JPS6351196B2 - - Google Patents

Info

Publication number
JPS6351196B2
JPS6351196B2 JP54033921A JP3392179A JPS6351196B2 JP S6351196 B2 JPS6351196 B2 JP S6351196B2 JP 54033921 A JP54033921 A JP 54033921A JP 3392179 A JP3392179 A JP 3392179A JP S6351196 B2 JPS6351196 B2 JP S6351196B2
Authority
JP
Japan
Prior art keywords
polyamide
imide
insulated wire
diisocyanate
isocyanate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54033921A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55125170A (en
Inventor
Yoshuki Mukoyama
Toichi Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP3392179A priority Critical patent/JPS55125170A/ja
Priority to US06/094,938 priority patent/US4294952A/en
Priority to DE19792947117 priority patent/DE2947117A1/de
Priority to GB7941113A priority patent/GB2037788B/en
Publication of JPS55125170A publication Critical patent/JPS55125170A/ja
Publication of JPS6351196B2 publication Critical patent/JPS6351196B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Paints Or Removers (AREA)
JP3392179A 1978-11-30 1979-03-22 Polyamideimide-coated insulated wire Granted JPS55125170A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP3392179A JPS55125170A (en) 1979-03-22 1979-03-22 Polyamideimide-coated insulated wire
US06/094,938 US4294952A (en) 1978-11-30 1979-11-16 Polyamide-imide resin and its production
DE19792947117 DE2947117A1 (de) 1978-11-30 1979-11-22 Polyamidimidharz, verfahren zu seiner herstellung und dessen verwendung
GB7941113A GB2037788B (en) 1978-11-30 1979-11-28 Polyamide-imade resin and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3392179A JPS55125170A (en) 1979-03-22 1979-03-22 Polyamideimide-coated insulated wire

Publications (2)

Publication Number Publication Date
JPS55125170A JPS55125170A (en) 1980-09-26
JPS6351196B2 true JPS6351196B2 (en, 2012) 1988-10-13

Family

ID=12399971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3392179A Granted JPS55125170A (en) 1978-11-30 1979-03-22 Polyamideimide-coated insulated wire

Country Status (1)

Country Link
JP (1) JPS55125170A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098078B2 (en) 1990-09-24 2006-08-29 Tessera, Inc. Microelectronic component and assembly having leads with offset portions

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100627508B1 (ko) 2005-02-21 2006-09-22 엘에스전선 주식회사 에나멜 전선 피복도료 조성물 및 이를 이용한 에나멜 전선
WO2006112568A1 (en) * 2005-02-21 2006-10-26 Ls Cable Ltd. Enamel vanish composition for enamel wire and enamel wire using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2542706C3 (de) * 1975-09-25 1981-04-09 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Imidgruppen enthaltenden Polykondensaten

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098078B2 (en) 1990-09-24 2006-08-29 Tessera, Inc. Microelectronic component and assembly having leads with offset portions
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US7271481B2 (en) 1990-09-24 2007-09-18 Tessera, Inc. Microelectronic component and assembly having leads with offset portions
US7291910B2 (en) 1990-09-24 2007-11-06 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same

Also Published As

Publication number Publication date
JPS55125170A (en) 1980-09-26

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