CA1167127A - Electrical connector structure and method of manufacture - Google Patents
Electrical connector structure and method of manufactureInfo
- Publication number
- CA1167127A CA1167127A CA000419497A CA419497A CA1167127A CA 1167127 A CA1167127 A CA 1167127A CA 000419497 A CA000419497 A CA 000419497A CA 419497 A CA419497 A CA 419497A CA 1167127 A CA1167127 A CA 1167127A
- Authority
- CA
- Canada
- Prior art keywords
- connector
- elongated
- anchor portion
- electrically conductive
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
ELECTRICAL CONNECTOR STRUCTURE AND METHOD OF MANUFACTURE
Abstract of the Disclosure An electrical connector includes an elongated contact portion extending from an anchor portion having a plurality of ribs or protrusions in an interference fit in a PCB plated through hole. The plated through hole is tinned and air knife squeegeed before insertion of the anchor portion. Thereafter it is fluxed via conduits defined by the periphery of the plated through hole and the ribs in the anchor portion.
The electrical connector is soldered into the hole by solder reflow which in one example is accomplished by exposing the PCB to radiant energy within the infrared and visible spectrums. The solder becomes concentrated, during reflow, into fillets adjacent the wall of the plated through hole and a terminating surface of each of the ribs such that solder contamination of the elongated contact portion is avoided.
-i-
Abstract of the Disclosure An electrical connector includes an elongated contact portion extending from an anchor portion having a plurality of ribs or protrusions in an interference fit in a PCB plated through hole. The plated through hole is tinned and air knife squeegeed before insertion of the anchor portion. Thereafter it is fluxed via conduits defined by the periphery of the plated through hole and the ribs in the anchor portion.
The electrical connector is soldered into the hole by solder reflow which in one example is accomplished by exposing the PCB to radiant energy within the infrared and visible spectrums. The solder becomes concentrated, during reflow, into fillets adjacent the wall of the plated through hole and a terminating surface of each of the ribs such that solder contamination of the elongated contact portion is avoided.
-i-
Description
~bi7~
The invention is in the field of electrical connectors and more particularly relates to an electrical connector structure and method of manufacture of same.
In large electronic systems it is well known to support various circuit boards in a shelf or frame and to provide interconnections between the various circuit boards by means of appropriate connectors and back plane wiring. The back plane wiring may itself be provided by a back plane printed circuit board mounted to one side of the shelt. In addition to carrying conductor paths the back plane printed circuit board also includes connector pins. Each of the connector pins is fixed at a predetermined location and includes a male element protruding from one side of the back plane printed circuit for connection to a circuit board which carries a corresponding female receptacle. Manufacture of these back plane printed circuit boards is similar to that of most circuit boards. Components, in this case connector pins, are inserted into plated through holes in the printed circuit board to provide an intermediate assembly. Thereafter the assembly is ~ypically machine wave soldered to obtain a final assembly. In order to avoid contaminating precious metal plated pin contact surfaces, the solder wave is contacted with the side of the board away from the protruding pins. Solder from the wave migrates through the plated through holes by capilliary action preferably filling all voids whereby acceptably reliable back plane structures for electronic systems are obtained.
More recently the shelves in electronic systems have been arranged back to back, to reduce the building space required to house such systems and also to reduce the length of interconnecting circuit paths.
To accommodate this new arrangement, back plane wiring printed circuit ~ 7 ~t~
boards have been required to include connector pins protruding from both sides of the board. Circuit boards of this type might be more precisely termed middle plane wiring boards. Unfortunately this structure is not directly wave solderable without contaminating the connnector pins on one of the two sides of the board. At First, manually performed hand soldering was the only means by which suitable middle plane wiring circuit boards were manufactured for the electronic system with back to back shelves.
At least two alternative methods to hand soldering in the production of middle plane circui-t boards have been developed. One involves wave soldering in the typical manner after connector pins protruding from the solder exposure side oF the board have been coated with a solder resist compound. The other involves a placement of a preformed ring of solder over each pin location on one side of the board followed by submersion of the board into a hot oil bath to achieve a reflow soldering. Both these me~hods have proven to be somewhat unreliable and hence expensive. In the first method, various solder resist compounds were tried with various degrees of success. However in manufacturing none of the solder resists consistently provided adequate protection of precious metal surfaces of the connector pin. The second method has consistently produced more acceptable results than the first method. However it relies on hand labour to place each of the solder rings before the step of oil bath reFlow soldering. As such it has proven to be only a minor cost saving in comparison to purely manual hand soldering.
