JPS6127091Y2 - - Google Patents
Info
- Publication number
- JPS6127091Y2 JPS6127091Y2 JP1981113567U JP11356781U JPS6127091Y2 JP S6127091 Y2 JPS6127091 Y2 JP S6127091Y2 JP 1981113567 U JP1981113567 U JP 1981113567U JP 11356781 U JP11356781 U JP 11356781U JP S6127091 Y2 JPS6127091 Y2 JP S6127091Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- pin
- circuit board
- solder
- adhesion prevention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 230000002265 prevention Effects 0.000 claims description 24
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 15
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113567U JPS5819473U (ja) | 1981-07-30 | 1981-07-30 | プリント基板用ピン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113567U JPS5819473U (ja) | 1981-07-30 | 1981-07-30 | プリント基板用ピン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5819473U JPS5819473U (ja) | 1983-02-05 |
| JPS6127091Y2 true JPS6127091Y2 (enExample) | 1986-08-13 |
Family
ID=29907866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981113567U Granted JPS5819473U (ja) | 1981-07-30 | 1981-07-30 | プリント基板用ピン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5819473U (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11167944A (ja) * | 1997-10-03 | 1999-06-22 | Fujitsu Ltd | 基板間接続用の半田ダム付きｉ／ｏピン |
-
1981
- 1981-07-30 JP JP1981113567U patent/JPS5819473U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5819473U (ja) | 1983-02-05 |
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