JPS61283650A - 積層板用熱硬化性樹脂組成物 - Google Patents
積層板用熱硬化性樹脂組成物Info
- Publication number
- JPS61283650A JPS61283650A JP12522085A JP12522085A JPS61283650A JP S61283650 A JPS61283650 A JP S61283650A JP 12522085 A JP12522085 A JP 12522085A JP 12522085 A JP12522085 A JP 12522085A JP S61283650 A JPS61283650 A JP S61283650A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- paper
- added
- copper
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 38
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000009472 formulation Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 15
- 239000004332 silver Substances 0.000 abstract description 15
- 230000005012 migration Effects 0.000 abstract description 14
- 238000013508 migration Methods 0.000 abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 13
- BDYUSDIJIDGWCY-UHFFFAOYSA-N NN-Dimethyllauramide Chemical compound CCCCCCCCCCCC(=O)N(C)C BDYUSDIJIDGWCY-UHFFFAOYSA-N 0.000 abstract description 5
- 235000014113 dietary fatty acids Nutrition 0.000 abstract description 4
- QKIUAMUSENSFQQ-UHFFFAOYSA-N dimethylazanide Chemical compound C[N-]C QKIUAMUSENSFQQ-UHFFFAOYSA-N 0.000 abstract description 4
- 229930195729 fatty acid Natural products 0.000 abstract description 4
- 239000000194 fatty acid Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 150000004665 fatty acids Chemical class 0.000 abstract description 3
- GAXDEROCNMZYCS-QXMHVHEDSA-N (z)-n,n-dimethyloctadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)N(C)C GAXDEROCNMZYCS-QXMHVHEDSA-N 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- -1 unsaturated fatty acid dimethylamides Chemical class 0.000 abstract description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 21
- 239000002966 varnish Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000003378 silver Chemical class 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12522085A JPS61283650A (ja) | 1985-06-11 | 1985-06-11 | 積層板用熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12522085A JPS61283650A (ja) | 1985-06-11 | 1985-06-11 | 積層板用熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61283650A true JPS61283650A (ja) | 1986-12-13 |
| JPH0471408B2 JPH0471408B2 (enrdf_load_stackoverflow) | 1992-11-13 |
Family
ID=14904819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12522085A Granted JPS61283650A (ja) | 1985-06-11 | 1985-06-11 | 積層板用熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61283650A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8980770B2 (en) | 2006-11-06 | 2015-03-17 | Hexcel Composites Limited | Composite materials |
-
1985
- 1985-06-11 JP JP12522085A patent/JPS61283650A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8980770B2 (en) | 2006-11-06 | 2015-03-17 | Hexcel Composites Limited | Composite materials |
| US9603229B2 (en) | 2006-11-06 | 2017-03-21 | Hexcel Composites Limited | Composite materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0471408B2 (enrdf_load_stackoverflow) | 1992-11-13 |
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