The invention provides for a middle plane wiring board structure and method of manufacture which are of similar cost and ~ ~r~
reliability as compared to typical back plane wiring board structures and manufacturing methods.
In accordance with the invention an electrical connector includes an electrically conductive connector element anchored in a substrate. The electrically conductive connector element includes an anchor portion having a body and a plurality of protrusions extending from the body. The substrate includes an opening therethrough being defined by a metallic side wall. The anchor portion resides in the opening with at least one of the terminating surfaces lying against the metallic side wall. Solder fillets are contiguous with portions of the protrusion and the metallic side wall. The metallic side wall, the solder fillets, and the protrusions in combination define a fluid flowable conduit through the substrate.
A method in accordance with the invention for manufacturing an electrical connector includes providing an insulating substrate having a hole formed therethrough, the hole being defined by a metallic peripheral wall. An electrically conductive connector element is provided wherein an anchor portion of the connector element includes a body and a plurality of protrusions extending from the body and being so spaced as to achieve an interference fit with the peripheral wall upon insertion of the anchor portion into the hole. The metallic peripheral wall is tinned with a solder material and squeegeed to remove all but a substantially uniform thickness of the solder material. The peripheral wall is cooled to less than a fusion temperature of the solder rnaterial whereafter the anchor portion is inserted into the hole providing an intermediate assembly wherein a fluid flowable conduit is defined between the peripheral wall and the protrusion. A solder fluxing agent is applied by way of the .
~ J~
conduit and the electrically conductive element and the peripheral wall are heated to a -temperature above the fusion temperature whereby a solder fillet is formed between each of the protrusions and the peripheral wall to provide a finished assembly.
An example embodiment is described with reference to the accompanying drawings in which:
Figure 1 is a simplified pictorial illustration of a middle plane wiring board;
Figure 2 is a side elevational view of an electrically conductive connector element used in the middle plane wiring board in figure 1 in accordance with the lnvention;
Figure 3 is a sectional side elevation of an opening in the middle plane wiring board suitable for receiving the connector element in figure 2;
Figure 4 is a sectional plan view taken through the middle plane wiring board illustrating an intermediate assembly of the electrically conductive connector element in figure 2 after insertion into a hole in the wiring board as illustrated in figure 3; and Figure 5 is a sectional plan view similar to figure 4 and in contrast to figure 4 illustrates a final assembly achieved in the middle plane wiring board by reflow soldering.
Referring to figure 1, the middle plane wiring board includes an insulating substrate 10. The substrate 10 is provided by any convenient material known for this purpose by persons skilled in the manufacture of printed circuit boards (PCBs). Very briefly in the manufacture of the PCB, metallic land areas are formed on the substrate at each location at which an electrically conductive connector element 20 is ., .
.. , 4~ 3'~
required. The land areas are drilled or punched out to form holes through the substrate. Thereafter the holes are plated with a conductive material, for example copper, so that each hole is defined by a metallic peripheral wall which connec-ts the land area on one side of the substrate with the corresponding land area on the other side of the substrate.
It is common practice to insert the connector elements 20 such that each is retained by an interference fit. Thereafter at least one side of -the PCB is subjected to a soldering process l;o firmly fix the connector elements 20. The PCB in figure 1 as thus far discussed is exemplary of commonly practiced manufacturing methods in the electronic industry.
However as previously mentioned, typical machine process soldering methods are not conveniently applicable in the case where the connector elements 20 protrude on both sides of the substrate 10, as in the case of the middle plane wiring board in figure 1.
Figures 2 - 5 of the drawings are in substance scale representations of the example embodiment magnified about 74 times for convenience of illustration.
In figure 2 the connector element 20 is shown to have an anchor portion 22 with contact portions 21 of rectangular cross-section extending therefrom. The contact portions 21 are broken for convenience of illustration. The anchor portion 22 includes a body 23 and protruding ribs 24, 25, 26 and 27, extending therefrom to respective terminating surfaces 24a, 25a~ 26a and 27a. The rib 27 and its terminating surf`ace are hidden from view in figure 2 but are visible in cross-section with reference to figure 4. Connector elements similar to that in figure 2 are commonly used in the electronic industry.
' ' "''.' ' . ' ' . .
7~ 7 A novel structure wherein substantially only the terminating surfaces of the ribs are joined to the metallic peripheral wall is achieved in accordance with the invention. Figure 3 illustrates in detail a hole structured at 11 in the substrate 10. To obtain the hole structure substrate material 12 and copper land areas 15 and 16 are drilled. The land areas and the peripheral wall are then copper plated to obtain a plated through hole structure defined by a copper peripheral wall 13. The copper wall 13 is then tinned to have a thin solder covering 14.
In one example the process of tinning includes steps of submerging the PCB into molten solder. The PCB is then withdrawn from the molten solder by way of an air blast squeegeeing apparatus, sometimes referred to as an air knife9 which removes all but a very thin layer of solder from the copper. For example in a case where a plated through hole is of a diameter of between 0.03 and 0.05 inches, a solder layer of about 0.001 inches is satisfactory. After the PCB has cooled to below the fusion temperature of the solder, the connector element 20 is inserted such that the anchor portion is in interference fit with the copper wall 13. Figure 4 illustrates a typical cross-section view of an intermediate assembly of the connector element in the hole 11~ The terminating surfaces 24a, 25a, 26a and 27a are all in substantially gas tight contact with the copper wall 13, the solder coating 14 in the contact area having been stripped away during insertion, and the copper wall and the substrate material adjacent each of the terminating surfaces having yielded slightly to accommodate the anchor portion. At this point in the assembly method four clear conduits 11a, 11b, llc and 11d are defined by the solder layer 14 and the anchor portion 22. The final steps in the assembly process are that of fluxing and reflow soldering~ Fluxing is achieved by any convenient means which will cause a solder flux material to flow into the conduits 11a - 11d either at the moment of flux application or later during the reflow soldering step. The reflow soldering step may be accomplished by any of various heating methods which cause the temperature of the plate through hole and the connector element 20 to exceed the fusion temperature oF the solder material. For example exposure of the PCB, while in a substantially calm or stagnant atmosphere, to radiant energy in arange extendiny through the infrared and visible spectrums has been found to produce a very satisfactory solder reflow, obtaining a structure similar to the structure illustrated in figure 5.
Here the solder layer 14 is shown to have virtually disappeared, having been concentrated into solder fillets 18 which firmly attach the protruding ribs 24 - 27 to the copper wall 13. Substantially all the solder present is concentrated in the fillets 18, leaving the contact surfaces of the contact element 21 without solder contamination, and typically leaving all of the conduits 11a - 11d substantially intact.
: 7 ,
The invention is in the field of electrical connectors and more particularly relates to an electrical connector structure and method of manufacture of same.
In large electronic systems it is well known to support various circuit boards in a shelf or frame and to provide interconnections between the various circuit boards by means of appropriate connectors and back plane wiring. The back plane wiring may itself be provided by a back plane printed circuit board mounted to one side of the shelt. In addition to carrying conductor paths the back plane printed circuit board also includes connector pins. Each of the connector pins is fixed at a predetermined location and includes a male element protruding from one side of the back plane printed circuit for connection to a circuit board which carries a corresponding female receptacle. Manufacture of these back plane printed circuit boards is similar to that of most circuit boards. Components, in this case connector pins, are inserted into plated through holes in the printed circuit board to provide an intermediate assembly. Thereafter the assembly is ~ypically machine wave soldered to obtain a final assembly. In order to avoid contaminating precious metal plated pin contact surfaces, the solder wave is contacted with the side of the board away from the protruding pins. Solder from the wave migrates through the plated through holes by capilliary action preferably filling all voids whereby acceptably reliable back plane structures for electronic systems are obtained.
More recently the shelves in electronic systems have been arranged back to back, to reduce the building space required to house such systems and also to reduce the length of interconnecting circuit paths.
To accommodate this new arrangement, back plane wiring printed circuit ~ 7 ~t~
boards have been required to include connector pins protruding from both sides of the board. Circuit boards of this type might be more precisely termed middle plane wiring boards. Unfortunately this structure is not directly wave solderable without contaminating the connnector pins on one of the two sides of the board. At First, manually performed hand soldering was the only means by which suitable middle plane wiring circuit boards were manufactured for the electronic system with back to back shelves.
At least two alternative methods to hand soldering in the production of middle plane circui-t boards have been developed. One involves wave soldering in the typical manner after connector pins protruding from the solder exposure side oF the board have been coated with a solder resist compound. The other involves a placement of a preformed ring of solder over each pin location on one side of the board followed by submersion of the board into a hot oil bath to achieve a reflow soldering. Both these me~hods have proven to be somewhat unreliable and hence expensive. In the first method, various solder resist compounds were tried with various degrees of success. However in manufacturing none of the solder resists consistently provided adequate protection of precious metal surfaces of the connector pin. The second method has consistently produced more acceptable results than the first method. However it relies on hand labour to place each of the solder rings before the step of oil bath reFlow soldering. As such it has proven to be only a minor cost saving in comparison to purely manual hand soldering.
The invention provides for a middle plane wiring board structure and method of manufacture which are of similar cost and ~ ~r~
reliability as compared to typical back plane wiring board structures and manufacturing methods.
In accordance with the invention an electrical connector includes an electrically conductive connector element anchored in a substrate. The electrically conductive connector element includes an anchor portion having a body and a plurality of protrusions extending from the body. The substrate includes an opening therethrough being defined by a metallic side wall. The anchor portion resides in the opening with at least one of the terminating surfaces lying against the metallic side wall. Solder fillets are contiguous with portions of the protrusion and the metallic side wall. The metallic side wall, the solder fillets, and the protrusions in combination define a fluid flowable conduit through the substrate.
A method in accordance with the invention for manufacturing an electrical connector includes providing an insulating substrate having a hole formed therethrough, the hole being defined by a metallic peripheral wall. An electrically conductive connector element is provided wherein an anchor portion of the connector element includes a body and a plurality of protrusions extending from the body and being so spaced as to achieve an interference fit with the peripheral wall upon insertion of the anchor portion into the hole. The metallic peripheral wall is tinned with a solder material and squeegeed to remove all but a substantially uniform thickness of the solder material. The peripheral wall is cooled to less than a fusion temperature of the solder rnaterial whereafter the anchor portion is inserted into the hole providing an intermediate assembly wherein a fluid flowable conduit is defined between the peripheral wall and the protrusion. A solder fluxing agent is applied by way of the .
~ J~
conduit and the electrically conductive element and the peripheral wall are heated to a -temperature above the fusion temperature whereby a solder fillet is formed between each of the protrusions and the peripheral wall to provide a finished assembly.
An example embodiment is described with reference to the accompanying drawings in which:
Figure 1 is a simplified pictorial illustration of a middle plane wiring board;
Figure 2 is a side elevational view of an electrically conductive connector element used in the middle plane wiring board in figure 1 in accordance with the lnvention;
Figure 3 is a sectional side elevation of an opening in the middle plane wiring board suitable for receiving the connector element in figure 2;
Figure 4 is a sectional plan view taken through the middle plane wiring board illustrating an intermediate assembly of the electrically conductive connector element in figure 2 after insertion into a hole in the wiring board as illustrated in figure 3; and Figure 5 is a sectional plan view similar to figure 4 and in contrast to figure 4 illustrates a final assembly achieved in the middle plane wiring board by reflow soldering.
Referring to figure 1, the middle plane wiring board includes an insulating substrate 10. The substrate 10 is provided by any convenient material known for this purpose by persons skilled in the manufacture of printed circuit boards (PCBs). Very briefly in the manufacture of the PCB, metallic land areas are formed on the substrate at each location at which an electrically conductive connector element 20 is ., .
.. , 4~ 3'~
required. The land areas are drilled or punched out to form holes through the substrate. Thereafter the holes are plated with a conductive material, for example copper, so that each hole is defined by a metallic peripheral wall which connec-ts the land area on one side of the substrate with the corresponding land area on the other side of the substrate.
It is common practice to insert the connector elements 20 such that each is retained by an interference fit. Thereafter at least one side of -the PCB is subjected to a soldering process l;o firmly fix the connector elements 20. The PCB in figure 1 as thus far discussed is exemplary of commonly practiced manufacturing methods in the electronic industry.
However as previously mentioned, typical machine process soldering methods are not conveniently applicable in the case where the connector elements 20 protrude on both sides of the substrate 10, as in the case of the middle plane wiring board in figure 1.
Figures 2 - 5 of the drawings are in substance scale representations of the example embodiment magnified about 74 times for convenience of illustration.
In figure 2 the connector element 20 is shown to have an anchor portion 22 with contact portions 21 of rectangular cross-section extending therefrom. The contact portions 21 are broken for convenience of illustration. The anchor portion 22 includes a body 23 and protruding ribs 24, 25, 26 and 27, extending therefrom to respective terminating surfaces 24a, 25a~ 26a and 27a. The rib 27 and its terminating surf`ace are hidden from view in figure 2 but are visible in cross-section with reference to figure 4. Connector elements similar to that in figure 2 are commonly used in the electronic industry.
' ' "''.' ' . ' ' . .
7~ 7 A novel structure wherein substantially only the terminating surfaces of the ribs are joined to the metallic peripheral wall is achieved in accordance with the invention. Figure 3 illustrates in detail a hole structured at 11 in the substrate 10. To obtain the hole structure substrate material 12 and copper land areas 15 and 16 are drilled. The land areas and the peripheral wall are then copper plated to obtain a plated through hole structure defined by a copper peripheral wall 13. The copper wall 13 is then tinned to have a thin solder covering 14.
In one example the process of tinning includes steps of submerging the PCB into molten solder. The PCB is then withdrawn from the molten solder by way of an air blast squeegeeing apparatus, sometimes referred to as an air knife9 which removes all but a very thin layer of solder from the copper. For example in a case where a plated through hole is of a diameter of between 0.03 and 0.05 inches, a solder layer of about 0.001 inches is satisfactory. After the PCB has cooled to below the fusion temperature of the solder, the connector element 20 is inserted such that the anchor portion is in interference fit with the copper wall 13. Figure 4 illustrates a typical cross-section view of an intermediate assembly of the connector element in the hole 11~ The terminating surfaces 24a, 25a, 26a and 27a are all in substantially gas tight contact with the copper wall 13, the solder coating 14 in the contact area having been stripped away during insertion, and the copper wall and the substrate material adjacent each of the terminating surfaces having yielded slightly to accommodate the anchor portion. At this point in the assembly method four clear conduits 11a, 11b, llc and 11d are defined by the solder layer 14 and the anchor portion 22. The final steps in the assembly process are that of fluxing and reflow soldering~ Fluxing is achieved by any convenient means which will cause a solder flux material to flow into the conduits 11a - 11d either at the moment of flux application or later during the reflow soldering step. The reflow soldering step may be accomplished by any of various heating methods which cause the temperature of the plate through hole and the connector element 20 to exceed the fusion temperature oF the solder material. For example exposure of the PCB, while in a substantially calm or stagnant atmosphere, to radiant energy in arange extendiny through the infrared and visible spectrums has been found to produce a very satisfactory solder reflow, obtaining a structure similar to the structure illustrated in figure 5.
Here the solder layer 14 is shown to have virtually disappeared, having been concentrated into solder fillets 18 which firmly attach the protruding ribs 24 - 27 to the copper wall 13. Substantially all the solder present is concentrated in the fillets 18, leaving the contact surfaces of the contact element 21 without solder contamination, and typically leaving all of the conduits 11a - 11d substantially intact.
: 7 ,
Claims (18)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An electrical connector comprising:
an electrically conductive connector element including an anchor portion having a body and a plurality of protrusions extending from the body to respective terminating surfaces;
a substrate having an electrically insulating surface and an opening therethrough being defined by a metallic side wall;
the anchor portion residing in the opening with at least one of the terminating surfaces lying against the metallic side wall and solder fillets being contiguous with the protrusions and portions of the metallic side wall adjacent the protrusion;
the metallic side wall, the solder fillets, and the protrusion in combination defining a fluid flowable conduit through the substrate.
an electrically conductive connector element including an anchor portion having a body and a plurality of protrusions extending from the body to respective terminating surfaces;
a substrate having an electrically insulating surface and an opening therethrough being defined by a metallic side wall;
the anchor portion residing in the opening with at least one of the terminating surfaces lying against the metallic side wall and solder fillets being contiguous with the protrusions and portions of the metallic side wall adjacent the protrusion;
the metallic side wall, the solder fillets, and the protrusion in combination defining a fluid flowable conduit through the substrate.
