JPS61294845A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS61294845A
JPS61294845A JP60136288A JP13628885A JPS61294845A JP S61294845 A JPS61294845 A JP S61294845A JP 60136288 A JP60136288 A JP 60136288A JP 13628885 A JP13628885 A JP 13628885A JP S61294845 A JPS61294845 A JP S61294845A
Authority
JP
Japan
Prior art keywords
strip
metal plate
semiconductor device
pellets
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60136288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431188B2 (enrdf_load_stackoverflow
Inventor
Hidetoshi Iwashita
英俊 岩下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP60136288A priority Critical patent/JPS61294845A/ja
Publication of JPS61294845A publication Critical patent/JPS61294845A/ja
Publication of JPH0431188B2 publication Critical patent/JPH0431188B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60136288A 1985-06-21 1985-06-21 半導体装置の製造方法 Granted JPS61294845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60136288A JPS61294845A (ja) 1985-06-21 1985-06-21 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60136288A JPS61294845A (ja) 1985-06-21 1985-06-21 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61294845A true JPS61294845A (ja) 1986-12-25
JPH0431188B2 JPH0431188B2 (enrdf_load_stackoverflow) 1992-05-25

Family

ID=15171665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60136288A Granted JPS61294845A (ja) 1985-06-21 1985-06-21 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61294845A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001033632A1 (en) * 1999-11-01 2001-05-10 General Semiconductor, Inc. Planar hybrid diode rectifier bridge
CN103236426A (zh) * 2013-04-22 2013-08-07 扬州扬杰电子科技股份有限公司 一种同向阵列式整流桥堆
CN110085579A (zh) * 2019-04-25 2019-08-02 广东美的制冷设备有限公司 高集成智能功率模块及其制作方法以及空调器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150423A (ja) * 1974-10-29 1976-05-04 Shindengen Electric Mfg Handotaitansozenpaseiryusoshino seizohoho oyobi handotaitansozenpaseiryusoshi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150423A (ja) * 1974-10-29 1976-05-04 Shindengen Electric Mfg Handotaitansozenpaseiryusoshino seizohoho oyobi handotaitansozenpaseiryusoshi

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001033632A1 (en) * 1999-11-01 2001-05-10 General Semiconductor, Inc. Planar hybrid diode rectifier bridge
US6387730B2 (en) 1999-11-01 2002-05-14 General Semiconductor, Inc. Hybrid S.C. devices and method of manufacture thereof
CN1327521C (zh) * 1999-11-01 2007-07-18 通用半导体公司 平面混合式二极管整流桥
CN103236426A (zh) * 2013-04-22 2013-08-07 扬州扬杰电子科技股份有限公司 一种同向阵列式整流桥堆
CN110085579A (zh) * 2019-04-25 2019-08-02 广东美的制冷设备有限公司 高集成智能功率模块及其制作方法以及空调器

Also Published As

Publication number Publication date
JPH0431188B2 (enrdf_load_stackoverflow) 1992-05-25

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