JPS61293204A - 感光性組成物 - Google Patents

感光性組成物

Info

Publication number
JPS61293204A
JPS61293204A JP60133958A JP13395885A JPS61293204A JP S61293204 A JPS61293204 A JP S61293204A JP 60133958 A JP60133958 A JP 60133958A JP 13395885 A JP13395885 A JP 13395885A JP S61293204 A JPS61293204 A JP S61293204A
Authority
JP
Japan
Prior art keywords
acid
added
polyamide
solution
photosensitive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60133958A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0572941B2 (enrdf_load_stackoverflow
Inventor
Yoshio Matsuoka
松岡　嘉夫
Akihiko Ikeda
章彦 池田
Hideo Ai
愛　英夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP60133958A priority Critical patent/JPS61293204A/ja
Publication of JPS61293204A publication Critical patent/JPS61293204A/ja
Publication of JPH0572941B2 publication Critical patent/JPH0572941B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP60133958A 1985-06-21 1985-06-21 感光性組成物 Granted JPS61293204A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60133958A JPS61293204A (ja) 1985-06-21 1985-06-21 感光性組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60133958A JPS61293204A (ja) 1985-06-21 1985-06-21 感光性組成物

Publications (2)

Publication Number Publication Date
JPS61293204A true JPS61293204A (ja) 1986-12-24
JPH0572941B2 JPH0572941B2 (enrdf_load_stackoverflow) 1993-10-13

Family

ID=15117054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60133958A Granted JPS61293204A (ja) 1985-06-21 1985-06-21 感光性組成物

Country Status (1)

Country Link
JP (1) JPS61293204A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05127383A (ja) * 1991-11-06 1993-05-25 Sumitomo Bakelite Co Ltd 感光性樹脂組成物
US8071273B2 (en) 2008-03-31 2011-12-06 Dai Nippon Printing Co., Ltd. Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition
WO2015012080A1 (ja) * 2013-07-26 2015-01-29 国立大学法人 東京大学 イミノ基を有する可溶性ポリイミド系重合体、及びその製造方法
WO2018047479A1 (ja) * 2016-09-06 2018-03-15 株式会社スリーボンド 硬化性樹脂組成物、それを用いた燃料電池およびシール方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60233646A (ja) * 1984-03-29 1985-11-20 シ−メンス、アクチエンゲゼルシヤフト レリ−フ構造体の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60233646A (ja) * 1984-03-29 1985-11-20 シ−メンス、アクチエンゲゼルシヤフト レリ−フ構造体の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05127383A (ja) * 1991-11-06 1993-05-25 Sumitomo Bakelite Co Ltd 感光性樹脂組成物
US8071273B2 (en) 2008-03-31 2011-12-06 Dai Nippon Printing Co., Ltd. Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition
US8859186B2 (en) 2008-03-31 2014-10-14 Dai Nippon Printing Co., Ltd. Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition
WO2015012080A1 (ja) * 2013-07-26 2015-01-29 国立大学法人 東京大学 イミノ基を有する可溶性ポリイミド系重合体、及びその製造方法
WO2018047479A1 (ja) * 2016-09-06 2018-03-15 株式会社スリーボンド 硬化性樹脂組成物、それを用いた燃料電池およびシール方法
CN109641997A (zh) * 2016-09-06 2019-04-16 三键有限公司 固化性树脂组合物、使用该固化性树脂组合物的燃料电池和密封方法
KR20190050966A (ko) * 2016-09-06 2019-05-14 가부시끼가이샤 쓰리본드 경화성 수지 조성물, 그것을 이용한 연료 전지 및 밀봉 방법
JPWO2018047479A1 (ja) * 2016-09-06 2019-08-15 株式会社スリーボンド 硬化性樹脂組成物、それを用いた燃料電池およびシール方法
US11165072B2 (en) 2016-09-06 2021-11-02 Threebond Co., Ltd. Curable resin composition, fuel cell using same, and sealing method using same
CN109641997B (zh) * 2016-09-06 2021-12-28 三键有限公司 固化性树脂组合物、使用该固化性树脂组合物的燃料电池和密封方法

Also Published As

Publication number Publication date
JPH0572941B2 (enrdf_load_stackoverflow) 1993-10-13

Similar Documents

Publication Publication Date Title
US4914182A (en) Polyimides, a process for their preparation and their use, and tetracarboxylic acids and tetracarboxylic acid derivatives
US4803147A (en) Photosensitive polyimide polymer compositions
EP0020773B1 (en) Light-sensitive polymer composition
EP0203372B1 (en) Process for making photopolymerizable aromatic polyamic acid derivatives
JP5740977B2 (ja) 感光性ポリイミド前駆体及び感光性樹脂組成物
US20080103275A1 (en) Negative photosensitive polyimide polymer and uses thereof
JPH02639A (ja) ４，４’−ビス〔２−（３，４−（ジカルボキシフェニル）ヘキサフルオロイソプロピル〕ジフェニルエーテル二無水物から得られた重合体
WO2000043439A1 (fr) Ester d'acide polyamique
JPH0680776A (ja) ポリイミド前駆体及び組成物
US4677186A (en) Polyimides and a process for their preparation
JPS61118423A (ja) 感光性組成物
JPH06342211A (ja) ｉ線露光用感光性組成物
JP2844219B2 (ja) 低応力ポリイミド前駆体、及びポリイミド複合成形体の製造方法
JPS59145216A (ja) 有機溶媒可溶性の感光性ポリアミドイミド
JPS61293204A (ja) 感光性組成物
JPH0850354A (ja) ｉ線用感光性組成物
WO2021070232A1 (ja) ポリイミド前駆体、樹脂組成物、感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
US5037949A (en) Polymers prepared from 4,4'-bis[2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl]diphenyl ether
FR2628112A1 (fr) Resines thermoresistantes et photosensibles de polyamide aromatique et procede pour leur preparation
US4914181A (en) Polyimides, a process for their preparation and their use, and tetracarboxylic acids and tetracarboxylic acid derivatives
US4714669A (en) Radiation-sensitive polycondensates, their preparation, material coated therewith and the use thereof
JPH07242744A (ja) 低応力膜を与える組成物
JP3132736B2 (ja) 感光性樹脂の製造方法
JPH0558007B2 (enrdf_load_stackoverflow)
JP4048598B2 (ja) 感光性ポリイミド前駆体組成物および金属箔−ポリイミド複合体