JPS614255A - 集積回路パツケ−ジ - Google Patents

集積回路パツケ−ジ

Info

Publication number
JPS614255A
JPS614255A JP12446084A JP12446084A JPS614255A JP S614255 A JPS614255 A JP S614255A JP 12446084 A JP12446084 A JP 12446084A JP 12446084 A JP12446084 A JP 12446084A JP S614255 A JPS614255 A JP S614255A
Authority
JP
Japan
Prior art keywords
chip
heat
heat sink
chip carriers
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12446084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0326543B2 (enrdf_load_stackoverflow
Inventor
Toshihiko Watari
渡里　俊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12446084A priority Critical patent/JPS614255A/ja
Publication of JPS614255A publication Critical patent/JPS614255A/ja
Publication of JPH0326543B2 publication Critical patent/JPH0326543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP12446084A 1984-06-19 1984-06-19 集積回路パツケ−ジ Granted JPS614255A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12446084A JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12446084A JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS614255A true JPS614255A (ja) 1986-01-10
JPH0326543B2 JPH0326543B2 (enrdf_load_stackoverflow) 1991-04-11

Family

ID=14886066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12446084A Granted JPS614255A (ja) 1984-06-19 1984-06-19 集積回路パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS614255A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02501178A (ja) * 1988-03-01 1990-04-19 ディジタル　イクイプメント　コーポレーション 集積回路チップをパッケージ化及び冷却する方法及び装置
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
USH1699H (en) * 1995-10-31 1997-12-02 The United States Of America As Represented By The Secretary Of The Navy Thermal bond system
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02501178A (ja) * 1988-03-01 1990-04-19 ディジタル　イクイプメント　コーポレーション 集積回路チップをパッケージ化及び冷却する方法及び装置
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
USH1699H (en) * 1995-10-31 1997-12-02 The United States Of America As Represented By The Secretary Of The Navy Thermal bond system
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof

Also Published As

Publication number Publication date
JPH0326543B2 (enrdf_load_stackoverflow) 1991-04-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees