JPS6148544A - 軟化温度の低い高導電用銅合金 - Google Patents

軟化温度の低い高導電用銅合金

Info

Publication number
JPS6148544A
JPS6148544A JP16994884A JP16994884A JPS6148544A JP S6148544 A JPS6148544 A JP S6148544A JP 16994884 A JP16994884 A JP 16994884A JP 16994884 A JP16994884 A JP 16994884A JP S6148544 A JPS6148544 A JP S6148544A
Authority
JP
Japan
Prior art keywords
ppm
copper
softening temperature
copper alloy
low softening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16994884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6247936B2 (enrdf_load_stackoverflow
Inventor
Hisashi Suzuki
寿 鈴木
Mikihiro Sugano
菅野　幹宏
Takao Maeda
貴雄 前田
Toshiyuki Osako
敏行 大迫
Shinsuke Yamazaki
信介 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP16994884A priority Critical patent/JPS6148544A/ja
Publication of JPS6148544A publication Critical patent/JPS6148544A/ja
Publication of JPS6247936B2 publication Critical patent/JPS6247936B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Conductive Materials (AREA)
JP16994884A 1984-08-16 1984-08-16 軟化温度の低い高導電用銅合金 Granted JPS6148544A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16994884A JPS6148544A (ja) 1984-08-16 1984-08-16 軟化温度の低い高導電用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16994884A JPS6148544A (ja) 1984-08-16 1984-08-16 軟化温度の低い高導電用銅合金

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP10132387A Division JPS6345339A (ja) 1987-04-24 1987-04-24 軟化温度の低い高導電用銅合金

Publications (2)

Publication Number Publication Date
JPS6148544A true JPS6148544A (ja) 1986-03-10
JPS6247936B2 JPS6247936B2 (enrdf_load_stackoverflow) 1987-10-12

Family

ID=15895839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16994884A Granted JPS6148544A (ja) 1984-08-16 1984-08-16 軟化温度の低い高導電用銅合金

Country Status (1)

Country Link
JP (1) JPS6148544A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918724A (ja) * 1982-07-23 1984-01-31 Nitto Electric Ind Co Ltd 熱硬化性樹脂組成物
JPH01283333A (ja) * 1987-12-25 1989-11-14 Hiroshi Sasaki 高導電性金属材料
US5364923A (en) * 1992-09-30 1994-11-15 Dow Corning Toray Silicone Co., Ltd. Organopolysiloxane graft epoxy resins and a method for the preparation thereof
US6709753B2 (en) 2001-02-23 2004-03-23 Shin-Etsu Chemical Co., Ltd. Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
JP2008182170A (ja) * 2006-12-28 2008-08-07 Hitachi Cable Ltd 太陽電池用はんだめっき線及びその製造方法並びに太陽電池
JP2008186626A (ja) * 2007-01-26 2008-08-14 Matsushita Electric Works Ltd リモコンブレーカ
JP2013014838A (ja) * 2011-06-08 2013-01-24 Nippon Steel & Sumikin Chemical Co Ltd 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111455210A (zh) * 2020-04-17 2020-07-28 金川集团股份有限公司 一种超高导电率微合金化铜材料及其加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139662A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139662A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918724A (ja) * 1982-07-23 1984-01-31 Nitto Electric Ind Co Ltd 熱硬化性樹脂組成物
JPH01283333A (ja) * 1987-12-25 1989-11-14 Hiroshi Sasaki 高導電性金属材料
US5364923A (en) * 1992-09-30 1994-11-15 Dow Corning Toray Silicone Co., Ltd. Organopolysiloxane graft epoxy resins and a method for the preparation thereof
US6709753B2 (en) 2001-02-23 2004-03-23 Shin-Etsu Chemical Co., Ltd. Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
JP2008182170A (ja) * 2006-12-28 2008-08-07 Hitachi Cable Ltd 太陽電池用はんだめっき線及びその製造方法並びに太陽電池
JP2008186626A (ja) * 2007-01-26 2008-08-14 Matsushita Electric Works Ltd リモコンブレーカ
JP2013014838A (ja) * 2011-06-08 2013-01-24 Nippon Steel & Sumikin Chemical Co Ltd 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法

Also Published As

Publication number Publication date
JPS6247936B2 (enrdf_load_stackoverflow) 1987-10-12

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