JPS6141303B2 - - Google Patents
Info
- Publication number
- JPS6141303B2 JPS6141303B2 JP759381A JP759381A JPS6141303B2 JP S6141303 B2 JPS6141303 B2 JP S6141303B2 JP 759381 A JP759381 A JP 759381A JP 759381 A JP759381 A JP 759381A JP S6141303 B2 JPS6141303 B2 JP S6141303B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- layer
- circuit
- copper
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 48
- 239000010410 layer Substances 0.000 claims description 35
- 229910052759 nickel Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP759381A JPS57120433A (en) | 1981-01-20 | 1981-01-20 | Laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP759381A JPS57120433A (en) | 1981-01-20 | 1981-01-20 | Laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57120433A JPS57120433A (en) | 1982-07-27 |
JPS6141303B2 true JPS6141303B2 (it) | 1986-09-13 |
Family
ID=11670095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP759381A Granted JPS57120433A (en) | 1981-01-20 | 1981-01-20 | Laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57120433A (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61128593A (ja) * | 1984-11-27 | 1986-06-16 | 株式会社 麗光 | プリント回路用蒸着フイルム |
JPS61284991A (ja) * | 1985-06-11 | 1986-12-15 | 電気化学工業株式会社 | アルミニウム/銅複合箔張基板の回路形成法 |
JPS62181488A (ja) * | 1986-02-05 | 1987-08-08 | 尾池工業株式会社 | フレキシブルプリント回路用フイルム材料 |
WO2021192671A1 (ja) * | 2020-03-26 | 2021-09-30 | 東洋製罐株式会社 | 容器 |
-
1981
- 1981-01-20 JP JP759381A patent/JPS57120433A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57120433A (en) | 1982-07-27 |
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