JPS614188B2 - - Google Patents

Info

Publication number
JPS614188B2
JPS614188B2 JP55179047A JP17904780A JPS614188B2 JP S614188 B2 JPS614188 B2 JP S614188B2 JP 55179047 A JP55179047 A JP 55179047A JP 17904780 A JP17904780 A JP 17904780A JP S614188 B2 JPS614188 B2 JP S614188B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55179047A
Other versions
JPS56100440A (en
Inventor
Eru Koodo Jooji
Hawaado Sho Reimondo
Arubaato Hatsuchinson Maachin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of JPS56100440A publication Critical patent/JPS56100440A/ja
Publication of JPS614188B2 publication Critical patent/JPS614188B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Physical Vapour Deposition (AREA)
JP17904780A 1979-12-21 1980-12-19 Wafer feeding device Granted JPS56100440A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/106,342 US4311427A (en) 1979-12-21 1979-12-21 Wafer transfer system

Publications (2)

Publication Number Publication Date
JPS56100440A JPS56100440A (en) 1981-08-12
JPS614188B2 true JPS614188B2 (ja) 1986-02-07

Family

ID=22310897

Family Applications (2)

Application Number Title Priority Date Filing Date
JP17904780A Granted JPS56100440A (en) 1979-12-21 1980-12-19 Wafer feeding device
JP59174189A Granted JPS6063947A (ja) 1979-12-21 1984-08-23 ウエーハ垂直移動装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP59174189A Granted JPS6063947A (ja) 1979-12-21 1984-08-23 ウエーハ垂直移動装置

Country Status (8)

