JPS56151165A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS56151165A JPS56151165A JP5298180A JP5298180A JPS56151165A JP S56151165 A JPS56151165 A JP S56151165A JP 5298180 A JP5298180 A JP 5298180A JP 5298180 A JP5298180 A JP 5298180A JP S56151165 A JPS56151165 A JP S56151165A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit substrate
- melting
- wiring conductors
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: To improve working efficiency by melting the solder paste between a circuit substrate on which wiring conductors are placed and molded solder by heating the same through the substrate thereby uniformly melting the molded solder by heating.
CONSTITUTION: When a circuit substrate 1 is heated from its under part, the solder paste 5 among wiring conductors 4aW4d and the circuit substrate 1 and molded solder 3 melts first. The molte solder paste 5 transfers heat uniformly over the entire part of the molded solder 3 from a wide contact area, thereby soldering the wiring conductors 4aW4d to the circuit substrate 1 without causing partially imperfect melting.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5298180A JPS56151165A (en) | 1980-04-23 | 1980-04-23 | Soldering method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5298180A JPS56151165A (en) | 1980-04-23 | 1980-04-23 | Soldering method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56151165A true JPS56151165A (en) | 1981-11-24 |
Family
ID=12930076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5298180A Pending JPS56151165A (en) | 1980-04-23 | 1980-04-23 | Soldering method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56151165A (en) |
-
1980
- 1980-04-23 JP JP5298180A patent/JPS56151165A/en active Pending
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