JPS6157837A - 外観検査装置 - Google Patents

外観検査装置

Info

Publication number
JPS6157837A
JPS6157837A JP18102584A JP18102584A JPS6157837A JP S6157837 A JPS6157837 A JP S6157837A JP 18102584 A JP18102584 A JP 18102584A JP 18102584 A JP18102584 A JP 18102584A JP S6157837 A JPS6157837 A JP S6157837A
Authority
JP
Japan
Prior art keywords
illumination
defect
pellet
image
defects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18102584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0554622B2 (enExample
Inventor
Yukihiro Goto
幸博 後藤
Nobushi Suzuki
鈴木　悦四
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP18102584A priority Critical patent/JPS6157837A/ja
Publication of JPS6157837A publication Critical patent/JPS6157837A/ja
Publication of JPH0554622B2 publication Critical patent/JPH0554622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP18102584A 1984-08-30 1984-08-30 外観検査装置 Granted JPS6157837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18102584A JPS6157837A (ja) 1984-08-30 1984-08-30 外観検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18102584A JPS6157837A (ja) 1984-08-30 1984-08-30 外観検査装置

Publications (2)

Publication Number Publication Date
JPS6157837A true JPS6157837A (ja) 1986-03-24
JPH0554622B2 JPH0554622B2 (enExample) 1993-08-13

Family

ID=16093445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18102584A Granted JPS6157837A (ja) 1984-08-30 1984-08-30 外観検査装置

Country Status (1)

Country Link
JP (1) JPS6157837A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128730U (enExample) * 1987-02-16 1988-08-23
JPH0293312A (ja) * 1988-09-29 1990-04-04 Dainippon Printing Co Ltd 欠陥検査装置
JPH04297886A (ja) * 1991-03-05 1992-10-21 Mitsubishi Electric Corp レーザ測距装置
US5686994A (en) * 1993-06-25 1997-11-11 Matsushita Electric Industrial Co., Ltd. Appearance inspection apparatus and appearance inspection method of electronic components
JP2009016437A (ja) * 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハの欠陥位置検出方法
CN104458763A (zh) * 2014-12-12 2015-03-25 元亮科技有限公司 广视野表面缺陷检测装置
CN110208286A (zh) * 2019-06-21 2019-09-06 上海精测半导体技术有限公司 一种检测设备
JP2020013841A (ja) * 2018-07-17 2020-01-23 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128730U (enExample) * 1987-02-16 1988-08-23
JPH0293312A (ja) * 1988-09-29 1990-04-04 Dainippon Printing Co Ltd 欠陥検査装置
JPH04297886A (ja) * 1991-03-05 1992-10-21 Mitsubishi Electric Corp レーザ測距装置
US5686994A (en) * 1993-06-25 1997-11-11 Matsushita Electric Industrial Co., Ltd. Appearance inspection apparatus and appearance inspection method of electronic components
JP2009016437A (ja) * 2007-07-02 2009-01-22 Nitto Denko Corp 半導体ウエハの欠陥位置検出方法
CN104458763A (zh) * 2014-12-12 2015-03-25 元亮科技有限公司 广视野表面缺陷检测装置
JP2020013841A (ja) * 2018-07-17 2020-01-23 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN110208286A (zh) * 2019-06-21 2019-09-06 上海精测半导体技术有限公司 一种检测设备

Also Published As

Publication number Publication date
JPH0554622B2 (enExample) 1993-08-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees