JPS61283650A - Thermosetting resin composition for laminated sheet - Google Patents
Thermosetting resin composition for laminated sheetInfo
- Publication number
- JPS61283650A JPS61283650A JP12522085A JP12522085A JPS61283650A JP S61283650 A JPS61283650 A JP S61283650A JP 12522085 A JP12522085 A JP 12522085A JP 12522085 A JP12522085 A JP 12522085A JP S61283650 A JPS61283650 A JP S61283650A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- paper
- added
- copper
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、銀の移行現象の発生しＣ二くい（以下、′耐
銀移行性Ｃ二優れた″と称する）印刷回路配線板用紙基
材エポキシ樹脂銅張積層板の製造Ｃ：用いられる積層板
用熱硬化性樹脂組成物に関するものである。Detailed Description of the Invention [Industrial Field of Application] The present invention provides a printed circuit wiring board paper substrate with excellent silver migration resistance (hereinafter referred to as ``C2 excellent silver migration resistance''). Production of epoxy resin copper-clad laminate C: This relates to the thermosetting resin composition for laminates used.
従来、印刷回路配線板用紙基材エポキシ樹脂銅張積層板
は、エポキシ樹脂配合物ワニスをクラフト紙またはリン
ター紙等に含浸乾燥させ、該含浸紙を複数枚積層し、用
途に応じてこの片面又は両面（：接着剤付銅箔な加えた
後、加熱加圧成形されて製造されている。Conventionally, paper-based epoxy resin copper-clad laminates for printed circuit wiring boards are produced by impregnating and drying kraft paper or linter paper with an epoxy resin compound varnish, then laminating a plurality of sheets of the impregnated paper. Both sides (copper foil with adhesive) are added and then heated and pressure molded.
しかるＣ二、この上５（ニして得られた紙基材エポキシ
樹脂銅張板は、温湿度条件下において積層板表面上（＝
形成された銀電極間！−電界を加えると、所定時間の経
過後、銀の移行現象が発生することは、良く知られてい
る。However, the paper-based epoxy resin copper-clad board obtained by C2 and above 5 (D) has the following effect on the surface of the laminate under temperature and humidity conditions:
Between the formed silver electrodes! - It is well known that when an electric field is applied, a silver migration phenomenon occurs after a certain period of time.
この銀の移行現象を電気化学的に解析する試みは、数多
く行なわれており、絶縁材料による銀の移行現象の差異
Ｃ；ついても指摘されているが、紙基材エポキシ樹脂銅
張積層板は５紙基材フェノール樹脂銅張積層板とともに
、極めて銀の移行現象が発生し易いものとして位置づけ
られている。Many attempts have been made to electrochemically analyze this silver migration phenomenon, and it has been pointed out that there are differences in the silver migration phenomenon depending on the insulating material, but paper-based epoxy resin copper-clad laminates 5 Paper-based phenolic resin copper-clad laminates are considered to be extremely susceptible to silver migration.
しかる（＝近年の印刷回路配線板の高密度化に伴い信頼
性の確保は！要な課題であるが、この銀の移行現象は印
刷回路配線板にとって致命的欠陥となり得る要素をもっ
ているため、印刷回路配線板の生産段階において、銀の
移行現象を抑制し得る各種の処理が試みられ、また現実
に実施されているが、積層板の本質的特性に依存する部
分が強く、耐銀移行性に優れた紙基材エポキン樹脂銅張
積層板が必要とされるものである。However, as the density of printed circuit wiring boards has increased in recent years, ensuring reliability is an important issue.However, this silver migration phenomenon has an element that can be a fatal defect for printed circuit wiring boards, so printing At the production stage of circuit wiring boards, various treatments that can suppress the silver migration phenomenon have been tried and actually implemented, but they largely depend on the essential characteristics of the laminate, and the silver migration resistance has not been improved. What is needed is a superior paper-based Epoquine resin copper clad laminate.
本発明者らは、紙基材エポキン樹脂銅張積層板表面の銀
の移行について詳細な検討を加えた結果。The present inventors conducted a detailed study on the migration of silver on the surface of a paper-based Epoquine resin copper-clad laminate.
エポキシ樹脂組成物の紙基材への含浸性が大きな要因を
有していることを見い出している。It has been found that the impregnability of the epoxy resin composition into the paper base material is a major factor.
このような紙への含浸性を向上させる手段としては２回
塗りが良く知られているところであるが。Two-coat coating is well known as a means of improving the impregnating properties of such paper.
