JPS6145377B2 - - Google Patents

Info

Publication number
JPS6145377B2
JPS6145377B2 JP55119963A JP11996380A JPS6145377B2 JP S6145377 B2 JPS6145377 B2 JP S6145377B2 JP 55119963 A JP55119963 A JP 55119963A JP 11996380 A JP11996380 A JP 11996380A JP S6145377 B2 JPS6145377 B2 JP S6145377B2
Authority
JP
Japan
Prior art keywords
wafer
jig
apiezon wax
phenyl salicylate
apiezon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55119963A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5743427A (en
Inventor
Mitsuo Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55119963A priority Critical patent/JPS5743427A/ja
Publication of JPS5743427A publication Critical patent/JPS5743427A/ja
Publication of JPS6145377B2 publication Critical patent/JPS6145377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P52/00—

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP55119963A 1980-08-28 1980-08-28 Manufacture of semiconductor device Granted JPS5743427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55119963A JPS5743427A (en) 1980-08-28 1980-08-28 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55119963A JPS5743427A (en) 1980-08-28 1980-08-28 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5743427A JPS5743427A (en) 1982-03-11
JPS6145377B2 true JPS6145377B2 (OSRAM) 1986-10-07

Family

ID=14774527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55119963A Granted JPS5743427A (en) 1980-08-28 1980-08-28 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5743427A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0178030U (OSRAM) * 1987-11-11 1989-05-25
JPH0653514U (ja) * 1992-12-22 1994-07-22 株式会社アマダ 製品等収納装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003060032A1 (fr) * 2002-01-10 2003-07-24 Api Corporation Composition adhesive sensible a la pression et a la chaleur

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0178030U (OSRAM) * 1987-11-11 1989-05-25
JPH0653514U (ja) * 1992-12-22 1994-07-22 株式会社アマダ 製品等収納装置

Also Published As

Publication number Publication date
JPS5743427A (en) 1982-03-11

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