JPS61287138A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61287138A
JPS61287138A JP60128729A JP12872985A JPS61287138A JP S61287138 A JPS61287138 A JP S61287138A JP 60128729 A JP60128729 A JP 60128729A JP 12872985 A JP12872985 A JP 12872985A JP S61287138 A JPS61287138 A JP S61287138A
Authority
JP
Japan
Prior art keywords
electrode
inner lead
semiconductor element
expanded
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60128729A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426546B2 (cs
Inventor
Yoshifumi Kitayama
北山　喜文
Yukio Maeda
幸男 前田
Yoshio Tsunesumi
常住　美夫
Tsutomu Tsunoda
勉 角田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60128729A priority Critical patent/JPS61287138A/ja
Publication of JPS61287138A publication Critical patent/JPS61287138A/ja
Publication of JPH0426546B2 publication Critical patent/JPH0426546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60128729A 1985-06-13 1985-06-13 半導体装置 Granted JPS61287138A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60128729A JPS61287138A (ja) 1985-06-13 1985-06-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60128729A JPS61287138A (ja) 1985-06-13 1985-06-13 半導体装置

Publications (2)

Publication Number Publication Date
JPS61287138A true JPS61287138A (ja) 1986-12-17
JPH0426546B2 JPH0426546B2 (cs) 1992-05-07

Family

ID=14992003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60128729A Granted JPS61287138A (ja) 1985-06-13 1985-06-13 半導体装置

Country Status (1)

Country Link
JP (1) JPS61287138A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5027995A (en) * 1988-08-31 1991-07-02 Siemens Aktiengesellschaft Process for bonding semiconductor chips to substrates
US5504375A (en) * 1992-03-02 1996-04-02 International Business Machines Corporation Asymmetric studs and connecting lines to minimize stress

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5027995A (en) * 1988-08-31 1991-07-02 Siemens Aktiengesellschaft Process for bonding semiconductor chips to substrates
US5504375A (en) * 1992-03-02 1996-04-02 International Business Machines Corporation Asymmetric studs and connecting lines to minimize stress

Also Published As

Publication number Publication date
JPH0426546B2 (cs) 1992-05-07

Similar Documents

Publication Publication Date Title
JPS61125062A (ja) ピン取付け方法およびピン取付け装置
JP2980495B2 (ja) 半導体装置の製造方法
JPH01293626A (ja) フレキシブル配線板におけるワイヤボンディング法
JPS61287138A (ja) 半導体装置
JPS60194543A (ja) バンプ電極形成方法
JPH05267385A (ja) ワイヤーボンディング装置
JP2821777B2 (ja) フリップチップ用ｉｃ及びその製造方法
JPS6313337A (ja) 半導体素子の実装方法
JPS5815252A (ja) バンプ構造
JP2986661B2 (ja) 半導体装置の製造方法
JPH0428241A (ja) 半導体装置の製造方法
JP2000150756A (ja) 樹脂封止型半導体装置及びリードフレーム
JPS6388833A (ja) テ−プキヤリヤ実装テ−プ
KR0157892B1 (ko) 칩 사이즈 반도체 패키지 및 그 제조방법
JPS61125028A (ja) 半導体装置
JPS6379331A (ja) ワイヤボンデイング装置
JP2730304B2 (ja) 半導体装置
JP2001176917A (ja) 半導体装置およびその製造方法
JPH04299544A (ja) フィルムキャリヤ半導体装置の製造方法
JP3550946B2 (ja) Ｔａｂ型半導体装置
JPS6386442A (ja) Ｔａｂ用ｉｃチツプ
JPS60206035A (ja) 半導体装置の製造方法
JPS6038869B2 (ja) 半導体装置の製造方法
JPS61287136A (ja) 半導体装置
JPH01215047A (ja) 半導体チップのバンプ形成方法