JPS6141086B2 - - Google Patents

Info

Publication number
JPS6141086B2
JPS6141086B2 JP12740080A JP12740080A JPS6141086B2 JP S6141086 B2 JPS6141086 B2 JP S6141086B2 JP 12740080 A JP12740080 A JP 12740080A JP 12740080 A JP12740080 A JP 12740080A JP S6141086 B2 JPS6141086 B2 JP S6141086B2
Authority
JP
Japan
Prior art keywords
resin
composite material
diisocyanate
polyamide
item
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12740080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5750717A (en
Inventor
Tooru Tominaga
Tetsuo Myagawa
Toichi Sakata
Yoshuki Mukoyama
Hiroshi Nishizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12740080A priority Critical patent/JPS5750717A/ja
Publication of JPS5750717A publication Critical patent/JPS5750717A/ja
Publication of JPS6141086B2 publication Critical patent/JPS6141086B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
JP12740080A 1980-09-12 1980-09-12 Electrically insulating composite material Granted JPS5750717A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12740080A JPS5750717A (en) 1980-09-12 1980-09-12 Electrically insulating composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12740080A JPS5750717A (en) 1980-09-12 1980-09-12 Electrically insulating composite material

Publications (2)

Publication Number Publication Date
JPS5750717A JPS5750717A (en) 1982-03-25
JPS6141086B2 true JPS6141086B2 (en, 2012) 1986-09-12

Family

ID=14959048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12740080A Granted JPS5750717A (en) 1980-09-12 1980-09-12 Electrically insulating composite material

Country Status (1)

Country Link
JP (1) JPS5750717A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105081U (en, 2012) * 1989-02-07 1990-08-21

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140252A (ja) * 1982-02-16 1983-08-19 ダイアホイル株式会社 積層フイルム
JPH0197638A (ja) * 1987-05-29 1989-04-17 Takiron Co Ltd 耐熱性フィルム又はその類似物、並びにその製造方法
US10406791B2 (en) 2011-05-12 2019-09-10 Elantas Pdg, Inc. Composite insulating film
US10253211B2 (en) 2011-05-12 2019-04-09 Elantas Pdg, Inc. Composite insulating film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105081U (en, 2012) * 1989-02-07 1990-08-21

Also Published As

Publication number Publication date
JPS5750717A (en) 1982-03-25

Similar Documents

Publication Publication Date Title
US4497944A (en) Process for producing polyamide-imide resin
US4431758A (en) Heat resistant resin composition comprising reaction product of polyamideimide resin, alcohol and acid component.
JP2002235001A (ja) 耐熱性組成物
JPH0114643B2 (en, 2012)
US20050043502A1 (en) Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition, film-forming material and adhesive for electronic parts
CN117304438A (zh) 一种聚氨酯组合物、聚氨酯胶黏剂及含该胶黏剂的挠性覆铜板
JPS6141086B2 (en, 2012)
US4614782A (en) Heat resistant resin composition
US4477624A (en) Heat-resistant synthetic resin composition
JP4622480B2 (ja) ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法
US7064176B2 (en) Coating material for electronic components
JPS5821414A (ja) 熱硬化性樹脂組成物
JP2001064508A (ja) ポリアミドイミド樹脂組成物及びそれを含む被膜形成材料
JP2002371182A (ja) ポリイミド樹脂組成物及びそれを含む被膜形成材料
JPS58104925A (ja) ポリアミドイミド樹脂組成物およびその製造方法
JP3336220B2 (ja) 絶縁電線
JPH06345841A (ja) ポリ(アミド−イミド−エステル)樹脂及びその製造方法
JPH08143663A (ja) 耐熱性樹脂組成物
JP2845880B2 (ja) 耐熱性樹脂組成物
JP2001152015A (ja) 耐熱性樹脂組成物及びそれを用いた接着フィルム
JPH09241353A (ja) エポキシ樹脂用硬化剤
US20140212665A1 (en) Polyamide-imide coating material and insulated wire using the same
JPS6351196B2 (en, 2012)
JPS5952898B2 (ja) ポリイミド前駆体の製造方法
JP2996872B2 (ja) 低温加工性の優れた耐熱性樹脂組成物