JPS6127091Y2 - - Google Patents
Info
- Publication number
- JPS6127091Y2 JPS6127091Y2 JP1981113567U JP11356781U JPS6127091Y2 JP S6127091 Y2 JPS6127091 Y2 JP S6127091Y2 JP 1981113567 U JP1981113567 U JP 1981113567U JP 11356781 U JP11356781 U JP 11356781U JP S6127091 Y2 JPS6127091 Y2 JP S6127091Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- pin
- circuit board
- solder
- adhesion prevention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 230000002265 prevention Effects 0.000 claims description 24
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 15
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
この考案は、プリント基板用ピンに係り、特に
プリント基板への植設と半田付け作業の容易なプ
リント基板用ピンに関する。[Detailed Description of the Invention] This invention relates to a pin for a printed circuit board, and particularly to a pin for a printed circuit board that can be easily installed on a printed circuit board and soldered.
従来、プリント基板用のピンは、例えば、第１
図に示すような形で知られている。この種のピン
１は、導電性円筒部材、例えば真鍮製の円筒部材
からなり、プリント基板５に取付けられて、リー
ド線などに接続された端子７と接続される。この
ピン１を、プリント基板５上に自動半田槽で半田
付けするには、プリント基板５に穿設された穴
に、このピン１を植設した後、このプリント基板
５の配線面５ａを半田付け槽へ浸して、ピン１の
基部１ａへの半田付け作業を行なうと、第２図に
示すように、ピン１の基部１ａ以外の、端子７と
接触する端子接触部分１ｂにも、余分な半田が付
着する。この余分に付着した半田は、ピン１を端
子７へ挿入する際にその挿入を困難とするので、
除去することが必要となるが、この徐去作業は手
数を要し、ひいてはピン１の取付作業の迅速化を
妨げる。そのため、従来は、自動半田付とは別工
程で手動半田付作業を行つたりプリント基板５の
配線面５ａを半田付け槽へ浸す前に、ピン１の接
触部分１ｂに予めレジスト液を塗布しておき、半
田付け作業の際にこのレジスト液を塗布した端子
接触部分１ｂに余分な半田が付着しないように
し、その後、このレジスト液が付着した端子接触
部分１ｂを剥離液に浸してレジスト液を除去する
ことにより、前記の手数を要する半田除去作業を
省略している。しかしながら、このような作業工
程を経ると、レジスト液の塗布とその除去を行な
わなければならず、作業工程が増えるという欠点
がある。 Conventionally, pins for printed circuit boards, for example,
It is known in the form shown in the figure. This type of pin 1 is made of a conductive cylindrical member, for example a brass cylindrical member, and is attached to a printed circuit board 5 and connected to a terminal 7 connected to a lead wire or the like. To solder this pin 1 onto the printed circuit board 5 using an automatic soldering bath, after implanting this pin 1 into a hole drilled in the printed circuit board 5, solder the wiring surface 5a of this printed circuit board 5. When the pin 1 is immersed in a soldering tank and soldered to the base 1a of the pin 1, as shown in FIG. Solder will stick. This excess solder makes it difficult to insert pin 1 into terminal 7.
Although it is necessary to remove the pin 1, this removal work is time-consuming and further impedes the speed of the pin 1 installation work. Therefore, in the past, resist liquid was applied in advance to the contact portion 1b of the pin 1 before manual soldering was performed in a separate process from automatic soldering, or before the wiring surface 5a of the printed circuit board 5 was immersed in the soldering bath. Then, during soldering work, make sure that excess solder does not adhere to the terminal contact area 1b to which this resist liquid has been applied, and then immerse the terminal contact area 1b to which this resist liquid has adhered in stripping liquid to remove the resist liquid. By removing the solder, the troublesome solder removal work described above is omitted. However, if such a work step is carried out, the resist solution must be applied and removed, resulting in an increase in the number of work steps.
そこで、この考案に係る出願人等は、第３図に
示すように、ピン１０の基部１０ａを残して端子
接触部分１０ｂに、半田が付着しにくくしかも導
電性の半田付着防止層、例えば、クロムなどのメ
ツキ層や、導電性ペーストなどを塗布した層を成
形したプリント基板用ピン１０を提案し、前記の
ようなレジスト液の除去のための作業を省略でき
るようにした。ところが、ピン１０の端子接触部
分１０ｂのみに半田付着防止層を形成することは
手数を要し、ピン自体のコスト高となる。 Therefore, as shown in FIG. 3, the applicants of this invention have applied a solder adhesion prevention layer that is difficult to adhere to solder and is conductive, such as chromium, to the terminal contact portion 10b, leaving the base 10a of the pin 10. We have proposed a pin 10 for a printed circuit board formed with a plating layer or a layer coated with a conductive paste, etc., so that the work for removing the resist solution as described above can be omitted. However, forming the solder adhesion prevention layer only on the terminal contact portion 10b of the pin 10 is time-consuming and increases the cost of the pin itself.
