BR7607443A - Receptaculo plastico com componentes eletricos e metodo de fabricacao do mesmo - Google Patents

Receptaculo plastico com componentes eletricos e metodo de fabricacao do mesmo

Info

Publication number
BR7607443A
BR7607443A BR7607443A BR7607443A BR7607443A BR 7607443 A BR7607443 A BR 7607443A BR 7607443 A BR7607443 A BR 7607443A BR 7607443 A BR7607443 A BR 7607443A BR 7607443 A BR7607443 A BR 7607443A
Authority
BR
Brazil
Prior art keywords
manufacturing
same
electrical components
plastic receptacle
receptacle
Prior art date
Application number
BR7607443A
Other languages
English (en)
Inventor
H Nebel
K Paulus
Original Assignee
Int Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Standard Electric Corp filed Critical Int Standard Electric Corp
Publication of BR7607443A publication Critical patent/BR7607443A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
BR7607443A 1976-02-21 1976-11-05 Receptaculo plastico com componentes eletricos e metodo de fabricacao do mesmo BR7607443A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762607083 DE2607083A1 (de) 1976-02-21 1976-02-21 Kunststoffgehaeuse mit elektrischem bauelement

Publications (1)

Publication Number Publication Date
BR7607443A true BR7607443A (pt) 1977-09-20

Family

ID=5970524

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7607443A BR7607443A (pt) 1976-02-21 1976-11-05 Receptaculo plastico com componentes eletricos e metodo de fabricacao do mesmo

Country Status (2)

Country Link
BR (1) BR7607443A (pt)
DE (1) DE2607083A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2840972A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung einer kunststoffkapselung fuer halbleiterbauelemente auf metallischen systemtraegern
DE2844830C3 (de) * 1978-10-14 1981-07-09 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verfahren zur Herstellung eines Kondensators mit einem geschlossenen, aus zwei Halbschalen gebildeten Kunststoffgehäuse
US4305897A (en) * 1978-12-28 1981-12-15 Hitachi Chemical Company, Ltd. Packaging process for semiconductors
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
DE3208108A1 (de) * 1982-03-06 1983-09-08 Robert Bosch Gmbh, 7000 Stuttgart Elektrischer anschluss fuer elektrisches aggregat
DE3332293A1 (de) * 1983-09-07 1985-03-21 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Elektronisches oder elektrisches bauelement
DE3505883C1 (de) * 1985-02-20 1986-07-24 Westermann, Wolfgang, Dipl.-Ing., 6800 Mannheim Flachwickelkondensator mit metallisierten Kunststoffolien in Chipbauweise und Verfahren zu seiner Herstellung
US4764235A (en) * 1985-08-01 1988-08-16 Hitachi Chemical Company, Ltd. Process and apparatus for sealing semiconductor packages
US4843188A (en) * 1986-03-25 1989-06-27 Western Digital Corporation Integrated circuit chip mounting and packaging assembly
DE3703383A1 (de) * 1987-02-05 1988-08-18 Eldo Elektronik Service Gmbh Umkapselung eines elektronischen bauelements
DE4214121A1 (de) * 1992-04-29 1993-11-04 Siemens Matsushita Components Elektrischer wickelkondensator
DE19854594A1 (de) * 1998-11-26 2000-05-31 Mannesmann Vdo Ag Drosselklappenstutzen

Also Published As

Publication number Publication date
DE2607083A1 (de) 1977-09-01

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