作業能率の低下、使用原材料の増加等のほか、得られた
銅張積層板特性の点でも１機械特性等の低下が見られ好
ましくない。In addition to a decrease in work efficiency and an increase in the amount of raw materials used, it is also undesirable to see a decrease in the mechanical properties of the resulting copper-clad laminate.
本発明は、以上のような問題点を改善し、耐銀移行性（
＝優れた紙基材エポキシ樹脂銅張積層板を１回塗り（＝
よって得ることのできる積層板用熱硬化性樹脂を提供す
ることを目的とする。The present invention improves the above problems and improves silver migration resistance (
= One coat of superior paper-based epoxy resin copper-clad laminate (=
Therefore, an object of the present invention is to provide a thermosetting resin for laminates that can be obtained.
本発明は、紙基材エポキシ樹脂銅張積層板（＝用いられ
るエポキシ樹脂配合物に、
（但し、ｎ＝５〜２０．ｍ＝２ｎ＋１又はｍ＝２ｎ−１
）なる化合物（Ｉ）を添加することを特徴とする積層板
用熱硬化性樹脂組成物である。The present invention provides a paper-based epoxy resin copper-clad laminate (=the epoxy resin compound used (where n=5 to 20, m=2n+1 or m=2n-1
) is a thermosetting resin composition for a laminate, which is characterized by adding compound (I).
本発明の熱硬化性樹脂組成物に用いられるエポキシ樹脂
配合物は、エポキン樹脂（ａ）と硬化剤（ｂ）を所定の
割合で配合したものであり、必要に応じてこれ（：硬化
促進剤（Ｃ）を加えたものを使用することも可能である
。The epoxy resin compound used in the thermosetting resin composition of the present invention is a mixture of epoxy resin (a) and curing agent (b) in a predetermined ratio, and if necessary, this (: curing accelerator) It is also possible to use one in which (C) is added.
エポキシ樹脂（ａ）、硬化剤（ｂ）、硬化促進剤（Ｃ）
の種類及び使用量は、目的Ｃ二よって種々変えることが
でき、これらを限定すること（：格別の意義はない。Epoxy resin (a), curing agent (b), curing accelerator (C)
The type and amount used can be varied depending on the purpose C2, and there is no particular significance in limiting them.
また、化合物（Ｉ）としては、ラウリン酸ジメチルアミ
ド、オレイン酸ジメチルアミド等の飽和脂肪酸、又は不
飽和脂肪酸のジメチルアミドが用いられる。Moreover, as the compound (I), saturated fatty acids such as lauric acid dimethylamide and oleic acid dimethylamide, or dimethylamide of unsaturated fatty acids are used.
これらの脂肪酸ジメチルアミドは、エポキシ樹脂配合物
との親和性が良く、またエポキシ樹脂配合物ワニスに添
加することにより、エポキシ樹脂配合物ワニスの粘度を
大幅（：下げる効果を有している。These fatty acid dimethylamides have good affinity with epoxy resin blends, and when added to epoxy resin blend varnishes, they have the effect of significantly lowering the viscosity of the epoxy resin blend varnishes.
また脂肪酸ジメチルアミドは極性が強く、銅張積層板の
基材（＝用いられるリンター紙やクラフト紙等の繊維質
基材とも親和性が良いため、脂肪酸ジメチルアミドをエ
ポキシ樹脂配合物（＝添加した場合、脂肪酸ジメチルア
ミドを添加していないエポキシ樹脂配合物（＝比べ格段
に高度の含浸性を賦与することができるものである。In addition, fatty acid dimethylamide has strong polarity and has good affinity with the fibrous base materials such as linter paper and kraft paper used in copper-clad laminates. In this case, it is possible to impart a much higher degree of impregnating property than an epoxy resin formulation to which fatty acid dimethylamide is not added.
エポキシ樹脂配合物ワニスに対する化合物（Ｉ）の添加
量は、固型分換算にてエポキシ樹脂（ａ） １００重量
部に対し、０．１乃至１０重量部、好ましくは、０．３
乃至６重量部である。The amount of compound (I) added to the epoxy resin blend varnish is 0.1 to 10 parts by weight, preferably 0.3 parts by weight, per 100 parts by weight of the epoxy resin (a) in terms of solid content.
6 parts by weight.
化合物α）の添加量が０．１ｔｔ部（：満たない場合所
望の含浸効果をあげることができず、また１０重量部を
越えると含浸効果は一定限度以上はあがらず、一方積層
板にした場合の特性低下が見られ好ましくない。If the amount of compound α) added is less than 0.1tt part (:), the desired impregnating effect cannot be achieved, and if it exceeds 10 parts by weight, the impregnating effect will not increase beyond a certain limit.On the other hand, if it is made into a laminate This is not preferable because the characteristics of the product are deteriorated.
