JPS6150365B2 - - Google Patents
Info
- Publication number
- JPS6150365B2 JPS6150365B2 JP55131102A JP13110280A JPS6150365B2 JP S6150365 B2 JPS6150365 B2 JP S6150365B2 JP 55131102 A JP55131102 A JP 55131102A JP 13110280 A JP13110280 A JP 13110280A JP S6150365 B2 JPS6150365 B2 JP S6150365B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- resistor element
- electrical terminal
- forming
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、抵抗器の電気端子形成方法に係り、
抵抗素子の両端部に抵抗体皮膜との電気的接触が
極めて良好でしかも密着の強固な電気端子（以下
端子という）を形成する方法に関するものであ
る。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for forming electrical terminals of a resistor,
The present invention relates to a method for forming electrical terminals (hereinafter referred to as terminals) having extremely good electrical contact with a resistor film and strong adhesion at both ends of a resistor element.
（従来の技術）
近年電子機器は部品実装の高密度化と高能率化
が強く要求されており、その一方式としてプリン
ト基板の配線導電帯にリード線を持たない電気部
品を直接ハンダつけする結合方式が採用されるよ
うになつた。(Conventional technology) In recent years, there has been a strong demand for higher density and higher efficiency component mounting in electronic devices, and one method for achieving this is to directly solder electrical components without lead wires to the wiring conductive strips of printed circuit boards. method has been adopted.
上記のリード線を持たない電子部品の一つとし
て第６図に示すように円筒形絶縁素体１の表面に
抵抗体皮膜２を形成し、この素体１の両端部に金
属キヤツプ３を嵌合して端子とした後、抵抗値調
整を行い、抵抗体皮膜２上に保護絶縁層４を形成
した抵抗器が知られている。この抵抗器は樹脂で
プリント基板に仮止めした後ハンダつぼに浸漬し
てハンダづけをしている。この方法により従来の
ように両端部にリード線を有する抵抗器より高密
度実装することができ、また部品の取付時間を短
縮することができる。しかしながらこの方法では
部品全体を高温のハンダつぼに浸漬するため、金
属キヤツプ３と円筒形絶縁基体１の熱膨張率の差
異により抵抗体皮膜２と金属キヤツプ３との接触
が十分でなくなることがあることや、抵抗器製造
工程中に金属キヤツプ３と抵抗体皮膜２との間に
異物が介入して電気的接触を不確実にし、また上
記金属キヤツプ３と抵抗体皮膜２との間に湿気の
侵入により特性の低下をおこす等のおそれがあ
る。さらに電子部品の１個１個に金属キヤツプ３
を嵌着するために製作に手数がかかつた。また、
多数の電子部品に電極を形成する方法としては特
公昭49―2941号公報に記載されているように、熱
収縮性樹脂板に多数の通孔を形成し、この通孔に
電子部品を挿通し次に熱収縮性樹脂板に熱を加え
て収縮させて通孔に電子部品を固着し、この電子
部品に電極を形成する塗料を塗布して多数の電子
部品に電極を形成する方法が知られている。 As one of the above-mentioned electronic components without lead wires, a resistor film 2 is formed on the surface of a cylindrical insulating element 1 as shown in FIG. A resistor is known in which a protective insulating layer 4 is formed on the resistor film 2 by adjusting the resistance value after combining the resistors to form a terminal. This resistor is temporarily attached to a printed circuit board with resin and then immersed in a soldering pot for soldering. This method allows for higher density mounting than conventional resistors having lead wires at both ends, and also shortens the time required to attach the components. However, in this method, the entire component is immersed in a high-temperature soldering pot, so the contact between the resistor film 2 and the metal cap 3 may not be sufficient due to the difference in thermal expansion coefficient between the metal cap 3 and the cylindrical insulating base 1. In addition, foreign matter may intervene between the metal cap 3 and the resistor film 2 during the resistor manufacturing process, making the electrical contact unreliable, and moisture may be present between the metal cap 3 and the resistor film 2. There is a risk that properties may deteriorate due to intrusion. Furthermore, each electronic component has 3 metal caps.
It took a lot of work to make it because it had to be fitted. Also,
As described in Japanese Patent Publication No. 49-2941, a method for forming electrodes on a large number of electronic components is to form a large number of holes in a heat-shrinkable resin plate and insert the electronic components into these holes. There is a known method of applying heat to a heat-shrinkable resin plate to shrink it, fixing electronic components in the through holes, and applying paint to form electrodes to the electronic components to form electrodes on a large number of electronic components. ing.
