JPS55132088A - Semiconductor laser device - Google Patents
Semiconductor laser deviceInfo
- Publication number
- JPS55132088A JPS55132088A JP3907379A JP3907379A JPS55132088A JP S55132088 A JPS55132088 A JP S55132088A JP 3907379 A JP3907379 A JP 3907379A JP 3907379 A JP3907379 A JP 3907379A JP S55132088 A JPS55132088 A JP S55132088A
- Authority
- JP
- Japan
- Prior art keywords
- insulating material
- heat insulating
- window
- dusts
- contamination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000011810 insulating material Substances 0.000 abstract 3
- 238000011109 contamination Methods 0.000 abstract 2
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 230000009545 invasion Effects 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000008188 pellet Substances 0.000 abstract 1
- 238000005201 scrubbing Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3907379A JPS55132088A (en) | 1979-03-30 | 1979-03-30 | Semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3907379A JPS55132088A (en) | 1979-03-30 | 1979-03-30 | Semiconductor laser device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55132088A true JPS55132088A (en) | 1980-10-14 |
JPS6152998B2 JPS6152998B2 (enrdf_load_stackoverflow) | 1986-11-15 |
Family
ID=12542936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3907379A Granted JPS55132088A (en) | 1979-03-30 | 1979-03-30 | Semiconductor laser device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55132088A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60123037A (ja) * | 1983-12-08 | 1985-07-01 | Toshiba Corp | ダイ・ボンディング装置 |
JP2004288742A (ja) * | 2003-03-19 | 2004-10-14 | Sumitomo Electric Ind Ltd | 光モジュール |
CN109586165A (zh) * | 2019-01-25 | 2019-04-05 | 维沃移动通信有限公司 | 一种激光模组及电子设备 |
JP7036286B1 (ja) * | 2021-05-11 | 2022-03-15 | 三菱電機株式会社 | 光半導体装置 |
-
1979
- 1979-03-30 JP JP3907379A patent/JPS55132088A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60123037A (ja) * | 1983-12-08 | 1985-07-01 | Toshiba Corp | ダイ・ボンディング装置 |
JP2004288742A (ja) * | 2003-03-19 | 2004-10-14 | Sumitomo Electric Ind Ltd | 光モジュール |
CN109586165A (zh) * | 2019-01-25 | 2019-04-05 | 维沃移动通信有限公司 | 一种激光模组及电子设备 |
US12015241B2 (en) | 2019-01-25 | 2024-06-18 | Vivo Mobile Communication Co., Ltd. | Laser module and electronic device |
JP7036286B1 (ja) * | 2021-05-11 | 2022-03-15 | 三菱電機株式会社 | 光半導体装置 |
WO2022239121A1 (ja) * | 2021-05-11 | 2022-11-17 | 三菱電機株式会社 | 光半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6152998B2 (enrdf_load_stackoverflow) | 1986-11-15 |
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