Country Link
US (1) US4311427A (ja)
JP (2) JPS56100440A (ja)
CH (1) CH652376A5 (ja)
DE (1) DE3047513A1 (ja)
FR (1) FR2473022B1 (ja)
GB (3) GB2066570B (ja)
IT (1) IT1134852B (ja)
NL (1) NL8006934A (ja)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3051199C3 (de) * 1979-12-21 1994-12-22 Varian Associates Zufördervorrichtung für eine Einrichtung zum Beschicken von Mikroplättchen in eine Behandlungskammer
US4311427A (en) 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
DE47132T1 (de) * 1980-09-02 1983-01-20 Heraeus Quarzschmelze Gmbh, 6450 Hanau Verfahren und geraet zum ueberfuehren von gegenstaenden zwischen traggliedern.
US4373846A (en) * 1980-10-24 1983-02-15 Charbonnet Carl D Panel transferring apparatus
US4421479A (en) * 1981-05-12 1983-12-20 Varian Associates, Inc. Process for treating a semiconductor material by blackbody radiation source with constant planar energy flux
US4486652A (en) * 1981-05-12 1984-12-04 Varian Associates, Inc. Blackbody radiation source with constant planar energy flux
US4417347A (en) * 1981-05-12 1983-11-22 Varian Associates, Inc. Semiconductor processor incorporating blackbody radiation source with constant planar energy flux
US4550239A (en) * 1981-10-05 1985-10-29 Tokyo Denshi Kagaku Kabushiki Kaisha Automatic plasma processing device and heat treatment device
US4457661A (en) * 1981-12-07 1984-07-03 Applied Materials, Inc. Wafer loading apparatus
DE3204436A1 (de) * 1982-02-09 1983-08-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur waermebehandlung von halbleiterscheiben
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
US4449885A (en) * 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
US4498833A (en) * 1982-05-24 1985-02-12 Varian Associates, Inc. Wafer orientation system
US4513430A (en) * 1982-05-24 1985-04-23 Varian Associates, Inc. Missing or broken wafer sensor
US4634331A (en) * 1982-05-24 1987-01-06 Varian Associates, Inc. Wafer transfer system
EP0100206A1 (en) * 1982-07-22 1984-02-08 Oerlikon-Buhrle U.S.A. Inc. Apparatus for treating an article in a vacuum chamber
US4490087A (en) * 1982-07-27 1984-12-25 Northern Telecom Limited Elevating jig for semi-conductor wafers and similar articles
FR2531938B1 (fr) * 1982-08-20 1986-02-21 Crismatec Ascenseur poussoir pour plaquettes minces rangees dans un conteneur collectif
JPS5950538A (ja) * 1982-09-17 1984-03-23 Hitachi Ltd ウエハ搬送装置
JPS59101846A (ja) * 1982-12-01 1984-06-12 Seiko Instr & Electronics Ltd 薄板物品のリニア搬送装置
US4573851A (en) * 1983-05-18 1986-03-04 Microglass, Inc. Semiconductor wafer transfer apparatus and method
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
JPS59220445A (ja) * 1983-05-20 1984-12-11 バリアン・アソシエイツ・インコ−ポレイテツド 基底を通る入路を有するカセツトトロリ−
US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
USRE33341E (en) * 1983-05-23 1990-09-18 ASQ Technology, Inc. Wafer transfer apparatus
US4567584A (en) * 1983-06-13 1986-01-28 Kabushiki Kaisha Toshiba Autochanger type disc player
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
US4662811A (en) * 1983-07-25 1987-05-05 Hayden Thomas J Method and apparatus for orienting semiconductor wafers
JPS6052574A (ja) * 1983-09-02 1985-03-25 Hitachi Ltd 連続スパツタ装置
US4602713A (en) * 1983-09-22 1986-07-29 Varian Associates, Inc. Multiple wafer holder for a wafer transfer system
US4558388A (en) * 1983-11-02 1985-12-10 Varian Associates, Inc. Substrate and substrate holder
US4523985A (en) * 1983-12-22 1985-06-18 Sputtered Films, Inc. Wafer processing machine
US4522697A (en) * 1983-12-22 1985-06-11 Sputtered Films, Inc. Wafer processing machine
US4534314A (en) * 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
US4548699A (en) * 1984-05-17 1985-10-22 Varian Associates, Inc. Transfer plate rotation system
US4592926A (en) * 1984-05-21 1986-06-03 Machine Technology, Inc. Processing apparatus and method
US4820930A (en) * 1984-06-20 1989-04-11 Canon Kabushiki Kaisha Photomask positioning device
US4747608A (en) * 1984-10-30 1988-05-31 Canon Kabushiki Kaisha Wafer chuck
US5280983A (en) * 1985-01-22 1994-01-25 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
EP0189279B1 (en) * 1985-01-22 1991-10-09 Applied Materials, Inc. Semiconductor processing system
GB8531723D0 (en) * 1985-12-24 1986-02-05 Vg Instr Group Wafer transfer apparatus
SE456570B (sv) * 1986-01-20 1988-10-17 Applied Vacuum Scandinavia Ab Sett att transportera alster vid en tillverknings- och/eller efterbehandlingsprocess
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US4779877A (en) * 1986-04-22 1988-10-25 Varian Associates, Inc. Wafer support assembly
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
JPS62274739A (ja) * 1986-05-16 1987-11-28 バリアン・アソシエイツ・インコ−ポレイテッド ウエファ方向づけ装置および方法
US4744713A (en) * 1986-05-21 1988-05-17 Texas Instruments Incorporated Misalignment sensor for a wafer feeder assembly
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US4818933A (en) * 1986-10-08 1989-04-04 Hewlett-Packard Company Board fixturing system
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
US4795299A (en) * 1987-04-15 1989-01-03 Genus, Inc. Dial deposition and processing apparatus
US4817556A (en) * 1987-05-04 1989-04-04 Varian Associates, Inc. Apparatus for retaining wafers
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
DE3717628A1 (de) * 1987-05-26 1988-12-15 Loehr & Herrmann Gmbh Vorrichtung zum ein- und ausgeben von leiterplatten in geschlitzte wechselpaletten
US4813840A (en) * 1987-08-11 1989-03-21 Applied Materials, Inc. Method of aligning wafers and device therefor
US4952115A (en) * 1988-02-29 1990-08-28 Tel Sagami Limited Wafer support device