この考案は、以上のような点に鑑みなされたも
のであつて、ピン自体の製造が簡単で、しかもプ
リント基板への植設と半田付け作業の容易な、プ
リント基板用ピンを提供することを目的とする。 This invention was made in view of the above points, and it is an object of the present invention to provide a pin for a printed circuit board that is easy to manufacture, and also easy to install and solder onto a printed circuit board. purpose.
この目的を達成するため、この考案は、環状突
起を有する導電性の棒状部材からなるピンの表面
全体に、予め半田付着防止層を形成しておき、こ
のピをプリント基板へ植設する前に、またはプリ
ント基板への植設の際に、環状突起面の半田付着
防止層を機械的手段などで除去した後、この環状
突起部分にのみ半田の付着を可能にしている。 In order to achieve this purpose, this invention involves forming a solder adhesion prevention layer on the entire surface of the pin, which is a conductive rod-shaped member having an annular projection, before placing the pin on the printed circuit board. Or, when installing on a printed circuit board, the solder adhesion prevention layer on the annular protrusion surface is removed by mechanical means, and then solder can be applied only to the annular protrusion portion.
以下、添付図面に基づいて、この考案の一実施
例を説明する。 An embodiment of this invention will be described below based on the accompanying drawings.
第４図は、この実施例に係るプリント基板用ピ
ンの斜視図である。このプリント基板用のピン２
０は、導電性の棒状部材２１と、この棒状部材２
１に設けた環状突起２２と、この環状突起２２を
有する前記棒状部材２１の表面全体に形成した半
田付着防止層２３とからなる。 FIG. 4 is a perspective view of the printed circuit board pin according to this embodiment. Pin 2 for this printed circuit board
0 is a conductive rod-shaped member 21 and this rod-shaped member 2
1, and a solder adhesion prevention layer 23 formed on the entire surface of the rod-shaped member 21 having the annular projection 22.
ここで、棒状部材２１は、例えば、円筒状柱状
などをなし、半田付け可能な導電性の材料、例え
ば、真鍮、銅などで作られている。この棒状部材
２１の外側上端近くには、環状突起２２が形成さ
れ、この環状突起２２によつて棒状部材２１を、
プリント基板穴に嵌入される基部２１ａと、端子
に接触する端子接触部分２１ｂとに、画定する。
環状突起２２の外側突起面２２ａは、例えば、平
らに形成され、しかもその幅は半田付けが可能な
長さを有している。これら環状突起２２を有する
前記棒状部材２１の表面全体に形成される半田付
着防止層２３は、半田が付着しにくくしかも導電
性の層、例えば、導電性ペーストの皮膜層や、棒
状部材２１が真鍮の場合にはクロムなどのメツキ
層等からなる。 Here, the rod-shaped member 21 has a cylindrical column shape, for example, and is made of a solderable conductive material, such as brass or copper. An annular projection 22 is formed near the outer upper end of this rod-shaped member 21, and this annular projection 22 allows the rod-shaped member 21 to be
A base portion 21a that is fitted into the printed circuit board hole and a terminal contact portion 21b that contacts the terminal are defined.
The outer protrusion surface 22a of the annular protrusion 22 is, for example, formed flat and has a width that is long enough to be soldered. The solder adhesion prevention layer 23 formed on the entire surface of the rod-shaped member 21 having these annular protrusions 22 is a layer that is difficult for solder to adhere to and is conductive, for example, a film layer of conductive paste, or a layer made of brass. In this case, it consists of a plating layer of chromium or the like.
第５図は、前記ピン２０をプリント基板に取付
けるための説明図である。 FIG. 5 is an explanatory diagram for attaching the pin 20 to a printed circuit board.