2. An electrical connector as defined in claim 1 wherein at least two of the terminating surfaces lie against the metal side wall, the solder fillets being contiguous with the protrusions and those portions of the metallic side wall adjacent thereto wherein a plurality of said conduits is defined.
3. An electrical connector as defined in claim 2 wherein the body portion is elongated, the protrusions likewise being elongated and being of such dimensions so as to cause deformation of at least one of said protrusions or the portion of the metallic side wall adjacent said protrusion.
4. An electrical connector as defined in claim 1, wherein the electrically conductive connector element includes two elongated connector portions each extending from an end of the body of the anchor portion, one of the elongated connector portions being of limited cross-sectional dimension to permit free passage of the elongated connector portion through the opening in the substrate during assembly.
5. An electrical connector as defined in claim 2, wherein the electrically conductive connector element includes two elongated connector portions each extending from an end of the body of the anchor portion, one of the elongated connector portions being of limited cross-sectional dimension to permit free passage of the elongated connector portion through the opening in the substrate during assembly.
6. An electrical connector as defined in claim 3, wherein the electrically conductive connector element includes two elongated connector portions each extending from an end of the body of the anchor portion, one of the elongated connection portions being of limited cross-sectional dimension to permit free passage of the elongated connector portion through the opening in the substrate during assembly.
7. A connector plane for electrically connecting with a plurality of circuit boards having connector receptacles, the connector plane comprising:
a plurality of electrically conductive connector elements, each including a connection portion for contact with a connector receptacle and an anchor portion having a body and a plurality of protrusions extending from the body portion to respective terminating surfaces;
a substrate having an electrically insulating surface and a plurality of openings therethrough each opening being defined by a metallic sidewall;
the anchor portion of each of the electrically conductive connector elements residing in one of the openings with at least one of the terminating surfaces lying against a portion of the metallic side wall and solder fillets being contiguous with the protrusion and said portion of the metallic side wall;
the metallic side wall, the solder fillets, and the protrusion in combination defining a fluid flow conduit through the substrate.
a plurality of electrically conductive connector elements, each including a connection portion for contact with a connector receptacle and an anchor portion having a body and a plurality of protrusions extending from the body portion to respective terminating surfaces;
a substrate having an electrically insulating surface and a plurality of openings therethrough each opening being defined by a metallic sidewall;
the anchor portion of each of the electrically conductive connector elements residing in one of the openings with at least one of the terminating surfaces lying against a portion of the metallic side wall and solder fillets being contiguous with the protrusion and said portion of the metallic side wall;
the metallic side wall, the solder fillets, and the protrusion in combination defining a fluid flow conduit through the substrate.
8. A connector plane as defined in claim 7 wherein at least two terminating surfaces of each anchor portion lie against respective portions of the metallic side wall, respective solder fillets being contiguous with the respective protrusions and said respective portions of the metallic side wall, such that a plurality of conduits is defined.
9. A connector plane as defined in claim 8 wherein the body portion is elongated, the protrusions being likewise elongated and being of such dimension to cause deformation of at least one of the protrusions or the metallic side wall adjacent said protrusions.
10. A connector plane as defined in claim 7, wherein in at least some of the electrically conductive elements each include two elongated connector portions each extending from an end of the body of the anchor portion, one of the elongated connector portions being of limited cross-sectional dimension to permit insertion of said elongated connector portion through a respective one of the openings during assembly.
11. A connector plane as defined in claim 8, wherein in at least some of the electrically conductive elements each include two elongated connector portions each extending from an end of the body of the anchor portion, one of the elongated connector portions being of limited cross-sectional dimension to permit insertion of said elongated connector portion through a respective one of the openings during assembly.
