JPS5645060A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5645060A JPS5645060A JP12082779A JP12082779A JPS5645060A JP S5645060 A JPS5645060 A JP S5645060A JP 12082779 A JP12082779 A JP 12082779A JP 12082779 A JP12082779 A JP 12082779A JP S5645060 A JPS5645060 A JP S5645060A
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- polyimide
- supporting substance
- supporting
- ethylene fluoride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12082779A JPS5645060A (en) | 1979-09-21 | 1979-09-21 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12082779A JPS5645060A (en) | 1979-09-21 | 1979-09-21 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5645060A true JPS5645060A (en) | 1981-04-24 |
JPS6138864B2 JPS6138864B2 (ja) | 1986-09-01 |
Family
ID=14795938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12082779A Granted JPS5645060A (en) | 1979-09-21 | 1979-09-21 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5645060A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138395U (ja) * | 1982-03-11 | 1983-09-17 | 電気化学工業株式会社 | 絶縁フイン |
JPS603132A (ja) * | 1983-06-20 | 1985-01-09 | Nitto Electric Ind Co Ltd | 半導体装置 |
JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
JPS60102751A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用接着フイルム |
JPS60106471A (ja) * | 1983-11-15 | 1985-06-11 | 住友ゴム工業株式会社 | テニスボ−ル用コア |
US5766740A (en) * | 1995-05-26 | 1998-06-16 | Sheldahl, Inc. | Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink |
JP2007288054A (ja) * | 2006-04-19 | 2007-11-01 | Toyota Motor Corp | パワーモジュール |
WO2023110895A1 (de) * | 2021-12-13 | 2023-06-22 | Robert Bosch Gmbh | Leistungsmodul mit hochvolt-isolierung |
-
1979
- 1979-09-21 JP JP12082779A patent/JPS5645060A/ja active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138395U (ja) * | 1982-03-11 | 1983-09-17 | 電気化学工業株式会社 | 絶縁フイン |
JPS603132A (ja) * | 1983-06-20 | 1985-01-09 | Nitto Electric Ind Co Ltd | 半導体装置 |
JPS60102750A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用導電性接着フイルム |
JPS60102751A (ja) * | 1983-11-09 | 1985-06-06 | Nitto Electric Ind Co Ltd | 半導体素子固定用接着フイルム |
JPS60106471A (ja) * | 1983-11-15 | 1985-06-11 | 住友ゴム工業株式会社 | テニスボ−ル用コア |
JPH0471421B2 (ja) * | 1983-11-15 | 1992-11-13 | Sumitomo Rubber Ind | |
US5766740A (en) * | 1995-05-26 | 1998-06-16 | Sheldahl, Inc. | Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink |
US5798171A (en) * | 1995-05-26 | 1998-08-25 | Sheldahl, Inc. | Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink |
JP2007288054A (ja) * | 2006-04-19 | 2007-11-01 | Toyota Motor Corp | パワーモジュール |
WO2023110895A1 (de) * | 2021-12-13 | 2023-06-22 | Robert Bosch Gmbh | Leistungsmodul mit hochvolt-isolierung |
Also Published As
Publication number | Publication date |
---|---|
JPS6138864B2 (ja) | 1986-09-01 |
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