まず、環状突起２２の外側突起面２２ａ上に形
成された半田付着防止層２３を、機械的手段や電
気的手段、化学的手段などの種々の方法により除
去する。ここで、機械的手段としては、プレスに
よる剥離などの方法が考えられる。その後、プリ
ント基板３５の配線面３５ａから、そのプリント
基板３５に穿設した穴３５ｂへ、ピン２０の基部
２１ａを挿入すると、穴３５ａへピン２０が所定
長だけ入つたところで、環状突起２２の上側面が
プリント基板３５の配線３５ａに当接して、係止
される。なお、第５図に示すようなプレスＡによ
り、前記の半田付着防止層２３の除去と、穴３５
ｂへの植設作業とを、同時に行なうことも可能で
ある。次いで、ピン２０を植設したプリント基板
３５の配線面３５ａを、半田付け槽へ浸すなどの
方法により、環状突起２２の外側突起面２２ａと
配線面３５ａとに半田付けＢを行なう。この半田
付け作業に、半田付け槽を採用する場合には、ピ
ン２０の端子接触面２１ｂおよび環状突起２２
を、半田付け槽へ浸しても、端子接触面２１ｂに
はその表面を半田付着防止層２３で覆われている
ので、半田が付着せず、この半田付着防止層２３
が除去された環状突起２２の外側突起面２２ａに
のみ半田が付着する。而して、この実施例に係る
ピン２０は、半田付着防止層２３が全面に形成さ
れるので、その半田付着防止層２３をピン２０の
一部にのみ形成するよりも容易である。また、環
状突起２２の外側突起面２２ａが、ピン２０の側
面から突出しているので、この外側突起面２２ａ
上の半田付着防止層２３を除去しやすく、しかも
ピン２０の基部２１ａをプリント基板３５の穴３
５ｂへ挿入する際には、環状突起２２がプリント
基板３５の配線面３５ａに当接するため、ピン２
０の挿入長さの位置決めが容易である。さらに、
半田付け作業として、例えば、半田付け槽を使用
する場合には、半田付着防止層２３が除去された
前記外側突起面２２ａにのみ半田が付着し、その
他の端子接触部２２ｂには、それに覆われた半田
付着防止層２３のために余分な半田が付着せず、
それを除去するような作業を省略でき、さらにま
た、ピン２０の端子接触部２１ｂを覆つている半
田付着防止層２３は、導電性の層、例えば、クロ
ムメツキ層であるため、これを除去することな
く、そのまま端子などと接触させて結線でき、ひ
いては、プリント基板３５へのピン２０の取付け
作業が簡易でしかも迅速に行える利点がある。 First, the solder adhesion prevention layer 23 formed on the outer protrusion surface 22a of the annular protrusion 22 is removed by various methods such as mechanical means, electrical means, and chemical means. Here, as the mechanical means, methods such as peeling using a press can be considered. Thereafter, when the base 21a of the pin 20 is inserted from the wiring surface 35a of the printed circuit board 35 into the hole 35b drilled in the printed circuit board 35, when the pin 20 enters the hole 35a by a predetermined length, the annular protrusion 22 The side surface contacts the wiring 35a of the printed circuit board 35 and is locked. Note that by using a press A as shown in FIG. 5, the solder adhesion prevention layer 23 and the holes 35 are removed.
It is also possible to perform the planting work in b at the same time. Next, soldering B is performed on the outer projection surface 22a of the annular projection 22 and the wiring surface 35a by a method such as dipping the wiring surface 35a of the printed circuit board 35 on which the pin 20 is implanted into a soldering bath. When a soldering bath is used for this soldering work, the terminal contact surface 21b of the pin 20 and the annular protrusion 22
Even if the terminal contact surface 21b is immersed in a soldering bath, solder does not adhere to the terminal contact surface 21b because the surface is covered with the solder adhesion prevention layer 23.
Solder adheres only to the outer protrusion surface 22a of the annular protrusion 22 from which the annular protrusion 22 has been removed. Since the pin 20 according to this embodiment has the solder adhesion prevention layer 23 formed over the entire surface, it is easier to form the solder adhesion prevention layer 23 only on a part of the pin 20. Further, since the outer protrusion surface 22a of the annular protrusion 22 protrudes from the side surface of the pin 20, this outer protrusion surface 22a
The upper solder adhesion prevention layer 23 can be easily removed, and the base 21a of the pin 20 can be easily removed from the hole 3 of the printed circuit board 35.
5b, the annular protrusion 22 comes into contact with the wiring surface 35a of the printed circuit board 35, so the pin 2
It is easy to position the insertion length of 0. moreover,
For example, when a soldering bath is used for soldering work, solder adheres only to the outer protrusion surface 22a from which the solder adhesion prevention layer 23 has been removed, and the other terminal contact portions 22b are covered with it. The solder adhesion prevention layer 23 prevents excess solder from adhering.
Further, since the solder adhesion prevention layer 23 covering the terminal contact portion 21b of the pin 20 is a conductive layer, for example, a chrome plating layer, it is not necessary to remove it. This has the advantage that the pins 20 can be connected as they are by contacting them with terminals, etc., and the work of attaching the pins 20 to the printed circuit board 35 can be done easily and quickly.