（発明が解決しようとする問題点）
上記従来の電子部品に電極としてのキヤツプを
嵌着する方法は手数がかかるばかりでなく電子部
品とキヤツプとの接触不充分、異物の介入、湿気
の侵入等の問題があり、また特公昭49―2941号公
報に記載の方法は一時に多数の電極を形成するこ
とはできるが、電子部品が嵌着される熱収縮性樹
脂板は反復使用ができないという問題がある。(Problems to be Solved by the Invention) The conventional method of fitting a cap as an electrode onto an electronic component is not only time-consuming, but also causes problems such as insufficient contact between the electronic component and the cap, interference of foreign matter, and intrusion of moisture. Another problem is that although the method described in Japanese Patent Publication No. 49-2941 can form a large number of electrodes at once, the heat-shrinkable resin plate on which electronic components are fitted cannot be used repeatedly. There is.
本発明は上記問題に鑑みなされたもので、多数
の抵抗素体の両端に一挙に金属皮膜よりなる電極
を形成し、しかもこの電極が抵抗体膜と強固に密
着され、さらに抵抗素体を弾性的に支持した板状
体が反復使用可能な方法を提供しようとするもの
である。 The present invention was developed in view of the above problem, and consists of forming electrodes made of a metal film on both ends of a large number of resistor elements at once, which electrodes are tightly adhered to the resistor films, and furthermore, the resistor elements are elastically bonded to each other. The purpose of this invention is to provide a method in which a plate-like body supported by a holder can be used repeatedly.
（問題点を解決するための手段）
本発明の抵抗器の電気端子形成方法は、弾性を
有する板状体の厚さ方向に、電気端子形成前の抵
抗素体の直径よりやや小さな直径を有し上記抵抗
素体を挿入したとき抵抗素体両端の電気端子形成
部が露出する複数個の貫通孔を形成し、上記貫通
孔に夫々上記抵抗素体を挿入して両端の電気端子
形成部を露出させ、上記電気端子形成部にメツキ
法により電気端子としての金属皮膜を形成するこ
とを特徴とするものである。
(Means for Solving the Problems) In the method for forming electrical terminals of a resistor of the present invention, the elastic plate-like body has a diameter slightly smaller than the diameter of the resistor element before forming the electrical terminal in the thickness direction. A plurality of through holes are formed through which the electrical terminal forming portions at both ends of the resistive element are exposed when the resistive element is inserted, and the resistive element is inserted into each of the through holes to expose the electrical terminal forming portions at both ends. It is characterized in that the electrical terminal forming portion is exposed and a metal film as an electrical terminal is formed on the electrical terminal forming portion by a plating method.
（作用）
本発明の抵抗器の電気端子形成方法は、弾性を
有する板状体の貫通孔に複数個の抵抗素体を両端
の電気端子形成部を露出させて弾性的に嵌挿し、
夫々抵抗体素子の両端の露出した電気端子形成部
にメツキ法により電気端子としての金属皮膜を形
成し金属皮膜の形成後に抵抗素体を板状体の貫通
孔から引き抜くことにより同時に多数の抵抗体素
子の端部に電気端子としての金属皮膜が形成され
る。(Function) The method for forming electrical terminals of a resistor of the present invention includes elastically fitting a plurality of resistor elements into through holes of an elastic plate-like body with electrical terminal forming portions at both ends exposed.
A metal film is formed as an electrical terminal by a plating method on the exposed electrical terminal forming portions at both ends of each resistor element, and after the metal film is formed, the resistor element is pulled out from the through hole of the plate-like body, thereby creating a large number of resistors at the same time. A metal film is formed at the end of the element as an electrical terminal.
（実施例）
以下本発明一実施例を第１図ないし第５図で説
明する。(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. 1 to 5.
まず第１図に示すように円筒器磁気基体５の表
面に熱分解析出法により炭素皮膜６を析出させ抵
抗素体１１を形成する。一方、第２図に示すよう
に弾性をもつシリコンゴム板よりなる板状体７の
厚さ方向に複数個の貫通孔８が形成されている。
次にこの板状体７のそれぞれの貫通孔８に第３
図、または第４図に示すように上記抵抗素体１１
を挿入する。このとき貫通孔８の孔径は抵抗素体
１１の直径よりやや小さめにしておくことによ
り、抵抗素体１１の表面と貫通孔８の内壁面とは
完全に密着させることができる。また第３図に示
すように板状体７の厚さを抵抗素体１１の長さよ
り薄くするかまたは第４図に示すように貫通孔８
の両端開口部分を広くすることにより抵抗素体１
１の両端の端子形成部９のみを露出させることが
できる。次に抵抗素体１１の両端の端子形成部９
が露出した状態で無電解ニツケルメツキを行なつ
て露出部のみにニツケル端子としての金属皮膜１
０を形成する。この金属皮膜１０を形成後板状体
７より抵抗素体１１を取出す。 First, as shown in FIG. 1, a carbon film 6 is deposited on the surface of a cylindrical magnetic base 5 by a thermal analysis method to form a resistor element 11. On the other hand, as shown in FIG. 2, a plurality of through holes 8 are formed in the thickness direction of a plate-like body 7 made of an elastic silicone rubber plate.
