JPS5578537A - Gang bonding pressure welding tool - Google Patents
Gang bonding pressure welding toolInfo
- Publication number
- JPS5578537A JPS5578537A JP15252678A JP15252678A JPS5578537A JP S5578537 A JPS5578537 A JP S5578537A JP 15252678 A JP15252678 A JP 15252678A JP 15252678 A JP15252678 A JP 15252678A JP S5578537 A JPS5578537 A JP S5578537A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- pressurizing unit
- gas
- unevenness
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To apply uniform pressure to each lead in accordance with an unevenness of the position, terminals are to be pressurized thereat by transmitting pressure to an pressurizing unit composed of elastic body through gas or fluid having pressure which is contained in a support.
CONSTITUTION: An elastic pressurizing unit 2 is mounted inside the bottom of a cavity 3 of a rigid body 1. The cavity 3 contains a heated gas or liquid 4, and pressure is transmitted to the pressurizing unit 2 therethrough. According to this constitution, the pressure is allowed to work through gas or liquid 4, therefore leads can be pressurized uniformly, and a necessary heat can be supplied uniformly through gas or liquid 4 at the same time. Further, an unevenness of leads 6 according to that of pattern 7 and an unevenness of a substrate 8 are absorbed by an elastic film of the pressurizing unit 2 to a pressurization of the leads 6.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15252678A JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5578537A true JPS5578537A (en) | 1980-06-13 |
JPS6142859B2 JPS6142859B2 (en) | 1986-09-24 |
Family
ID=15542354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15252678A Granted JPS5578537A (en) | 1978-12-08 | 1978-12-08 | Gang bonding pressure welding tool |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5578537A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831546A (en) * | 1981-08-18 | 1983-02-24 | Nec Corp | Manufacture of semiconductor device |
JPH05211208A (en) * | 1992-01-23 | 1993-08-20 | Nec Corp | Bonding device |
JP2001230528A (en) * | 2000-02-15 | 2001-08-24 | Sony Corp | Mounting device and mounting method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01233795A (en) * | 1988-03-15 | 1989-09-19 | Mitsubishi Electric Corp | Hybrid integrated circuit |
-
1978
- 1978-12-08 JP JP15252678A patent/JPS5578537A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5831546A (en) * | 1981-08-18 | 1983-02-24 | Nec Corp | Manufacture of semiconductor device |
JPH05211208A (en) * | 1992-01-23 | 1993-08-20 | Nec Corp | Bonding device |
JP2001230528A (en) * | 2000-02-15 | 2001-08-24 | Sony Corp | Mounting device and mounting method |
Also Published As
Publication number | Publication date |
---|---|
JPS6142859B2 (en) | 1986-09-24 |
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