この考案によるプリント基板用ピンは、以上の
ように構成されるので、環状突起を有する棒状部
材の表面全体に半田付着防止層を形成することは
容易であり、さらに、このピンをプリント基板に
穿設される穴へ取付けるには、環状突起面がピン
の側面から突出しているので、その環状突起面を
覆つている半田付着防止層の除去を機械的手段な
どにより簡単に行なうことができ、しかもプリン
ト基板の穴へピンを植設する際に、この環状突起
がプリント基板に当接するのでピンの挿入長さの
位置決めが容易である。また、半田付着防止層を
導電性で且つ半田が付着しにくい層で形成するこ
とにより、次いで行なわれる半田付け作業に際し
ても、半田付着防止層で覆われた部分への余分な
半田付着がなく、この半田付着防止層が除去され
た環状突起のみの半田付けが容易となる効果があ
る。特に、半田付着防止層を導電性の層、例え
ば、クロムメツキ層とすれば、半田付け作業の後
に、このクロムメツキ層を除去する必要がなく、
そのままで、プリント基板上に取り付けられたこ
のピンを、端子などと接触させて結線できる効果
がある。 Since the printed circuit board pin according to this invention is constructed as described above, it is easy to form a solder adhesion prevention layer on the entire surface of the rod-shaped member having an annular projection, and furthermore, this pin can be drilled into a printed circuit board. Since the annular protrusion surface protrudes from the side surface of the pin, the solder adhesion prevention layer covering the annular protrusion surface can be easily removed by mechanical means, etc. to attach the pin to the hole. When inserting the pin into the hole of the printed circuit board, the annular projection comes into contact with the printed circuit board, making it easy to determine the insertion length of the pin. In addition, by forming the solder adhesion prevention layer as a layer that is conductive and difficult to adhere to solder, there is no excess solder adhesion to the parts covered with the solder adhesion prevention layer during the subsequent soldering work. This has the effect of making it easier to solder only the annular protrusions from which the solder adhesion prevention layer has been removed. In particular, if the solder adhesion prevention layer is a conductive layer, for example a chrome plating layer, there is no need to remove the chrome plating layer after soldering.
This has the effect of allowing the pins attached to the printed circuit board to be brought into contact with terminals, etc., and connected.
第１図，第２図は従来のプリント基板用ピンの
説明図、第３図はこの考案に係る出願人等が先に
提案したプリント基板用ピンの説明図、第４図は
この考案の一実施例に係るプリント基板用ピンの
斜視図、第５図は第４図のピンをプリント基板に
取付ける場合の説明図である。
１，１０，２０……プリント基板用ピン、５，
３５……プリント基板、２１……棒状部材、２２
……環状突起、２３……半田付着防止層。
Figures 1 and 2 are explanatory diagrams of conventional pins for printed circuit boards, Figure 3 is an explanatory diagram of pins for printed circuit boards previously proposed by the applicant and others related to this invention, and Figure 4 is an illustration of a pin for printed circuit boards that was previously proposed by the applicant and others related to this invention. FIG. 5 is a perspective view of the printed circuit board pin according to the embodiment, and is an explanatory diagram when the pin shown in FIG. 4 is attached to the printed circuit board. 1, 10, 20...Pin for printed circuit board, 5,
35...Printed circuit board, 21...rod-shaped member, 22
...Annular protrusion, 23...Solder adhesion prevention layer.
Claims (1)
棒状部材の基部をプリント基板に植設すると共
に、板面の配線に半田付けするプリント基板用
ピンにおいて、前記棒状部材を半田付けする部
位に前記端子接触部分よりも外径の大きい環状
突起を形成すると共に、この環状突起の外周面
を除いた表面に半田付着防止層を形成したこと
を特徴とするプリント基板用ピン。 ２ 前記半田付着防止層はクロムメツキ層とした
ことを特徴とする実用新案登録請求の範囲第１
項記載のプリント基板用ピン。[Claims for Utility Model Registration] 1. A pin for a printed circuit board that is a rod-shaped member having a terminal contact portion, the base of the rod-shaped member is implanted in a printed circuit board, and is soldered to the wiring on the board, the rod-shaped member A pin for a printed circuit board, characterized in that an annular protrusion having an outer diameter larger than the terminal contact portion is formed at the part to be soldered, and a solder adhesion prevention layer is formed on the surface of the annular protrusion except for the outer peripheral surface. . 2. Utility model registration claim 1, characterized in that the solder adhesion prevention layer is a chrome plating layer.
Printed circuit board pins listed in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113567U JPS5819473U (en) | 1981-07-30 | 1981-07-30 | Printed circuit board pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981113567U JPS5819473U (en) | 1981-07-30 | 1981-07-30 | Printed circuit board pins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5819473U JPS5819473U (en) | 1983-02-05 |
| JPS6127091Y2 true JPS6127091Y2 (en) | 1986-08-13 |
Family
ID=29907866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981113567U Granted JPS5819473U (en) | 1981-07-30 | 1981-07-30 | Printed circuit board pins |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5819473U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11167944A (en) * | 1997-10-03 | 1999-06-22 | Fujitsu Ltd | I/o pin with solder dam for connecting boards |
-
1981
- 1981-07-30 JP JP1981113567U patent/JPS5819473U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5819473U (en) | 1983-02-05 |
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