JPS6152998B2 - - Google Patents
Info
- Publication number
- JPS6152998B2 JPS6152998B2 JP54039073A JP3907379A JPS6152998B2 JP S6152998 B2 JPS6152998 B2 JP S6152998B2 JP 54039073 A JP54039073 A JP 54039073A JP 3907379 A JP3907379 A JP 3907379A JP S6152998 B2 JPS6152998 B2 JP S6152998B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- base
- laser device
- cavity
- optical window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 35
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000000428 dust Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3907379A JPS55132088A (en) | 1979-03-30 | 1979-03-30 | Semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3907379A JPS55132088A (en) | 1979-03-30 | 1979-03-30 | Semiconductor laser device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55132088A JPS55132088A (en) | 1980-10-14 |
JPS6152998B2 true JPS6152998B2 (enrdf_load_stackoverflow) | 1986-11-15 |
Family
ID=12542936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3907379A Granted JPS55132088A (en) | 1979-03-30 | 1979-03-30 | Semiconductor laser device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55132088A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60123037A (ja) * | 1983-12-08 | 1985-07-01 | Toshiba Corp | ダイ・ボンディング装置 |
JP4617636B2 (ja) * | 2003-03-19 | 2011-01-26 | 住友電気工業株式会社 | 光モジュール |
CN109586165B (zh) * | 2019-01-25 | 2020-04-07 | 维沃移动通信有限公司 | 一种激光模组及电子设备 |
CN117242394A (zh) * | 2021-05-11 | 2023-12-15 | 三菱电机株式会社 | 光半导体装置 |
-
1979
- 1979-03-30 JP JP3907379A patent/JPS55132088A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS55132088A (en) | 1980-10-14 |
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