Next, in each through hole 8 of this plate-like body 7, a third
As shown in FIG.
Insert. At this time, by making the diameter of the through hole 8 slightly smaller than the diameter of the resistor element 11, the surface of the resistor element 11 and the inner wall surface of the through hole 8 can be brought into complete contact. Also, as shown in FIG. 3, the thickness of the plate-like body 7 is made thinner than the length of the resistor element 11, or as shown in FIG.
By widening the openings at both ends of the resistor element 1
Only the terminal forming portions 9 at both ends of the terminal can be exposed. Next, the terminal forming portions 9 at both ends of the resistor element 11
Electroless nickel plating is performed with the nickel terminal exposed, and the metal film 1 as a nickel terminal is applied only to the exposed part.
form 0. After forming this metal film 10, the resistor element 11 is taken out from the plate-like body 7.
以上の工程により抵抗素体に金属皮膜１０を形
成することができる。次に抵抗素体１１の炭素皮
膜６から両端に形成された金属皮膜１０の一部に
かけて保護絶縁層４を形成し第５図に示す製品を
得る。尚必要に応じては板状体７に抵抗素体１１
を取付けたままで更にニツケル、銅等複数の金属
皮膜を形成することができる。 The metal film 10 can be formed on the resistor element through the above steps. Next, a protective insulating layer 4 is formed from the carbon film 6 of the resistor element 11 to a portion of the metal film 10 formed on both ends to obtain the product shown in FIG. If necessary, a resistive element 11 may be attached to the plate-like body 7.
It is possible to further form multiple metal films such as nickel and copper while leaving the film attached.
本発明によれば、弾性を有する板状体の厚さ方
向に、電気端子形成前の抵抗素体の直径よりやや
小さな直径を有し上記抵抗素体を挿入したとき抵
抗素体両端の電気端子形成部が露出する複数個の
貫通孔を形成し、上記貫通孔に夫々上記抵抗素体
を挿入して両端の電気端子形成部を露出させ、上
記電気端子形成部にメツキ法により電気端子とし
ての金属皮膜を形成するため、多数の抵抗素体の
両端の電気端子形成部に一挙に金属皮膜よりなる
電気端子を形成することができ、電気端子として
のキヤツプを抵抗素体に１個１個嵌着する手数を
省くことができ大量生産に好適である。また、弾
性を有する板状体の貫通孔に抵抗素体は弾性的に
支持されるから、メツキ法による金属皮膜の形成
時にメツキ液が貫通孔内に介入することがなく、
抵抗素体の抵抗形成部がメツキ液によつて侵され
るおそれがない。また金属皮膜形成後は、板状体
の弾性を利用して抵抗素体を脱出させることがで
き、そしてさらにこの板状体に金属被膜が形成さ
れていない抵抗素体を嵌着して板状体を反復使用
することができ、生産コストを低くすることがで
きる。さらにメツキ法によつて抵抗素体に形成さ
れた電気端子としての金属皮膜は、電気端子とし
てキヤツプを嵌着したものに比べて抵抗素体に対
する密着性が大きく、その後の製造工程中で異物
や湿気が介入するおそれもない。また金属皮膜は
熱シヨツクのひずみによる影響も少なく、安定な
電気端子を得ることができる。
According to the present invention, the elastic plate-like body has a diameter slightly smaller than the diameter of the resistor element before forming the electrical terminal, and when the resistor element is inserted, the electrical terminals at both ends of the resistor element are formed. A plurality of through holes are formed through which the forming portions are exposed, and the resistor element is inserted into each of the through holes to expose the electrical terminal forming portions at both ends, and the electrical terminal forming portions are plated as electrical terminals. Since a metal film is formed, electrical terminals made of metal film can be formed all at once on the electrical terminal forming portions at both ends of a large number of resistor elements, and the caps as electrical terminals are fitted one by one to the resistor elements. It is suitable for mass production as it can save the labor of attaching. In addition, since the resistor element is elastically supported in the through-hole of the elastic plate-like body, the plating liquid does not intervene in the through-hole when forming the metal film by the plating method.
