JPS6129541B2 - - Google Patents

Info

Publication number
JPS6129541B2
JPS6129541B2 JP53138879A JP13887978A JPS6129541B2 JP S6129541 B2 JPS6129541 B2 JP S6129541B2 JP 53138879 A JP53138879 A JP 53138879A JP 13887978 A JP13887978 A JP 13887978A JP S6129541 B2 JPS6129541 B2 JP S6129541B2
Authority
JP
Japan
Prior art keywords
sealing
lid
metal material
ceramic
transparent glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53138879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5565448A (en
Inventor
Masaru Sakaguchi
Masao Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13887978A priority Critical patent/JPS5565448A/ja
Publication of JPS5565448A publication Critical patent/JPS5565448A/ja
Publication of JPS6129541B2 publication Critical patent/JPS6129541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Die Bonding (AREA)
JP13887978A 1978-11-13 1978-11-13 Ceramic package for semiconductor device Granted JPS5565448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13887978A JPS5565448A (en) 1978-11-13 1978-11-13 Ceramic package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13887978A JPS5565448A (en) 1978-11-13 1978-11-13 Ceramic package for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5565448A JPS5565448A (en) 1980-05-16
JPS6129541B2 true JPS6129541B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-07

Family

ID=15232239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13887978A Granted JPS5565448A (en) 1978-11-13 1978-11-13 Ceramic package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5565448A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0747870Y2 (ja) * 1987-08-13 1995-11-01 日本電気株式会社 光学窓付き気密容器
JP4499386B2 (ja) 2003-07-29 2010-07-07 浜松ホトニクス株式会社 裏面入射型光検出素子の製造方法
WO2005086229A1 (ja) * 2004-03-05 2005-09-15 Neomax Materials Co., Ltd. 光透過用窓部材、光透過用窓部材を備えた半導体パッケージおよび光透過用窓部材の製造方法
JP4375186B2 (ja) * 2004-09-30 2009-12-02 株式会社日立製作所 陽極接合構造を用いた電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH637315A5 (fr) * 1980-07-07 1983-07-29 Sameca Sa Dispositif de guidage d'une barre de matiere au cours de son usinage dans un tour automatique.

Also Published As

Publication number Publication date
JPS5565448A (en) 1980-05-16

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