12. A connector plane as defined in claim 9, wherein in at least some of the electrically conductive elements each include two elongated connector portions each extending from an end of the body of the anchor portion, one of the elongated connector portions being of limited cross-sectional dimension to permit insertion of said elongated connector portion through a respective one of the openings during assembly.
13. A method for manufacturing an electrical connector, comprising the steps of:
a) providing an insulating substrate into which a hole has been formed therethrough and is defined by a solderable metallic peripheral wall;
b) providing an electrically conductive connector element including an anchor portion having a body and a plurality of protrusions extending from the body to respective terminal surfaces being so spaced as to achieve an interference fit with the peripheral wall upon insertion of the anchor portion into the hole;
c) tinning the metallic peripheral wall with a solder material;
d) squeegeeing the tinned wall to remove all but a substantially uniform thickness of the solder material;
e) cooling the peripheral wall to less than a fusion temperature of the solder material;
f) inserting the anchor portion into the hole to provide an intermediate assembly whereby fluid flowable conduits are defined between the peripheral wall and the protrusions;
g) applying a solder fluxing agent by way of the conduits;
and h) heating the electrically conductive connector element and the peripheral wall to a temperature above the fusion temperature whereby solder reflow occurs to form a solder fillet between each of the protrusions and respective adjacent portions of the peripheral walls to provide a finished assembly.
a) providing an insulating substrate into which a hole has been formed therethrough and is defined by a solderable metallic peripheral wall;
b) providing an electrically conductive connector element including an anchor portion having a body and a plurality of protrusions extending from the body to respective terminal surfaces being so spaced as to achieve an interference fit with the peripheral wall upon insertion of the anchor portion into the hole;
c) tinning the metallic peripheral wall with a solder material;
d) squeegeeing the tinned wall to remove all but a substantially uniform thickness of the solder material;
e) cooling the peripheral wall to less than a fusion temperature of the solder material;
f) inserting the anchor portion into the hole to provide an intermediate assembly whereby fluid flowable conduits are defined between the peripheral wall and the protrusions;
g) applying a solder fluxing agent by way of the conduits;
and h) heating the electrically conductive connector element and the peripheral wall to a temperature above the fusion temperature whereby solder reflow occurs to form a solder fillet between each of the protrusions and respective adjacent portions of the peripheral walls to provide a finished assembly.
14. A method as defined in claim 13 wherein the step d) of squeegeeing is performed by exposing the substrate and the peripheral wall to a directed fluid flow of gas at a temperature above the fusion temperature of the solder material.
15. A method as defined in claim 13 wherein the step h) of heating is performed by exposing the intermediate assembly to a source of electromagnetic radiation having a frequency within a range of frequencies including visible and infrared spectrums.
16. A method as defined in claim 13, wherein the insulated substrate includes a plurality of the holes and is provided by a circuit board having plated through holes each for receiving an anchor portion and wherein the electrically conductive element includes at least one elongated connecting portion extending from the body of the anchor portion.
17. A method as defined in claim 14, wherein the insulated substrate includes a plurality of the holes and is provided by a circuit board having plated through holes each for receiving an anchor portion and wherein the electrically conductive element includes at least one elongated connecting portion extending from the body of the anchor portion.
18. A method as defined in claim 15, wherein the insulated substrate includes a plurality of the holes and is provided by a circuit board having plated through holes each for receiving an anchor portion and wherein the electrically conductive element includes at least one elongated connecting portion extending from the body of the anchor portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000419497A CA1167127A (en) | 1983-01-14 | 1983-01-14 | Electrical connector structure and method of manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000419497A CA1167127A (en) | 1983-01-14 | 1983-01-14 | Electrical connector structure and method of manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1167127A true CA1167127A (en) | 1984-05-08 |
Family
ID=4124337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000419497A Expired CA1167127A (en) | 1983-01-14 | 1983-01-14 | Electrical connector structure and method of manufacture |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1167127A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0260967A1 (en) * | 1986-09-17 | 1988-03-23 | E.I. Du Pont De Nemours And Company | Connector with compliant retainer |
-
1983
- 1983-01-14 CA CA000419497A patent/CA1167127A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0260967A1 (en) * | 1986-09-17 | 1988-03-23 | E.I. Du Pont De Nemours And Company | Connector with compliant retainer |
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