There is no risk that the resistance forming portion of the resistance element body will be attacked by the plating liquid. In addition, after the metal film is formed, the resistor element can be pulled out using the elasticity of the plate-shaped body, and then a resistor element without a metal coating is fitted onto this plate-shaped body to form a plate-shaped body. The body can be used repeatedly and production costs can be reduced. Furthermore, the metal film formed on the resistor element by the plating method, which serves as an electrical terminal, has greater adhesion to the resistor element than a cap fitted as an electrical terminal. There is no risk of moisture getting involved. In addition, the metal film is less affected by distortion due to heat shock, making it possible to obtain stable electrical terminals.
第１図は本発明の方法の一実施例に用いられる
抵抗素体の断面図、第２図は同上板状体の一部の
斜視図、第３図は同上板状体に抵抗素体を嵌着し
た状態を示す断面図、第４図は同上他の実施例を
示す断面図、第５図は本発明の方法によつて得ら
れた抵抗器の縦断正面図、第６図は従来の方法に
よつて得られた抵抗器の縦断正面図である。
７……板状体、８……貫通孔、１０……金属皮
膜、１１……抵抗素体。
Fig. 1 is a sectional view of a resistor element used in an embodiment of the method of the present invention, Fig. 2 is a perspective view of a part of the same plate-like body, and Fig. 3 is a resistor element attached to the same plate-like body. 4 is a sectional view showing another embodiment of the same as above, FIG. 5 is a longitudinal sectional front view of a resistor obtained by the method of the present invention, and FIG. 6 is a conventional resistor. FIG. 3 is a longitudinal sectional front view of a resistor obtained by the method. 7... Plate-shaped body, 8... Through hole, 10... Metal film, 11... Resistor element body.
Claims (1)
形成前の抵抗素体の直径よりやや小さな直径を有
し上記抵抗素体を挿入したとき抵抗素体両端の電
気端子形成部が露出する複数個の貫通孔を形成
し、上記貫通孔に夫々上記抵抗素体を挿入して両
端の電気端子形成部を露出させ、上記電気端子形
成部にメツキ法により電気端子としての金属皮膜
を形成することを特徴とする抵抗器の電気端子形
成方法。1. The elastic plate-like body has a diameter in the thickness direction that is slightly smaller than the diameter of the resistor element before electrical terminals are formed, and when the resistor element is inserted, the electrical terminal forming portions at both ends of the resistor element are exposed. Forming a plurality of through holes, inserting the resistor element into each of the through holes to expose the electrical terminal forming portions at both ends, and forming a metal film as an electrical terminal on the electrical terminal forming portion by a plating method. A method for forming electrical terminals of a resistor, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13110280A JPS5756902A (en) | 1980-09-19 | 1980-09-19 | Method of forming electric terminal for resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13110280A JPS5756902A (en) | 1980-09-19 | 1980-09-19 | Method of forming electric terminal for resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5756902A JPS5756902A (en) | 1982-04-05 |
| JPS6150365B2 true JPS6150365B2 (en) | 1986-11-04 |
Family
ID=15050018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13110280A Granted JPS5756902A (en) | 1980-09-19 | 1980-09-19 | Method of forming electric terminal for resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5756902A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01149153U (en) * | 1988-04-04 | 1989-10-16 | ||
| JPH0267048A (en) * | 1988-09-01 | 1990-03-07 | Pioneer Answerphone Mfg Corp | Telephone set for outgoing abbreviated number |
| JPH02118347U (en) * | 1989-03-13 | 1990-09-21 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0680605B2 (en) * | 1987-11-28 | 1994-10-12 | 株式会社村田製作所 | Electronic component chip holding jig and metal coating method for metallized surface of electronic component chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492941A (en) * | 1972-05-09 | 1974-01-11 |
-
1980
- 1980-09-19 JP JP13110280A patent/JPS5756902A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492941A (en) * | 1972-05-09 | 1974-01-11 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01149153U (en) * | 1988-04-04 | 1989-10-16 | ||
| JPH0267048A (en) * | 1988-09-01 | 1990-03-07 | Pioneer Answerphone Mfg Corp | Telephone set for outgoing abbreviated number |
| JPH02118347U (en) * | 1989-03-13 | 1990-09-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5756902A (en) | 1982-04-05 |
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