JPS6139560A - リ−ド取付け方法 - Google Patents

リ−ド取付け方法

Info

Publication number
JPS6139560A
JPS6139560A JP16015284A JP16015284A JPS6139560A JP S6139560 A JPS6139560 A JP S6139560A JP 16015284 A JP16015284 A JP 16015284A JP 16015284 A JP16015284 A JP 16015284A JP S6139560 A JPS6139560 A JP S6139560A
Authority
JP
Japan
Prior art keywords
lead
nickel
coated film
silver solder
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16015284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH038114B2 (enExample
Inventor
Masao Sekihashi
関端　正雄
Taiji Nezu
根津　太治
Tetsuo Miyoshi
三好　徹夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16015284A priority Critical patent/JPS6139560A/ja
Publication of JPS6139560A publication Critical patent/JPS6139560A/ja
Publication of JPH038114B2 publication Critical patent/JPH038114B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP16015284A 1984-07-30 1984-07-30 リ−ド取付け方法 Granted JPS6139560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16015284A JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16015284A JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Publications (2)

Publication Number Publication Date
JPS6139560A true JPS6139560A (ja) 1986-02-25
JPH038114B2 JPH038114B2 (enExample) 1991-02-05

Family

ID=15708997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16015284A Granted JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Country Status (1)

Country Link
JP (1) JPS6139560A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0698604A (ja) * 1992-09-18 1994-04-12 Tokai Gokin Kogyo Kk 芝生管理機のエアレーション用タイン
CN107481989A (zh) * 2017-06-26 2017-12-15 中国电子科技集团公司第五十五研究所 一种高弯曲疲劳强度陶瓷封装外引线及制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727760U (enExample) * 1971-04-17 1972-11-29
JPS4923578A (enExample) * 1972-06-22 1974-03-02
JPS5066573U (enExample) * 1973-10-19 1975-06-14
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device
JPS5611807A (en) * 1979-07-10 1981-02-05 Nippon Mining Co Ironnbase alloy for lead wire material
JPS58123744A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd リ−ドフレ−ム及び半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4727760U (enExample) * 1971-04-17 1972-11-29
JPS4923578A (enExample) * 1972-06-22 1974-03-02
JPS5066573U (enExample) * 1973-10-19 1975-06-14
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device
JPS5611807A (en) * 1979-07-10 1981-02-05 Nippon Mining Co Ironnbase alloy for lead wire material
JPS58123744A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd リ−ドフレ−ム及び半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0698604A (ja) * 1992-09-18 1994-04-12 Tokai Gokin Kogyo Kk 芝生管理機のエアレーション用タイン
CN107481989A (zh) * 2017-06-26 2017-12-15 中国电子科技集团公司第五十五研究所 一种高弯曲疲劳强度陶瓷封装外引线及制备方法

Also Published As

Publication number Publication date
JPH038114B2 (enExample) 1991-02-05

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