JPS6153851B2 - - Google Patents

Info

Publication number
JPS6153851B2
JPS6153851B2 JP54013354A JP1335479A JPS6153851B2 JP S6153851 B2 JPS6153851 B2 JP S6153851B2 JP 54013354 A JP54013354 A JP 54013354A JP 1335479 A JP1335479 A JP 1335479A JP S6153851 B2 JPS6153851 B2 JP S6153851B2
Authority
JP
Japan
Prior art keywords
film
bonding
frame
semiconductor
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54013354A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55107238A (en
Inventor
Hiroshi Kato
Masamichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1335479A priority Critical patent/JPS55107238A/ja
Publication of JPS55107238A publication Critical patent/JPS55107238A/ja
Publication of JPS6153851B2 publication Critical patent/JPS6153851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1335479A 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same Granted JPS55107238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1335479A JPS55107238A (en) 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1335479A JPS55107238A (en) 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPS55107238A JPS55107238A (en) 1980-08-16
JPS6153851B2 true JPS6153851B2 (enExample) 1986-11-19

Family

ID=11830759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1335479A Granted JPS55107238A (en) 1979-02-09 1979-02-09 Semiconductor device and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JPS55107238A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768040A (en) * 1980-10-15 1982-04-26 Hitachi Ltd Electrode structure for semiconductor device
JPS57210637A (en) * 1981-06-18 1982-12-24 Mitsubishi Electric Corp Semiconductor device
JPS59193036A (ja) * 1983-04-16 1984-11-01 Toshiba Corp 半導体装置の製造方法
US5288456A (en) * 1993-02-23 1994-02-22 International Business Machines Corporation Compound with room temperature electrical resistivity comparable to that of elemental copper
JP2007109829A (ja) * 2005-10-12 2007-04-26 Dowa Holdings Co Ltd 半田接合形成方法
US9214442B2 (en) * 2007-03-19 2015-12-15 Infineon Technologies Ag Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
JP6046010B2 (ja) * 2013-09-09 2016-12-14 株式会社東芝 半導体装置及びその製造方法
JP6477517B2 (ja) * 2016-01-20 2019-03-06 トヨタ自動車株式会社 半導体装置の製造方法
JP6507120B2 (ja) * 2016-03-31 2019-04-24 Ｊｘ金属株式会社 基材との接合面が表面処理された半導体、および銅粉ペーストによる接合方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS527675A (en) * 1975-07-09 1977-01-20 Hitachi Ltd Semiconductor device
JPS5353256A (en) * 1976-10-25 1978-05-15 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JPS55107238A (en) 1980-08-16

Similar Documents

Publication Publication Date Title
EP0253691B1 (en) Silicon die bonding process
US4872047A (en) Semiconductor die attach system
JP3489811B2 (ja) 半導体デバイスの製造方法
US6346469B1 (en) Semiconductor device and a process for forming the semiconductor device
US4661375A (en) Method for increasing the height of solder bumps
JPS6187396A (ja) 電子回路装置とその製造方法
TW200829361A (en) Connecting material, method for manufacturing connecting material, and semiconductor device
JP2003338517A (ja) 基板上に無鉛はんだ合金を形成する方法
US5105258A (en) Metal system for semiconductor die attach
US4978052A (en) Semiconductor die attach system
JPS6153851B2 (enExample)
EP0335744B1 (en) Semiconducting device mounting
JP2000100869A (ja) 半導体装置およびその製造方法
US6742248B2 (en) Method of forming a soldered electrical connection
JP2000150574A (ja) 半導体装置及び半田による接合方法
JP2697116B2 (ja) インジウム半田の接合構造
JPH0146228B2 (enExample)
CA1244147A (en) Die bonding process
JP2813409B2 (ja) 半導体チップの接続方法
JPH0483366A (ja) 半導体集積回路装置およびその製造方法
KR102065765B1 (ko) 솔더범프를 이용한 반도체칩의 단자 접합방법
JPS6286895A (ja) 電子部品のはんだ付け方法
JPS5868945A (ja) フリツプチツプボンデイング法
JPS60143636A (ja) 電子部品
JPH0140514B2 (enExample)