JPS6138264B2 - - Google Patents
Info
- Publication number
- JPS6138264B2 JPS6138264B2 JP3638381A JP3638381A JPS6138264B2 JP S6138264 B2 JPS6138264 B2 JP S6138264B2 JP 3638381 A JP3638381 A JP 3638381A JP 3638381 A JP3638381 A JP 3638381A JP S6138264 B2 JPS6138264 B2 JP S6138264B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- melting point
- point metal
- polycrystalline silicon
- high melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Recrystallisation Techniques (AREA)
- Silicon Compounds (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3638381A JPS57170814A (en) | 1981-03-13 | 1981-03-13 | Formation of metallic silicide layer with high melting point |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3638381A JPS57170814A (en) | 1981-03-13 | 1981-03-13 | Formation of metallic silicide layer with high melting point |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57170814A JPS57170814A (en) | 1982-10-21 |
JPS6138264B2 true JPS6138264B2 (enrdf_load_stackoverflow) | 1986-08-28 |
Family
ID=12468316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3638381A Granted JPS57170814A (en) | 1981-03-13 | 1981-03-13 | Formation of metallic silicide layer with high melting point |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57170814A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5993871A (ja) * | 1982-11-16 | 1984-05-30 | Matsushita Electronics Corp | 高融点金属シリサイド膜の形成方法 |
JPH02224225A (ja) * | 1988-11-28 | 1990-09-06 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2706182B2 (ja) * | 1991-03-19 | 1998-01-28 | 三洋電機株式会社 | シリサイド膜の製造方法 |
-
1981
- 1981-03-13 JP JP3638381A patent/JPS57170814A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57170814A (en) | 1982-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3963494B2 (ja) | 半導体装置およびその形成方法 | |
EP0159935B1 (en) | Method for inhibiting dopant out-diffusion | |
JP3704427B2 (ja) | 半導体装置の銅金属配線形成方法 | |
EP0377137B1 (en) | Method for selective deposition of refractory metals on silicon substrates | |
US5733816A (en) | Method for depositing a tungsten layer on silicon | |
TWI255007B (en) | Method of fabricating a semiconductor device having reduced contact resistance | |
JPS62101049A (ja) | シリサイド層の形成方法 | |
JPH11238736A (ja) | 半導体デバイスの製造方法 | |
KR100539278B1 (ko) | 코발트 실리사이드막 형성 방법 및 반도체 장치의 제조방법. | |
US5518960A (en) | Method of manufacturing a wiring layer including amorphous silicon and refractory metal silicide | |
KR100485386B1 (ko) | 금속막 증착용 조성물 및 이를 이용한 금속막 형성 방법 | |
US4985371A (en) | Process for making integrated-circuit device metallization | |
KR20020011903A (ko) | 전극구조체의 형성방법 및 반도체장치의 제조방법 | |
JP2503187B2 (ja) | 二重シリサイド層配線をもつ半導体装置の製造方法 | |
JP2664757B2 (ja) | 半導体装置の製造方法 | |
EP0068843B1 (en) | Method of producing a conductor in a desired pattern on a semiconductor substrate | |
JPS6138264B2 (enrdf_load_stackoverflow) | ||
WO2000022659A1 (en) | Method of forming cobalt-disilicide contacts using a cobalt-carbon alloy thin film | |
JPH1167688A (ja) | シリサイド材料とその薄膜およびシリサイド薄膜の製造方法 | |
JPS639661B2 (enrdf_load_stackoverflow) | ||
JP3238437B2 (ja) | 半導体装置およびその製造方法 | |
JP2932484B2 (ja) | 高融点金属多層膜形成法 | |
JPH0147012B2 (enrdf_load_stackoverflow) | ||
JP3250543B2 (ja) | 半導体装置の製造方法 | |
JPH07297206A (ja) | 化合物半導体装置とその製造方法 |