JPH03206681A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH03206681A
JPH03206681A JP281390A JP281390A JPH03206681A JP H03206681 A JPH03206681 A JP H03206681A JP 281390 A JP281390 A JP 281390A JP 281390 A JP281390 A JP 281390A JP H03206681 A JPH03206681 A JP H03206681A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
hole
spring
metallic layer
inserted
coil spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP281390A
Inventor
Yasuki Ikeda
Eiji Kobayashi
Yasuhiro Teraoka
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

Abstract

PURPOSE: To prevent disconnection inside a through-hole by inserting a coil spring consisting of a conductive metal into a through-hole besides a metallic layer and by soldering the inserted spring or by bonding it using contact bonding agent.
CONSTITUTION: In addition to a metallic layer 3a, a coil spring 5 consisting of conductive metal is inserted into a through-hole 3, or the inserted spring is soldered or bonded by a contact bonding agent. A coil diameter of the spring 5 is made larger than a through-hole diameter. An outermost periphery of the spring 5 is brought into contact with the inner surface of the through-hole at several points. Even if the metallic layer 3a is disconnected due to cracks because of heat contraction, disconnection inside the through-hole can thereby be prevented. Conductive rubber or conductive resin can be injected and hardened instead of the coil spring.
COPYRIGHT: (C)1991,JPO&Japio
JP281390A 1990-01-09 1990-01-09 Printed wiring board Pending JPH03206681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP281390A JPH03206681A (en) 1990-01-09 1990-01-09 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP281390A JPH03206681A (en) 1990-01-09 1990-01-09 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH03206681A true true JPH03206681A (en) 1991-09-10

Family

ID=11539837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP281390A Pending JPH03206681A (en) 1990-01-09 1990-01-09 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH03206681A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045889B2 (en) * 2001-08-21 2006-05-16 Micron Technology, Inc. Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
WO2014007292A1 (en) * 2012-07-06 2014-01-09 シャープ株式会社 Structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045889B2 (en) * 2001-08-21 2006-05-16 Micron Technology, Inc. Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
WO2014007292A1 (en) * 2012-07-06 2014-01-09 シャープ株式会社 Structure
JP2014029893A (en) * 2012-07-06 2014-02-13 Sharp Corp Structure

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