JPS6135269Y2 - - Google Patents
Info
- Publication number
- JPS6135269Y2 JPS6135269Y2 JP19366181U JP19366181U JPS6135269Y2 JP S6135269 Y2 JPS6135269 Y2 JP S6135269Y2 JP 19366181 U JP19366181 U JP 19366181U JP 19366181 U JP19366181 U JP 19366181U JP S6135269 Y2 JPS6135269 Y2 JP S6135269Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin liquid
- resin
- collet
- protrusion
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 69
- 239000011347 resin Substances 0.000 claims description 69
- 239000007788 liquid Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 16
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nozzles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19366181U JPS5899859U (ja) | 1981-12-28 | 1981-12-28 | 樹脂液滴下用コレツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19366181U JPS5899859U (ja) | 1981-12-28 | 1981-12-28 | 樹脂液滴下用コレツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5899859U JPS5899859U (ja) | 1983-07-07 |
| JPS6135269Y2 true JPS6135269Y2 (ko) | 1986-10-14 |
Family
ID=30107009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19366181U Granted JPS5899859U (ja) | 1981-12-28 | 1981-12-28 | 樹脂液滴下用コレツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5899859U (ko) |
-
1981
- 1981-12-28 JP JP19366181U patent/JPS5899859U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5899859U (ja) | 1983-07-07 |
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