JPS6146088A - 導体配線を備えるセラミツク基板の製法 - Google Patents
導体配線を備えるセラミツク基板の製法Info
- Publication number
- JPS6146088A JPS6146088A JP60157624A JP15762485A JPS6146088A JP S6146088 A JPS6146088 A JP S6146088A JP 60157624 A JP60157624 A JP 60157624A JP 15762485 A JP15762485 A JP 15762485A JP S6146088 A JPS6146088 A JP S6146088A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- ceramic
- oxide
- sheet
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 title claims description 11
- 239000000203 mixture Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052810 boron oxide Inorganic materials 0.000 claims description 4
- 229910000272 alkali metal oxide Inorganic materials 0.000 claims description 3
- 229910021472 group 8 element Inorganic materials 0.000 claims 1
- 239000011230 binding agent Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000005245 sintering Methods 0.000 description 11
- 239000002002 slurry Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 241000209529 Arum maculatum Species 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910002710 Au-Pd Inorganic materials 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- WPKYZIPODULRBM-UHFFFAOYSA-N azane;prop-2-enoic acid Chemical compound N.OC(=O)C=C WPKYZIPODULRBM-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052955 covellite Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60157624A JPS6146088A (ja) | 1985-07-17 | 1985-07-17 | 導体配線を備えるセラミツク基板の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60157624A JPS6146088A (ja) | 1985-07-17 | 1985-07-17 | 導体配線を備えるセラミツク基板の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6146088A true JPS6146088A (ja) | 1986-03-06 |
| JPH0431196B2 JPH0431196B2 (enExample) | 1992-05-25 |
Family
ID=15653795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60157624A Granted JPS6146088A (ja) | 1985-07-17 | 1985-07-17 | 導体配線を備えるセラミツク基板の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6146088A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62198509U (enExample) * | 1986-06-04 | 1987-12-17 |
-
1985
- 1985-07-17 JP JP60157624A patent/JPS6146088A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62198509U (enExample) * | 1986-06-04 | 1987-12-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0431196B2 (enExample) | 1992-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS599992A (ja) | 多層配線基板の製造方法 | |
| JPS6112016A (ja) | 強度を増加した端子を有する卑金属電極積層コンデンサの製造方法 | |
| JP2001028476A (ja) | 歪みのない回路を形成する方法 | |
| JP2002016361A (ja) | ガラスセラミック回路基板の製造方法 | |
| JPH08274433A (ja) | 銀系導電性ペースト及びそれを用いた多層セラミック回路基板 | |
| JP6897704B2 (ja) | 黒色マーク組成物およびこれを用いた電子部品 | |
| JPS6146088A (ja) | 導体配線を備えるセラミツク基板の製法 | |
| EP1265464A2 (en) | Electronic component and method of manufacturing the same | |
| KR100744855B1 (ko) | 높은 열적 사이클 전도체 시스템 | |
| JPS6146096A (ja) | セラミツク基板の製造方法 | |
| JPH11284296A (ja) | 配線基板 | |
| JPS61274399A (ja) | 多層セラミック基板用組成物および多層セラミック基板の製造方法 | |
| JPS59162169A (ja) | セラミック多層配線板 | |
| JPH11186727A (ja) | 配線基板およびその製造方法 | |
| JPH0686327B2 (ja) | セラミツク基板用組成物 | |
| JP5004548B2 (ja) | 低温焼成磁器およびその製造方法、ならびにそれを用いた配線基板 | |
| JP4748799B2 (ja) | 高周波用低温焼成磁器組成物及びその製造方法 | |
| JPH11157945A (ja) | セラミック電子部品の製造方法及びそれに用いるダミー用グリーンシート | |
| JPH1125754A (ja) | 銅メタライズ組成物及びガラスセラミック基板の製造方法 | |
| JPH07277791A (ja) | 絶縁基板用セラミック組成物およびセラミック多層配線回路板 | |
| JPS63182887A (ja) | セラミツク配線回路板の製法 | |
| JP2001233677A (ja) | ガラスセラミック基板の製造方法 | |
| JP3878803B2 (ja) | ガラスセラミック基板の製造方法 | |
| JP3652184B2 (ja) | 導体ペースト、ガラスセラミック配線基板並びにその製法 | |
| JP2695602B2 (ja) | ガラスセラミックス多層基板 |