JPS6148544A - 軟化温度の低い高導電用銅合金 - Google Patents
軟化温度の低い高導電用銅合金Info
- Publication number
- JPS6148544A JPS6148544A JP16994884A JP16994884A JPS6148544A JP S6148544 A JPS6148544 A JP S6148544A JP 16994884 A JP16994884 A JP 16994884A JP 16994884 A JP16994884 A JP 16994884A JP S6148544 A JPS6148544 A JP S6148544A
- Authority
- JP
- Japan
- Prior art keywords
- ppm
- copper
- softening temperature
- pure copper
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 8
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052706 scandium Inorganic materials 0.000 claims description 4
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000005266 casting Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 238000000137 annealing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16994884A JPS6148544A (ja) | 1984-08-16 | 1984-08-16 | 軟化温度の低い高導電用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16994884A JPS6148544A (ja) | 1984-08-16 | 1984-08-16 | 軟化温度の低い高導電用銅合金 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10132387A Division JPS6345339A (ja) | 1987-04-24 | 1987-04-24 | 軟化温度の低い高導電用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6148544A true JPS6148544A (ja) | 1986-03-10 |
| JPS6247936B2 JPS6247936B2 (enrdf_load_stackoverflow) | 1987-10-12 |
Family
ID=15895839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16994884A Granted JPS6148544A (ja) | 1984-08-16 | 1984-08-16 | 軟化温度の低い高導電用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6148544A (enrdf_load_stackoverflow) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918724A (ja) * | 1982-07-23 | 1984-01-31 | Nitto Electric Ind Co Ltd | 熱硬化性樹脂組成物 |
| JPH01283333A (ja) * | 1987-12-25 | 1989-11-14 | Hiroshi Sasaki | 高導電性金属材料 |
| US5364923A (en) * | 1992-09-30 | 1994-11-15 | Dow Corning Toray Silicone Co., Ltd. | Organopolysiloxane graft epoxy resins and a method for the preparation thereof |
| US6709753B2 (en) | 2001-02-23 | 2004-03-23 | Shin-Etsu Chemical Co., Ltd. | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith |
| JP2008182170A (ja) * | 2006-12-28 | 2008-08-07 | Hitachi Cable Ltd | 太陽電池用はんだめっき線及びその製造方法並びに太陽電池 |
| JP2008186626A (ja) * | 2007-01-26 | 2008-08-14 | Matsushita Electric Works Ltd | リモコンブレーカ |
| JP2013014838A (ja) * | 2011-06-08 | 2013-01-24 | Nippon Steel & Sumikin Chemical Co Ltd | 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111455210A (zh) * | 2020-04-17 | 2020-07-28 | 金川集团股份有限公司 | 一种超高导电率微合金化铜材料及其加工方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59139662A (ja) * | 1983-01-31 | 1984-08-10 | Mitsubishi Metal Corp | 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線 |
-
1984
- 1984-08-16 JP JP16994884A patent/JPS6148544A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59139662A (ja) * | 1983-01-31 | 1984-08-10 | Mitsubishi Metal Corp | 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918724A (ja) * | 1982-07-23 | 1984-01-31 | Nitto Electric Ind Co Ltd | 熱硬化性樹脂組成物 |
| JPH01283333A (ja) * | 1987-12-25 | 1989-11-14 | Hiroshi Sasaki | 高導電性金属材料 |
| US5364923A (en) * | 1992-09-30 | 1994-11-15 | Dow Corning Toray Silicone Co., Ltd. | Organopolysiloxane graft epoxy resins and a method for the preparation thereof |
| US6709753B2 (en) | 2001-02-23 | 2004-03-23 | Shin-Etsu Chemical Co., Ltd. | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith |
| JP2008182170A (ja) * | 2006-12-28 | 2008-08-07 | Hitachi Cable Ltd | 太陽電池用はんだめっき線及びその製造方法並びに太陽電池 |
| JP2008186626A (ja) * | 2007-01-26 | 2008-08-14 | Matsushita Electric Works Ltd | リモコンブレーカ |
| JP2013014838A (ja) * | 2011-06-08 | 2013-01-24 | Nippon Steel & Sumikin Chemical Co Ltd | 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6247936B2 (enrdf_load_stackoverflow) | 1987-10-12 |