JPH029660B2 - - Google Patents
Info
- Publication number
- JPH029660B2 JPH029660B2 JP3551583A JP3551583A JPH029660B2 JP H029660 B2 JPH029660 B2 JP H029660B2 JP 3551583 A JP3551583 A JP 3551583A JP 3551583 A JP3551583 A JP 3551583A JP H029660 B2 JPH029660 B2 JP H029660B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ppm
- softening temperature
- boron
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 15
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 12
- 229910052796 boron Inorganic materials 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 238000011282 treatment Methods 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- FZQBLSFKFKIKJI-UHFFFAOYSA-N boron copper Chemical compound [B].[Cu] FZQBLSFKFKIKJI-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3551583A JPS59159954A (ja) | 1983-03-03 | 1983-03-03 | 軟化温度の低い高導電用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3551583A JPS59159954A (ja) | 1983-03-03 | 1983-03-03 | 軟化温度の低い高導電用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159954A JPS59159954A (ja) | 1984-09-10 |
| JPH029660B2 true JPH029660B2 (enrdf_load_stackoverflow) | 1990-03-02 |
Family
ID=12443886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3551583A Granted JPS59159954A (ja) | 1983-03-03 | 1983-03-03 | 軟化温度の低い高導電用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159954A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5499330B2 (ja) * | 2010-10-20 | 2014-05-21 | 日立金属株式会社 | 太陽電池用バスバー |
-
1983
- 1983-03-03 JP JP3551583A patent/JPS59159954A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59159954A (ja) | 1984-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2842438A (en) | Copper-zirconium alloys | |
| CN110951990A (zh) | 一种Cu-Ni-Co-Fe-Si-Zr-Zn铜合金材料及其制备方法 | |
| GB2073250A (en) | Copper alloys with small amounts of manganese and selenium | |
| US3522039A (en) | Copper base alloy | |
| JP2009007625A (ja) | 電気・電子部品用高強度銅合金の製造方法 | |
| CN115896512A (zh) | 高精密蚀刻引线框架用铜合金材料的制备方法 | |
| US4059437A (en) | Oxygen-free copper product and process | |
| JPS6017040A (ja) | 軟化温度の低い高導電用銅合金 | |
| JPS6247936B2 (enrdf_load_stackoverflow) | ||
| JPS591653A (ja) | ラジエ−タ−フイン用銅合金 | |
| JPS6345336A (ja) | 電子電気機器用銅合金とその製造法 | |
| KR100302546B1 (ko) | 방전가공기 전극선용 동-아연-알루미늄, 스트론튬, 티타늄, 보론계 합금 및 그 제조방법 | |
| US3639119A (en) | Copper base alloy | |
| CN112725654B (zh) | 一种集成电路用高强高导高韧铜钛合金及其制备方法 | |
| JPH029660B2 (enrdf_load_stackoverflow) | ||
| US4430298A (en) | Copper alloys for electric and electronic devices and method for producing same | |
| US3522038A (en) | Copper base alloy | |
| JPS6345339A (ja) | 軟化温度の低い高導電用銅合金 | |
| JPS5952943B2 (ja) | 高耐熱性および高導電性を有するＣｕ合金 | |
| JPS6158535B2 (enrdf_load_stackoverflow) | ||
| JPH07113133B2 (ja) | 連続鋳造鋳型用Ｃｕ合金 | |
| JPH0253502B2 (enrdf_load_stackoverflow) | ||
| JP2991319B2 (ja) | 高強度・高導電性銅合金及び製造方法（２） | |
| US3671225A (en) | Copper base alloy | |
| US4139372A (en) | Copper-based alloy |