JPS5682218A - Continuous automatic mold molding apparatus - Google Patents

Continuous automatic mold molding apparatus

Info

Publication number
JPS5682218A
JPS5682218A JP16002779A JP16002779A JPS5682218A JP S5682218 A JPS5682218 A JP S5682218A JP 16002779 A JP16002779 A JP 16002779A JP 16002779 A JP16002779 A JP 16002779A JP S5682218 A JPS5682218 A JP S5682218A
Authority
JP
Japan
Prior art keywords
long material
autoreel
templet
molding apparatus
mold molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16002779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142616B2 (enrdf_load_stackoverflow
Inventor
Masahiko Shiho
Yasunori Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16002779A priority Critical patent/JPS5682218A/ja
Publication of JPS5682218A publication Critical patent/JPS5682218A/ja
Publication of JPS6142616B2 publication Critical patent/JPS6142616B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14549—Coating rod-like, wire-like or belt-like articles
    • B29C45/14565—Coating rod-like, wire-like or belt-like articles at spaced locations, e.g. coaxial-cable wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP16002779A 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus Granted JPS5682218A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16002779A JPS5682218A (en) 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16002779A JPS5682218A (en) 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus

Publications (2)

Publication Number Publication Date
JPS5682218A true JPS5682218A (en) 1981-07-04
JPS6142616B2 JPS6142616B2 (enrdf_load_stackoverflow) 1986-09-22

Family

ID=15706370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16002779A Granted JPS5682218A (en) 1979-12-10 1979-12-10 Continuous automatic mold molding apparatus

Country Status (1)

Country Link
JP (1) JPS5682218A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164454A (ja) * 1986-12-26 1988-07-07 Idec Izumi Corp 小型電子部品の連結体
US4786454A (en) * 1985-09-17 1988-11-22 Illinois Tool Works Process for the production of flexible connectors
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
US5940954A (en) * 1995-11-27 1999-08-24 Kabushiki Kaisya Sato Seiki Apparatus for producing molded article and method therefor
EP1035555A3 (en) * 1999-02-09 2005-01-12 Matsushita Electric Industrial Co., Ltd. Method for manufacturing solid electrolytic capacitor and machine for manufacturing the same
JP2008150842A (ja) * 2006-12-18 2008-07-03 Daiwa House Ind Co Ltd 座屈拘束ブレース
JP2013086351A (ja) * 2011-10-18 2013-05-13 Fanuc Ltd テープ搬送装置を備えた射出成形機

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786454A (en) * 1985-09-17 1988-11-22 Illinois Tool Works Process for the production of flexible connectors
JPS63164454A (ja) * 1986-12-26 1988-07-07 Idec Izumi Corp 小型電子部品の連結体
US5336272A (en) * 1988-10-13 1994-08-09 Mitsubishi Denki Kabushiki Kaisha Method for molding a semiconductor package on a continuous leadframe
US5940954A (en) * 1995-11-27 1999-08-24 Kabushiki Kaisya Sato Seiki Apparatus for producing molded article and method therefor
EP1035555A3 (en) * 1999-02-09 2005-01-12 Matsushita Electric Industrial Co., Ltd. Method for manufacturing solid electrolytic capacitor and machine for manufacturing the same
JP2008150842A (ja) * 2006-12-18 2008-07-03 Daiwa House Ind Co Ltd 座屈拘束ブレース
JP2013086351A (ja) * 2011-10-18 2013-05-13 Fanuc Ltd テープ搬送装置を備えた射出成形機

Also Published As

Publication number Publication date
JPS6142616B2 (enrdf_load_stackoverflow) 1986-09-22

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