JPS61256656A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61256656A
JPS61256656A JP60098281A JP9828185A JPS61256656A JP S61256656 A JPS61256656 A JP S61256656A JP 60098281 A JP60098281 A JP 60098281A JP 9828185 A JP9828185 A JP 9828185A JP S61256656 A JPS61256656 A JP S61256656A
Authority
JP
Japan
Prior art keywords
cap
melting point
low melting
point glass
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60098281A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342699B2 (enrdf_load_stackoverflow
Inventor
Yoshihiro Kubota
義浩 久保田
Tetsushi Wakabayashi
哲史 若林
Takehisa Tsujimura
辻村　剛久
Takeshi Yokochi
横打　武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60098281A priority Critical patent/JPS61256656A/ja
Publication of JPS61256656A publication Critical patent/JPS61256656A/ja
Publication of JPH0342699B2 publication Critical patent/JPH0342699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60098281A 1985-05-08 1985-05-08 半導体装置 Granted JPS61256656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60098281A JPS61256656A (ja) 1985-05-08 1985-05-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60098281A JPS61256656A (ja) 1985-05-08 1985-05-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS61256656A true JPS61256656A (ja) 1986-11-14
JPH0342699B2 JPH0342699B2 (enrdf_load_stackoverflow) 1991-06-28

Family

ID=14215542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60098281A Granted JPS61256656A (ja) 1985-05-08 1985-05-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS61256656A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275147A (ja) * 1987-05-07 1988-11-11 Nec Corp 気密封止形半導体装置の製造方法
WO2002054488A3 (en) * 2000-12-29 2003-06-19 Intel Corp Ic package pressure release apparatus and method
JP2012065155A (ja) * 2010-09-16 2012-03-29 Nippon Dempa Kogyo Co Ltd 圧電デバイス
JP2019067833A (ja) * 2017-09-29 2019-04-25 日亜化学工業株式会社 発光装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275147A (ja) * 1987-05-07 1988-11-11 Nec Corp 気密封止形半導体装置の製造方法
WO2002054488A3 (en) * 2000-12-29 2003-06-19 Intel Corp Ic package pressure release apparatus and method
US7220624B2 (en) 2000-12-29 2007-05-22 Intel Corporation Windowed package for electronic circuitry
US7242088B2 (en) 2000-12-29 2007-07-10 Intel Corporation IC package pressure release apparatus and method
KR100815214B1 (ko) * 2000-12-29 2008-03-19 인텔 코오퍼레이션 Ic 패키지 압력 방출 방법, 이 방법을 이용하는 ic 패키지 및 전자장치
JP2012065155A (ja) * 2010-09-16 2012-03-29 Nippon Dempa Kogyo Co Ltd 圧電デバイス
US8896185B2 (en) 2010-09-16 2014-11-25 Nihon Dempa Kogyo Co., Ltd. Piezoelectric device
TWI469513B (zh) * 2010-09-16 2015-01-11 Nihon Dempa Kogyo Co 壓電裝置
JP2019067833A (ja) * 2017-09-29 2019-04-25 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JPH0342699B2 (enrdf_load_stackoverflow) 1991-06-28

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Legal Events

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