JPS6138186Y2 - - Google Patents

Info

Publication number
JPS6138186Y2
JPS6138186Y2 JP1981044152U JP4415281U JPS6138186Y2 JP S6138186 Y2 JPS6138186 Y2 JP S6138186Y2 JP 1981044152 U JP1981044152 U JP 1981044152U JP 4415281 U JP4415281 U JP 4415281U JP S6138186 Y2 JPS6138186 Y2 JP S6138186Y2
Authority
JP
Japan
Prior art keywords
bonding
thin metal
metal wire
pellet
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981044152U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57157139U (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981044152U priority Critical patent/JPS6138186Y2/ja
Publication of JPS57157139U publication Critical patent/JPS57157139U/ja
Application granted granted Critical
Publication of JPS6138186Y2 publication Critical patent/JPS6138186Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10W72/07141
    • H10W72/075
    • H10W72/07521
    • H10W72/07551
    • H10W72/50
    • H10W72/5363
    • H10W72/5438
    • H10W72/5449
    • H10W72/884
    • H10W90/736
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1981044152U 1981-03-27 1981-03-27 Expired JPS6138186Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981044152U JPS6138186Y2 (cg-RX-API-DMAC10.html) 1981-03-27 1981-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981044152U JPS6138186Y2 (cg-RX-API-DMAC10.html) 1981-03-27 1981-03-27

Publications (2)

Publication Number Publication Date
JPS57157139U JPS57157139U (cg-RX-API-DMAC10.html) 1982-10-02
JPS6138186Y2 true JPS6138186Y2 (cg-RX-API-DMAC10.html) 1986-11-05

Family

ID=29841089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981044152U Expired JPS6138186Y2 (cg-RX-API-DMAC10.html) 1981-03-27 1981-03-27

Country Status (1)

Country Link
JP (1) JPS6138186Y2 (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS57157139U (cg-RX-API-DMAC10.html) 1982-10-02

Similar Documents

Publication Publication Date Title
US5642852A (en) Method of ultrasonic welding
US20070029367A1 (en) Semiconductor device
KR100721280B1 (ko) 반도체 칩 조립체의 형성 방법과 기판 상의 회로로부터반도체 칩으로 와이어 본드부를 형성하는 장치
JPH0645409A (ja) ワイヤーボンディング方法及びその装置
JPS6138186Y2 (cg-RX-API-DMAC10.html)
GB2261547A (en) Semiconductor device with bonding pads at the edge
KR0161548B1 (ko) 와이어 본딩방법
JP2003303845A (ja) 半導体装置およびワイヤボンディング方法
US7314157B2 (en) Wire bond with improved shear strength
US5335842A (en) Self-aligning single point bonding tool
JP4604384B2 (ja) 回路基板実装体の実装方法
JP2682006B2 (ja) バンプ形成方法
JP2676782B2 (ja) バンプ形成方法およびバンプ構造体
JPH0697350A (ja) リ−ドフレ−ム
JP3202193B2 (ja) ワイヤボンディング方法
JPH0695519B2 (ja) バンプ形成方法
JP2921037B2 (ja) バンプ形成方法
JPS6178128A (ja) 半導体装置およびその製造において用いるボンデイングツ−ル
JP3372313B2 (ja) ワイヤボンディング装置
JPS63219131A (ja) 半導体装置の製造方法
JPH0748507B2 (ja) ワイヤボンデイング方法
KR100721274B1 (ko) 반도체 칩 조립체의 형성 방법
JP2925392B2 (ja) ボール式ワイヤボンディング方法
JPH0883817A (ja) 半導体集積回路およびその製造方法
JPS62108533A (ja) ワイヤボンデイング方法