JPS6142417B2 - - Google Patents

Info

Publication number
JPS6142417B2
JPS6142417B2 JP51122785A JP12278576A JPS6142417B2 JP S6142417 B2 JPS6142417 B2 JP S6142417B2 JP 51122785 A JP51122785 A JP 51122785A JP 12278576 A JP12278576 A JP 12278576A JP S6142417 B2 JPS6142417 B2 JP S6142417B2
Authority
JP
Japan
Prior art keywords
speed
ratio
bonding wire
movement
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51122785A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5348461A (en
Inventor
Juzo Taniguchi
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12278576A priority Critical patent/JPS5348461A/ja
Publication of JPS5348461A publication Critical patent/JPS5348461A/ja
Publication of JPS6142417B2 publication Critical patent/JPS6142417B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP12278576A 1976-10-15 1976-10-15 Wire bonder Granted JPS5348461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12278576A JPS5348461A (en) 1976-10-15 1976-10-15 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12278576A JPS5348461A (en) 1976-10-15 1976-10-15 Wire bonder

Publications (2)

Publication Number Publication Date
JPS5348461A JPS5348461A (en) 1978-05-01
JPS6142417B2 true JPS6142417B2 (enrdf_load_stackoverflow) 1986-09-20

Family

ID=14844542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12278576A Granted JPS5348461A (en) 1976-10-15 1976-10-15 Wire bonder

Country Status (1)

Country Link
JP (1) JPS5348461A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226936A (ja) * 1985-03-30 1986-10-08 Toshiba Corp ワイヤボンデイング方法および装置
JPS61235714A (ja) * 1985-04-11 1986-10-21 Nippon Kogaku Kk <Nikon> ワ−ク座標系による駆動装置
JPH07104142B2 (ja) * 1985-09-24 1995-11-13 株式会社ニコン ワ−ク座標系による駆動装置
JP3631030B2 (ja) 1998-01-23 2005-03-23 株式会社ハイニックスセミコンダクター ワイヤボンダ装備のｘ、ｙ、ｚ軸駆動装置及びその位置制御方法

Also Published As

Publication number Publication date
JPS5348461A (en) 1978-05-01

Similar Documents

Publication Publication Date Title
JP3329623B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
JPS6142417B2 (enrdf_load_stackoverflow)
JP2831626B2 (ja) 成形された線材接合部を造るための方法
JPS6243336B2 (enrdf_load_stackoverflow)
JPS5826524Y2 (ja) ハンドウタイワイヤボンダソウチ
JP2724343B2 (ja) 自動作画装置における筆記具昇降制御方法
JPH0574834A (ja) ワイヤボンダ
JP3783545B2 (ja) ロボット制御装置及びロボット制御方法
JPH0124931Y2 (enrdf_load_stackoverflow)
JPH0661294A (ja) ワイヤボンデイング装置のモータ制御回路
JPH0566731B2 (enrdf_load_stackoverflow)
JPS6329409B2 (enrdf_load_stackoverflow)
JPS61198639A (ja) ボンデイング装置
JP3026303B2 (ja) 半導体パッケージのワイヤボンディング方法及びそのワイヤボンディング装置
JPS593850B2 (ja) 半導体ワイヤ−ボンディング装置
KR100218379B1 (ko) 로보트팔 제어방법
JPS6252938A (ja) ワイヤボンディング装置
JPS63148648A (ja) 半導体集積回路ワイヤ−ボンデイング装置
JPS61194510A (ja) 移動テ−ブル制御装置
JPS6313344B2 (enrdf_load_stackoverflow)
JPS6417433A (en) Wire bonding method
JPH05143138A (ja) ワークピース上にツールを位置する時間を減少する方法
JPS62188231A (ja) ボンデイング装置
JPH0680699B2 (ja) ワイヤボンデイング装置
JPH0438136B2 (enrdf_load_stackoverflow)