JPS6141272Y2 - - Google Patents
Info
- Publication number
- JPS6141272Y2 JPS6141272Y2 JP1981075921U JP7592181U JPS6141272Y2 JP S6141272 Y2 JPS6141272 Y2 JP S6141272Y2 JP 1981075921 U JP1981075921 U JP 1981075921U JP 7592181 U JP7592181 U JP 7592181U JP S6141272 Y2 JPS6141272 Y2 JP S6141272Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electrical component
- component mounting
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000011295 pitch Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981075921U JPS6141272Y2 (de) | 1981-05-26 | 1981-05-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981075921U JPS6141272Y2 (de) | 1981-05-26 | 1981-05-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57188371U JPS57188371U (de) | 1982-11-30 |
JPS6141272Y2 true JPS6141272Y2 (de) | 1986-11-25 |
Family
ID=29871634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981075921U Expired JPS6141272Y2 (de) | 1981-05-26 | 1981-05-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6141272Y2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2858318B2 (ja) * | 1989-03-15 | 1999-02-17 | 松下電器産業株式会社 | 電子部品装着方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3416348A (en) * | 1966-09-30 | 1968-12-17 | Westinghouse Electric Corp | Flat-pack lead bending device |
JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
JPS5533666U (de) * | 1978-08-23 | 1980-03-04 | ||
JPS5571090A (en) * | 1978-11-22 | 1980-05-28 | Sony Corp | Bothhside printed board |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5599182U (de) * | 1978-12-27 | 1980-07-10 |
-
1981
- 1981-05-26 JP JP1981075921U patent/JPS6141272Y2/ja not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3416348A (en) * | 1966-09-30 | 1968-12-17 | Westinghouse Electric Corp | Flat-pack lead bending device |
JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
JPS5533666U (de) * | 1978-08-23 | 1980-03-04 | ||
JPS5571090A (en) * | 1978-11-22 | 1980-05-28 | Sony Corp | Bothhside printed board |
Also Published As
Publication number | Publication date |
---|---|
JPS57188371U (de) | 1982-11-30 |
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