JPS6138864B2 - - Google Patents

Info

Publication number
JPS6138864B2
JPS6138864B2 JP54120827A JP12082779A JPS6138864B2 JP S6138864 B2 JPS6138864 B2 JP S6138864B2 JP 54120827 A JP54120827 A JP 54120827A JP 12082779 A JP12082779 A JP 12082779A JP S6138864 B2 JPS6138864 B2 JP S6138864B2
Authority
JP
Japan
Prior art keywords
polyimide
copper
copper plate
support
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54120827A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5645060A (en
Inventor
Yasutoshi Kurihara
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12082779A priority Critical patent/JPS5645060A/ja
Publication of JPS5645060A publication Critical patent/JPS5645060A/ja
Publication of JPS6138864B2 publication Critical patent/JPS6138864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP12082779A 1979-09-21 1979-09-21 Semiconductor device Granted JPS5645060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12082779A JPS5645060A (en) 1979-09-21 1979-09-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12082779A JPS5645060A (en) 1979-09-21 1979-09-21 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5645060A JPS5645060A (en) 1981-04-24
JPS6138864B2 true JPS6138864B2 (enrdf_load_stackoverflow) 1986-09-01

Family

ID=14795938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12082779A Granted JPS5645060A (en) 1979-09-21 1979-09-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5645060A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138395U (ja) * 1982-03-11 1983-09-17 電気化学工業株式会社 絶縁フイン
JPS603132A (ja) * 1983-06-20 1985-01-09 Nitto Electric Ind Co Ltd 半導体装置
JPS60102751A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用接着フイルム
JPH0636416B2 (ja) * 1983-11-09 1994-05-11 日東電工株式会社 半導体素子固定用導電性接着フイルム
JPS60106471A (ja) * 1983-11-15 1985-06-11 住友ゴム工業株式会社 テニスボ−ル用コア
WO1996037915A1 (en) * 1995-05-26 1996-11-28 Sheldahl, Inc. Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
JP2007288054A (ja) * 2006-04-19 2007-11-01 Toyota Motor Corp パワーモジュール
DE102021214247A1 (de) * 2021-12-13 2023-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungsmodul mit Hochvolt-Isolierung

Also Published As

Publication number Publication date
JPS5645060A (en) 1981-04-24

Similar Documents

Publication Publication Date Title
JP5442368B2 (ja) 直付リード線を備えるｉｃチップパッケージ
US7061080B2 (en) Power module package having improved heat dissipating capability
US10485139B2 (en) Power module, thermal dissipation structure of the power module and contact method of the power module
US20180151461A1 (en) Stiffener for fan-out wafer level packaging and method of manufacturing
US20070246812A1 (en) High reliability power module
KR102172689B1 (ko) 반도체 패키지 및 그 제조방법
EP0380570A1 (en) Heat dissipating interconnect tape for use in tape automated bonding
JPH0677357A (ja) 改良された半導体パッケージ、集積回路デバイスをパッケージする改良された方法、および半導体デバイスを冷却する方法
US7078795B2 (en) High voltage module and method for producing same
US10937767B2 (en) Chip packaging method and device with packaged chips
CN111696938A (zh) 包括具有集成夹具和固定元件的半导体封装件的电子模块
JP3440824B2 (ja) 半導体装置
CN114078790A (zh) 功率半导体模块装置及其制造方法
JP2007012831A (ja) パワー半導体装置
JPS6138864B2 (enrdf_load_stackoverflow)
JP3841007B2 (ja) 半導体装置
JP2020141023A (ja) 半導体装置
JP7034211B2 (ja) 半導体装置
KR102371636B1 (ko) 양면 기판 반도체 제조 방법
JP7170614B2 (ja) 半導体装置
JP2021158304A (ja) 半導体装置及び半導体装置の製造方法
CN114975335B (zh) 半导体封装件
JPS6050354B2 (ja) 樹脂封止型半導体装置
JP3226088B2 (ja) 半導体装置
JP7535444B2 (ja) 絶縁基板および電力変換装置