上述のよう（＝、本発明の積層板用樹脂組成物は紙基材
への含浸性を従来のエポキシ樹脂配合物に比べ著しく向
上させることができる。従って該樹脂組成物の含浸紙を
積層し、加熱加圧成形した紙基材エポキシ樹脂銅張積層
板に高度の耐銀移行性を賦与することができるものであ
る。As mentioned above (=, the resin composition for laminates of the present invention can significantly improve the impregnating property to paper base materials compared to conventional epoxy resin formulations. Therefore, it is possible to laminate paper impregnated with the resin composition. , it is possible to impart a high degree of silver migration resistance to a paper-based epoxy resin copper-clad laminate that has been molded under heat and pressure.
市販のエポキン樹脂エピコート１０４５（シェル化学製
） １００部をメチルエチルケトン２５部に溶解して樹
脂液（Ａ）を得た。A resin liquid (A) was obtained by dissolving 100 parts of a commercially available Epoquin resin Epicoat 1045 (manufactured by Shell Chemical) in 25 parts of methyl ethyl ketone.
また、ジンアンジアミド４．５部をメチルセロソル１４
０部（＝溶解して溶液（Ｂ）を得た。更に２−エチルー
４−メチルイミダゾール０．１部をメチルセロソルブ１
部Ｃ：溶解して溶液（ｑを得た。この樹脂液（５）、溶
液（Ｂ）、溶液（Ｃ）を混合攪拌することにより、エポ
キシ樹脂配合物ワニス（Ｄ） １７０．６部を碍た。In addition, 4.5 parts of diandiamide was added to 14 parts of methyl cellosol.
0 parts (=dissolved to obtain solution (B).Additionally, 0.1 part of 2-ethyl-4-methylimidazole was added to 1 part of methyl cellosolve.
Part C: Dissolved to obtain solution (q). By mixing and stirring the resin liquid (5), solution (B), and solution (C), 170.6 parts of epoxy resin compound varnish (D) was added. Ta.
次いでこのエポキシ樹脂配合物ワニス（Ｄ） １７０．
６部（＝ラウリン酸ジメチルアミドを１％部添加して攪
拌、混合し、所望のエポキシ樹脂組成物の）を得た。Then this epoxy resin blend varnish (D) 170.
6 parts (=1% part of lauric acid dimethylamide was added and stirred and mixed to obtain a desired epoxy resin composition).
このエポキン樹脂組成物の）を厚さ０．２１ｔｍの混抄
紙（：含浸・乾燥して、樹脂付着率４５％の含浸紙を得
た。A mixed paper having a thickness of 0.21 tm was impregnated with this Epoquine resin composition and dried to obtain impregnated paper with a resin adhesion rate of 45%.
次いで、この含浸紙を８枚積層した後、厚さ０．０３５
ｇｍの接着剤付＠箔を接着剤面を含浸紙と対向させて後
、圧力１００に一１温度１７０℃で１２０分間加熱加圧
して厚さ１．６ｎの片面銅張積層板（ｅ）を得た。Next, after laminating 8 sheets of this impregnated paper, a thickness of 0.035
After placing GM's adhesive @ foil with the adhesive side facing the impregnated paper, heat and press at a pressure of 100°C and a temperature of 170°C for 120 minutes to form a single-sided copper-clad laminate (e) with a thickness of 1.6 nm. Obtained.
実施例２
実施例１と同様（−してエポキシ樹脂配合物ワニスの）
１７０．６部を得た後、これにラウリン酸ジメチルア
ミドを６季番部添加して攪拌・混合し所望のエポキシ樹
脂組成物促）を得た。Example 2 Same as Example 1 (with epoxy resin compound varnish)
After obtaining 170.6 parts, 6 parts of lauric acid dimethylamide were added thereto and stirred and mixed to obtain a desired epoxy resin composition.
このエポキシ樹脂組成物（Ｆ′）を用いて、以下実施例
１と同様にして厚さ１．６順の片面銅張板（ｆ）を碍た
。Using this epoxy resin composition (F'), single-sided copper-clad boards (f) having a thickness of 1.6 mm were prepared in the same manner as in Example 1.
比較例１
実施例１と同様にしてエポキシ樹脂配合物ワニス（Ｄ）
１７０．６部を得た後、これにラウリン酸ジメチルアミ
ドをｏ、ｏ ｓ ＠４部添加してエポキン樹脂組成物０
）を得た。Comparative Example 1 Epoxy resin compound varnish (D) was prepared in the same manner as in Example 1.
