AU2003201913A1 - Heat-sensitive pressure-sensitive adhesive composition - Google Patents

Heat-sensitive pressure-sensitive adhesive composition

Info

Publication number
AU2003201913A1
AU2003201913A1 AU2003201913A AU2003201913A AU2003201913A1 AU 2003201913 A1 AU2003201913 A1 AU 2003201913A1 AU 2003201913 A AU2003201913 A AU 2003201913A AU 2003201913 A AU2003201913 A AU 2003201913A AU 2003201913 A1 AU2003201913 A1 AU 2003201913A1
Authority
AU
Australia
Prior art keywords
sensitive
heat
adhesive composition
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003201913A
Inventor
Kouji Kobayashi
Mamoru Suga
Tadafumi Tokushige
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
API Corp
Original Assignee
API Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by API Corp filed Critical API Corp
Publication of AU2003201913A1 publication Critical patent/AU2003201913A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU2003201913A 2002-01-10 2003-01-08 Heat-sensitive pressure-sensitive adhesive composition Abandoned AU2003201913A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002039323 2002-01-10
JP2002-39323 2002-01-10
JP2002116853 2002-03-14
JP2002-116853 2002-03-14
PCT/JP2003/000069 WO2003060032A1 (en) 2002-01-10 2003-01-08 Heat-sensitive pressure-sensitive adhesive composition

Publications (1)

Publication Number Publication Date
AU2003201913A1 true AU2003201913A1 (en) 2003-07-30

Family

ID=26625689

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003201913A Abandoned AU2003201913A1 (en) 2002-01-10 2003-01-08 Heat-sensitive pressure-sensitive adhesive composition

Country Status (3)

Country Link
JP (1) JP4218526B2 (en)
AU (1) AU2003201913A1 (en)
WO (1) WO2003060032A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5735376B2 (en) * 2011-08-11 2015-06-17 リンテック株式会社 Removable adhesive sheet
CN107148459B (en) * 2014-08-21 2019-06-21 陶氏环球技术有限责任公司 Hot-melt adhesive composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5743427A (en) * 1980-08-28 1982-03-11 Mitsubishi Electric Corp Manufacture of semiconductor device
JPH07247468A (en) * 1994-03-09 1995-09-26 Daicel Chem Ind Ltd Hot-melt adhesive composition
DE19810268A1 (en) * 1998-03-10 1999-09-16 Basf Ag Polymer dispersions or polymer solutions containing stabilizers and polymer preparations obtainable therefrom
JP4447136B2 (en) * 1999-09-14 2010-04-07 株式会社リコー Thermally active adhesive, thermally active adhesive sheet, and thermally active double-sided adhesive paper
JP2001098162A (en) * 1999-09-30 2001-04-10 Daicel Chem Ind Ltd Thermoplastic resin composition, heat-sensitive adhesive sheet and method for producing heat-sensitive adhesive sheet

Also Published As

Publication number Publication date
WO2003060032A1 (en) 2003-07-24
JPWO2003060032A1 (en) 2005-05-19
JP4218526B2 (en) 2009-02-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase