JPS6144834U - 時計用回路基板の実装構造 - Google Patents
時計用回路基板の実装構造Info
- Publication number
- JPS6144834U JPS6144834U JP1984128356U JP12835684U JPS6144834U JP S6144834 U JPS6144834 U JP S6144834U JP 1984128356 U JP1984128356 U JP 1984128356U JP 12835684 U JP12835684 U JP 12835684U JP S6144834 U JPS6144834 U JP S6144834U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- mounting structure
- watches
- watch
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
図面は本考案の一実施例を示す断面図である。
１・・・・・・回路基板、２・・・・・・配線パタ〒ン
、３・・曲銅めつき、４・・・・・・高純度パラジウム
めっき、５・・・・・・部分金めつき、６・・・・・・
ＩＣ， ７・・・・・・ボンディングワイヤ、８・・・
・・・エポキシ樹脂封止。
、３・・曲銅めつき、４・・・・・・高純度パラジウム
めっき、５・・・・・・部分金めつき、６・・・・・・
ＩＣ， ７・・・・・・ボンディングワイヤ、８・・・
・・・エポキシ樹脂封止。
Claims (1)
- 時計用回路基板の実装構造において、回路基板へのＩＣ
の実装に係る部分の最上層には金めつきがなされ、その
他の部分はパラジウムめっきを最上層とする回路基板上
にＩＣをグイボンデイングし、ワイヤボンデイングにて
回路接続を行ない、ＩＣ封止を行なったことを特徴とす
る時計用回路基板の実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128356U JPS6144834U (ja) | 1984-08-24 | 1984-08-24 | 時計用回路基板の実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128356U JPS6144834U (ja) | 1984-08-24 | 1984-08-24 | 時計用回路基板の実装構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6144834U true JPS6144834U (ja) | 1986-03-25 |
Family
ID=30686986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984128356U Pending JPS6144834U (ja) | 1984-08-24 | 1984-08-24 | 時計用回路基板の実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144834U (ja) |
-
1984
- 1984-08-24 JP JP1984128356U patent/JPS6144834U/ja active Pending
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