JPS6142864B2 - - Google Patents
Info
- Publication number
- JPS6142864B2 JPS6142864B2 JP54073182A JP7318279A JPS6142864B2 JP S6142864 B2 JPS6142864 B2 JP S6142864B2 JP 54073182 A JP54073182 A JP 54073182A JP 7318279 A JP7318279 A JP 7318279A JP S6142864 B2 JPS6142864 B2 JP S6142864B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- chip carrier
- semiconductor element
- hole
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/73—
-
- H10W90/754—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7318279A JPS55165658A (en) | 1979-06-11 | 1979-06-11 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7318279A JPS55165658A (en) | 1979-06-11 | 1979-06-11 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55165658A JPS55165658A (en) | 1980-12-24 |
| JPS6142864B2 true JPS6142864B2 (index.php) | 1986-09-24 |
Family
ID=13510733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7318279A Granted JPS55165658A (en) | 1979-06-11 | 1979-06-11 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55165658A (index.php) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2604827B1 (fr) * | 1986-10-06 | 1989-12-29 | Alsthom | Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance |
| GB2380057A (en) * | 2001-09-19 | 2003-03-26 | Thermosonic Technology Inc | Heat dissipation structure with cavity for improved heat transfer |
| KR100461721B1 (ko) * | 2002-05-27 | 2004-12-14 | 삼성전기주식회사 | 리드 방열 세라믹 패키지 |
| US20060090881A1 (en) * | 2004-10-29 | 2006-05-04 | 3M Innovative Properties Company | Immersion cooling apparatus |
| US7755186B2 (en) * | 2007-12-31 | 2010-07-13 | Intel Corporation | Cooling solutions for die-down integrated circuit packages |
| JP5880318B2 (ja) * | 2012-07-04 | 2016-03-09 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135579A (en) * | 1977-05-02 | 1978-11-27 | Hitachi Ltd | Liquid sealing semiconductor device |
-
1979
- 1979-06-11 JP JP7318279A patent/JPS55165658A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55165658A (en) | 1980-12-24 |
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