JPS6142616B2 - - Google Patents

Info

Publication number
JPS6142616B2
JPS6142616B2 JP54160027A JP16002779A JPS6142616B2 JP S6142616 B2 JPS6142616 B2 JP S6142616B2 JP 54160027 A JP54160027 A JP 54160027A JP 16002779 A JP16002779 A JP 16002779A JP S6142616 B2 JPS6142616 B2 JP S6142616B2
Authority
JP
Japan
Prior art keywords
mold
long material
molding
runnerless
side template
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54160027A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5682218A (en
Inventor
Masahiko Shiho
Yasunori Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16002779A priority Critical patent/JPS5682218A/ja
Publication of JPS5682218A publication Critical patent/JPS5682218A/ja
Publication of JPS6142616B2 publication Critical patent/JPS6142616B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14549—Coating rod-like, wire-like or belt-like articles
    • B29C45/14565—Coating rod-like, wire-like or belt-like articles at spaced locations, e.g. coaxial-cable wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP16002779A 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus Granted JPS5682218A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16002779A JPS5682218A (en) 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16002779A JPS5682218A (en) 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus

Publications (2)

Publication Number Publication Date
JPS5682218A JPS5682218A (en) 1981-07-04
JPS6142616B2 true JPS6142616B2 (enrdf_load_stackoverflow) 1986-09-22

Family

ID=15706370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16002779A Granted JPS5682218A (en) 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus

Country Status (1)

Country Link
JP (1) JPS5682218A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1183959B (it) * 1985-09-17 1987-10-22 Itw Fastex Italia Spa Procedimento ed apparecchiatura per la realizzazione di tiranti flessibili
JPS63164454A (ja) * 1986-12-26 1988-07-07 Idec Izumi Corp 小型電子部品の連結体
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
JP3137889B2 (ja) * 1995-11-27 2001-02-26 株式会社佐藤精機 成形品製造装置及び成形品製造方法
JP3711776B2 (ja) * 1999-02-09 2005-11-02 松下電器産業株式会社 固体電解コンデンサの製造方法およびその製造装置
JP4879723B2 (ja) * 2006-12-18 2012-02-22 大和ハウス工業株式会社 座屈拘束ブレース
JP5770059B2 (ja) * 2011-10-18 2015-08-26 ファナック株式会社 テープ搬送装置を備えた射出成形機

Also Published As

Publication number Publication date
JPS5682218A (en) 1981-07-04

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