US5061144A (en) * 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
US4941429A (en) * 1988-12-20 1990-07-17 Texas Instruments Incorporated Semiconductor wafer carrier guide tracks
JPH02178947A (ja) * 1988-12-29 1990-07-11 Fujitsu Ltd 半導体ウェーハのノッチ合わせ機構
US5331458A (en) * 1989-09-11 1994-07-19 Kensington Laboratories, Inc. Compact specimen inspection station
US5446584A (en) * 1989-09-11 1995-08-29 Kensington Laboratories, Inc. Compact specimen processing station
KR0139785B1 (ko) * 1990-03-20 1998-07-15 카자마 젠쥬 웨이퍼 정렬 기능을 가진 웨이퍼 카운트 장치
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39824E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
DE4029905C2 (de) * 1990-09-21 1993-10-28 Leybold Ag Vorrichtung für den Transport von Substraten
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
GB2266992A (en) * 1992-05-06 1993-11-17 Surface Tech Sys Ltd Apparatus for loading semi-conductor wafers
DE9307263U1 (de) * 1993-05-13 1993-07-22 Balzers und Leybold Deutschland Holding AG, 63450 Hanau Vorrichtung zum Greifen und Halten eines flachen Substrats
US5427225A (en) * 1993-07-21 1995-06-27 Oimatsu Industries Company Limited Sheet-like workpiece delivering apparatus
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US5452801A (en) * 1994-07-13 1995-09-26 Middlesex General Industries, Inc. Conveyor cassette for wafers
US5551829A (en) * 1995-10-11 1996-09-03 H-Square Corporation Notch finder having a flexible alignment rod
US5772773A (en) * 1996-05-20 1998-06-30 Applied Materials, Inc. Co-axial motorized wafer lift
US5662452A (en) * 1996-08-26 1997-09-02 H-Square Corporation Apparatus and method of aligning notches using a free-floating rod
US5820329A (en) * 1997-04-10 1998-10-13 Tokyo Electron Limited Vacuum processing apparatus with low particle generating wafer clamp
US6114662A (en) * 1997-06-05 2000-09-05 International Business Machines Corporation Continual flow rapid thermal processing apparatus and method
DE19745011A1 (de) * 1997-10-11 1999-04-15 Eastman Kodak Co Vorrichtung zur vereinfachten vertikalen Einführung einer Röntgenkassette in eine Transportaufnahme eines Bearbeitungsgeräts für Röntgenkassetten
JPH11121585A (ja) * 1997-10-17 1999-04-30 Olympus Optical Co Ltd ウェハ搬送装置
US6126382A (en) * 1997-11-26 2000-10-03 Novellus Systems, Inc. Apparatus for aligning substrate to chuck in processing chamber
US6533101B2 (en) 1998-06-24 2003-03-18 Asyst Technologies, Inc. Integrated transport carrier and conveyor system
US6053694A (en) * 1998-06-26 2000-04-25 H-Square Corporation Rotatable wafer handler with retractable stops
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6258228B1 (en) 1999-01-08 2001-07-10 Tokyo Electron Limited Wafer holder and clamping ring therefor for use in a deposition chamber
US6241005B1 (en) 1999-03-30 2001-06-05 Veeco Instruments, Inc. Thermal interface member
US6174011B1 (en) * 1999-04-14 2001-01-16 Arthur Keigler Method of and apparatus for handling thin and flat workpieces and the like
WO2004001582A1 (en) 2002-06-19 2003-12-31 Brooks Automation, Inc. Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists
US6932558B2 (en) 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
KR20100040746A (ko) * 2002-10-11 2010-04-20 브룩스 오토메이션, 인크. 단일 트랙 위치로부터 오버헤드 호이스트 수송 차량에 의한 하나 이상의 재료 저장 선반 레벨로의 접근
US20070092359A1 (en) * 2002-10-11 2007-04-26 Brooks Automation, Inc. Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
JP3674864B2 (ja) * 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
WO2005022602A2 (en) * 2003-08-29 2005-03-10 Crossing Automation, Inc. A method and apparatus for semiconductor processing
US7101138B2 (en) * 2003-12-03 2006-09-05 Brooks Automation, Inc. Extractor/buffer
TW200633033A (en) * 2004-08-23 2006-09-16 Koninkl Philips Electronics Nv Hot source cleaning system
US20120305192A1 (en) 2011-06-03 2012-12-06 Arthur Keigler Parallel single substrate processing fluid jet module
US20130101372A1 (en) * 2011-10-19 2013-04-25 Lam Research Ag Method and apparatus for processing wafer-shaped articles
US8936425B2 (en) * 2012-01-23 2015-01-20 Tera Autotech Corporation Ancillary apparatus and method for loading glass substrates into a bracket
RU176918U1 (ru) * 2017-04-10 2018-02-01 Общество С Ограниченной Ответственностью "Изовак" Механизм открывания и поворота дверей вакуумной камеры
CN113879846A (zh) * 2021-08-30 2022-01-04 华研芯测半导体(苏州)有限公司 一种内置传送机构的级联真空腔装置及传送方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340176A (en) * 1965-07-28 1967-09-05 Western Electric Co Vacuum processing machine
US3521765A (en) * 1967-10-31 1970-07-28 Western Electric Co Closed-end machine for processing articles in a controlled atmosphere
US3856654A (en) * 1971-08-26 1974-12-24 Western Electric Co Apparatus for feeding and coating masses of workpieces in a controlled atmosphere
US3921788A (en) * 1974-05-21 1975-11-25 Macronetics Inc Processing apparatus for thin disc-like workpieces
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US4311427A (en) 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system

Also Published As

Publication number Publication date
JPH0159352B2 (ja) 1989-12-15
GB2135120A (en) 1984-08-22
GB2135120B (en) 1985-02-27
FR2473022A1 (fr) 1981-07-10
JPS56100440A (en) 1981-08-12
FR2473022B1 (fr) 1985-11-29
CH652376A5 (de) 1985-11-15
GB2066570B (en) 1984-10-24
GB2066570A (en) 1981-07-08
GB8400423D0 (en) 1984-02-08
IT8026865A0 (it) 1980-12-22
DE3047513A1 (de) 1981-08-27
DE3047513C2 (ja) 1990-03-29
NL8006934A (nl) 1981-07-16
GB8328038D0 (en) 1983-11-23
IT1134852B (it) 1986-08-20
JPS6063947A (ja) 1985-04-12
US4311427A (en) 1982-01-19

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