After obtaining 170.6 parts, o, o s @4 parts of lauric acid dimethylamide was added to this to obtain an Epoquine resin composition of 0.
) was obtained.
このエポキシ樹脂組成物ｐ）を用いて、以下実施例１と
同様（ニして、厚さ１．６Ｂの片面銅張板（ｇ）を得た
。Using this epoxy resin composition p), a single-sided copper-clad board (g) having a thickness of 1.6 B was obtained in the same manner as in Example 1 (d).
比較例２
実施例１と同様（ニして、エポキシ樹脂配合物ワニス（
Ｄ）１７０．６部を得た後、これを用いて以下実施例と
同様（＝シて厚さ１．６闘の片面銅張板（ｄ）を得た。Comparative Example 2 Same as Example 1 (but with epoxy resin compound varnish (
D) After obtaining 170.6 parts, this was used to obtain a single-sided copper-clad plate (d) having a thickness of 1.6 mm in the same manner as in the example below.
Claims (2)
エポキシ樹脂配合物に、 一般式 ▲数式、化学式、表等があります▼ （但し、ｎ＝５〜２０、ｍ＝２ｎ＋１又はｍ＝２ｎ−１
）なる化合物（ I ）を添加することを特徴とする積層
板用熱硬化性樹脂組成物。(1) Epoxy resin formulations containing epoxy resin (a) and curing agent (b) have general formulas ▲mathematical formulas, chemical formulas, tables, etc.▼ (However, n = 5 to 20, m = 2n + 1 or m = 2n-1
) A thermosetting resin composition for laminates, characterized in that the compound (I) is added thereto.
対し０．１〜１０重量％である特許請求の範囲第１項記
載の積層板用熱硬化性樹脂組成物。(2) The thermosetting resin composition for a laminate according to claim 1, wherein the amount of compound (I) added is 0.1 to 10% by weight based on the epoxy resin (a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12522085A JPS61283650A (en) | 1985-06-11 | 1985-06-11 | Thermosetting resin composition for laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12522085A JPS61283650A (en) | 1985-06-11 | 1985-06-11 | Thermosetting resin composition for laminated sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61283650A true JPS61283650A (en) | 1986-12-13 |
| JPH0471408B2 JPH0471408B2 (en) | 1992-11-13 |
Family
ID=14904819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12522085A Granted JPS61283650A (en) | 1985-06-11 | 1985-06-11 | Thermosetting resin composition for laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61283650A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8980770B2 (en) | 2006-11-06 | 2015-03-17 | Hexcel Composites Limited | Composite materials |
-
1985
- 1985-06-11 JP JP12522085A patent/JPS61283650A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8980770B2 (en) | 2006-11-06 | 2015-03-17 | Hexcel Composites Limited | Composite materials |
| US9603229B2 (en) | 2006-11-06 | 2017-03-21 | Hexcel Composites Limited | Composite materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0471408B2 (en) | 1992-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61283650A (en) | Thermosetting resin composition for laminated sheet | |
| JPS5929604B2 (en) | Manufacturing method of laminates | |
| JPH0138136B2 (en) | ||
| JPS6072931A (en) | Production of paper-base phenolic resin laminate | |
| DE2427673B2 (en) | HEAT RELEASING, ELECTRICALLY INSULATING SUBSTRATE PLATE | |
| JP2604846B2 (en) | Manufacturing method of laminated board | |
| JPS597044A (en) | Laminated board | |
| JP3243027B2 (en) | Copper clad laminate | |
| JPS6026706B2 (en) | Epoxy resin copper clad laminate | |
| JPS61143463A (en) | Thermosetting resin composition for laminate | |
| JPS62292428A (en) | Copper-lined laminated board | |
| JPH02160998A (en) | Raw material for electrical insulation laminate | |
| JPH0116255B2 (en) | ||
| JPS63125516A (en) | Production of epoxy resin | |
| JPS63168439A (en) | Epoxy resin composition for laminated sheet | |
| JPS6330538A (en) | Production of laminated sheet | |
| JPH0192237A (en) | Production of copper-clad laminated sheet | |
| JPH02311522A (en) | Laminating resin composition | |
| JPS6115889B2 (en) | ||
| JPS5831746A (en) | Copper lined laminated board | |
| JPS63312832A (en) | Copper-clad epoxy resin laminate | |
| JPS5957744A (en) | Flame-retarded unsaturated polyester resin-copper lined lam-inated board and its manufacture | |
| JPH02311518A (en) | Laminating resin composition | |
| JPH0313258B2 (en) | ||
| JPH03140355A (en) | Thermosetting resin composition for laminate |