JPS56151165A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS56151165A
JPS56151165A JP5298180A JP5298180A JPS56151165A JP S56151165 A JPS56151165 A JP S56151165A JP 5298180 A JP5298180 A JP 5298180A JP 5298180 A JP5298180 A JP 5298180A JP S56151165 A JPS56151165 A JP S56151165A
Authority
JP
Japan
Prior art keywords
solder
circuit substrate
melting
wiring conductors
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5298180A
Other languages
Japanese (ja)
Inventor
Takanari Murakami
Hiroshi Ii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5298180A priority Critical patent/JPS56151165A/en
Publication of JPS56151165A publication Critical patent/JPS56151165A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To improve working efficiency by melting the solder paste between a circuit substrate on which wiring conductors are placed and molded solder by heating the same through the substrate thereby uniformly melting the molded solder by heating.
CONSTITUTION: When a circuit substrate 1 is heated from its under part, the solder paste 5 among wiring conductors 4aW4d and the circuit substrate 1 and molded solder 3 melts first. The molte solder paste 5 transfers heat uniformly over the entire part of the molded solder 3 from a wide contact area, thereby soldering the wiring conductors 4aW4d to the circuit substrate 1 without causing partially imperfect melting.
COPYRIGHT: (C)1981,JPO&Japio
JP5298180A 1980-04-23 1980-04-23 Soldering method Pending JPS56151165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5298180A JPS56151165A (en) 1980-04-23 1980-04-23 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5298180A JPS56151165A (en) 1980-04-23 1980-04-23 Soldering method

Publications (1)

Publication Number Publication Date
JPS56151165A true JPS56151165A (en) 1981-11-24

Family

ID=12930076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5298180A Pending JPS56151165A (en) 1980-04-23 1980-04-23 Soldering method

Country Status (1)

Country Link
JP (1) JPS56151165A (en)

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