JPS6142859B2 - - Google Patents
Info
- Publication number
- JPS6142859B2 JPS6142859B2 JP53152526A JP15252678A JPS6142859B2 JP S6142859 B2 JPS6142859 B2 JP S6142859B2 JP 53152526 A JP53152526 A JP 53152526A JP 15252678 A JP15252678 A JP 15252678A JP S6142859 B2 JPS6142859 B2 JP S6142859B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- crimping
- crimping tool
- gigantic
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002788 crimping Methods 0.000 claims description 27
- 239000012530 fluid Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5578537A JPS5578537A (en) | 1980-06-13 |
JPS6142859B2 true JPS6142859B2 (xx) | 1986-09-24 |
Family
ID=15542354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15252678A Granted JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5578537A (xx) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01233795A (ja) * | 1988-03-15 | 1989-09-19 | Mitsubishi Electric Corp | 混成集績回路 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831546A (ja) * | 1981-08-18 | 1983-02-24 | Nec Corp | 半導体装置の製造方法 |
JPH05211208A (ja) * | 1992-01-23 | 1993-08-20 | Nec Corp | ボンディング装置 |
JP2001230528A (ja) * | 2000-02-15 | 2001-08-24 | Sony Corp | 実装装置及び実装方法 |
-
1978
- 1978-12-08 JP JP15252678A patent/JPS5578537A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01233795A (ja) * | 1988-03-15 | 1989-09-19 | Mitsubishi Electric Corp | 混成集績回路 |
Also Published As
Publication number | Publication date |
---|---|
JPS5578537A (en) | 1980-06-13 |
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