JPS6138186Y2 - - Google Patents
Info
- Publication number
- JPS6138186Y2 JPS6138186Y2 JP1981044152U JP4415281U JPS6138186Y2 JP S6138186 Y2 JPS6138186 Y2 JP S6138186Y2 JP 1981044152 U JP1981044152 U JP 1981044152U JP 4415281 U JP4415281 U JP 4415281U JP S6138186 Y2 JPS6138186 Y2 JP S6138186Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- thin metal
- metal wire
- pellet
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/0711—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H10W72/07141—
-
- H10W72/075—
-
- H10W72/07521—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/5438—
-
- H10W72/5449—
-
- H10W72/884—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981044152U JPS6138186Y2 (cg-RX-API-DMAC10.html) | 1981-03-27 | 1981-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981044152U JPS6138186Y2 (cg-RX-API-DMAC10.html) | 1981-03-27 | 1981-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57157139U JPS57157139U (cg-RX-API-DMAC10.html) | 1982-10-02 |
| JPS6138186Y2 true JPS6138186Y2 (cg-RX-API-DMAC10.html) | 1986-11-05 |
Family
ID=29841089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981044152U Expired JPS6138186Y2 (cg-RX-API-DMAC10.html) | 1981-03-27 | 1981-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138186Y2 (cg-RX-API-DMAC10.html) |
-
1981
- 1981-03-27 JP JP1981044152U patent/JPS6138186Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57157139U (cg-RX-API-DMAC10.html) | 1982-10-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5642852A (en) | Method of ultrasonic welding | |
| US20070029367A1 (en) | Semiconductor device | |
| KR100721280B1 (ko) | 반도체 칩 조립체의 형성 방법과 기판 상의 회로로부터반도체 칩으로 와이어 본드부를 형성하는 장치 | |
| JPH0645409A (ja) | ワイヤーボンディング方法及びその装置 | |
| JPS6138186Y2 (cg-RX-API-DMAC10.html) | ||
| GB2261547A (en) | Semiconductor device with bonding pads at the edge | |
| KR0161548B1 (ko) | 와이어 본딩방법 | |
| JP2003303845A (ja) | 半導体装置およびワイヤボンディング方法 | |
| US7314157B2 (en) | Wire bond with improved shear strength | |
| US5335842A (en) | Self-aligning single point bonding tool | |
| JP4604384B2 (ja) | 回路基板実装体の実装方法 | |
| JP2682006B2 (ja) | バンプ形成方法 | |
| JP2676782B2 (ja) | バンプ形成方法およびバンプ構造体 | |
| JPH0697350A (ja) | リ−ドフレ−ム | |
| JP3202193B2 (ja) | ワイヤボンディング方法 | |
| JPH0695519B2 (ja) | バンプ形成方法 | |
| JP2921037B2 (ja) | バンプ形成方法 | |
| JPS6178128A (ja) | 半導体装置およびその製造において用いるボンデイングツ−ル | |
| JP3372313B2 (ja) | ワイヤボンディング装置 | |
| JPS63219131A (ja) | 半導体装置の製造方法 | |
| JPH0748507B2 (ja) | ワイヤボンデイング方法 | |
| KR100721274B1 (ko) | 반도체 칩 조립체의 형성 방법 | |
| JP2925392B2 (ja) | ボール式ワイヤボンディング方法 | |
| JPH0883817A (ja) | 半導体集積回路およびその製造方法 | |
| JPS62108533A (ja) | ワイヤボンデイング方法 |