JPH038114B2 - - Google Patents

Info

Publication number
JPH038114B2
JPH038114B2 JP59160152A JP16015284A JPH038114B2 JP H038114 B2 JPH038114 B2 JP H038114B2 JP 59160152 A JP59160152 A JP 59160152A JP 16015284 A JP16015284 A JP 16015284A JP H038114 B2 JPH038114 B2 JP H038114B2
Authority
JP
Japan
Prior art keywords
lead
brazing material
leads
alloy
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59160152A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6139560A (ja
Inventor
Masao Sekihashi
Taiji Nezu
Tetsuo Myoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16015284A priority Critical patent/JPS6139560A/ja
Publication of JPS6139560A publication Critical patent/JPS6139560A/ja
Publication of JPH038114B2 publication Critical patent/JPH038114B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP16015284A 1984-07-30 1984-07-30 リ−ド取付け方法 Granted JPS6139560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16015284A JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16015284A JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Publications (2)

Publication Number Publication Date
JPS6139560A JPS6139560A (ja) 1986-02-25
JPH038114B2 true JPH038114B2 (enExample) 1991-02-05

Family

ID=15708997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16015284A Granted JPS6139560A (ja) 1984-07-30 1984-07-30 リ−ド取付け方法

Country Status (1)

Country Link
JP (1) JPS6139560A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0698604A (ja) * 1992-09-18 1994-04-12 Tokai Gokin Kogyo Kk 芝生管理機のエアレーション用タイン
CN107481989A (zh) * 2017-06-26 2017-12-15 中国电子科技集团公司第五十五研究所 一种高弯曲疲劳强度陶瓷封装外引线及制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512518Y2 (enExample) * 1971-04-17 1976-01-24
JPS553821B2 (enExample) * 1972-06-22 1980-01-26
JPS5066573U (enExample) * 1973-10-19 1975-06-14
JPS52117066A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device
JPS5611807A (en) * 1979-07-10 1981-02-05 Nippon Mining Co Ironnbase alloy for lead wire material
JPS58123744A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd リ−ドフレ−ム及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6139560A (ja) 1986-02-25

Similar Documents

Publication Publication Date Title
JP2543619B2 (ja) 半導体装置用リ―ドフレ―ム
US4498121A (en) Copper alloys for suppressing growth of Cu-Al intermetallic compounds
US5747881A (en) Semiconductor device, method of fabricating the same and copper leads
US5901901A (en) Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly
JPH0612796B2 (ja) 半導体装置
US5436082A (en) Protective coating combination for lead frames
US6130479A (en) Nickel alloy films for reduced intermetallic formation in solder
US20110042815A1 (en) Semiconductor device and on-vehicle ac generator
US5448107A (en) Radiating fin having an improved life and thermal conductivity
WO1982002457A1 (en) Die attachment exhibiting enhanced quality and reliability
US4513905A (en) Integrated circuit metallization technique
US20040124543A1 (en) Low stress semiconductor die attach
WO2005117112A1 (ja) 半導体装置用リードフレーム
JPH038114B2 (enExample)
EP1798763B1 (en) Semiconductor device and bonding method therefor
US5935719A (en) Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes
JPS5936425B2 (ja) 中間層を有するリ−ドフレ−ム構造
JPS6232622B2 (enExample)
JP2523029B2 (ja) Ａ▲ｌ▼―Ｓｎ系共晶皮膜被覆リ―ドフレ―ム材
JP2523030B2 (ja) Ａ▲ｌ▼―Ｐｂ系共晶皮膜被覆リ―ドフレ―ム材料
KR20250135590A (ko) 반도체 칩과의 접합부 특성이 향상된 반도체 패키지용 기판의 제조방법 및 그에 의해 제조된 반도체 패키지용 기판
JPS582755B2 (ja) ハンドウタイソウチヨウロウザイ
JPS638136Y2 (enExample)
JP2750469B2 (ja) 半導体パッケージ
JP3215851B2 (ja) 樹脂封止型半導体装置およびその製造法