JPS61254619A - 半導体封止用エポキシ樹脂組成物 - Google Patents

半導体封止用エポキシ樹脂組成物

Info

Publication number
JPS61254619A
JPS61254619A JP9645085A JP9645085A JPS61254619A JP S61254619 A JPS61254619 A JP S61254619A JP 9645085 A JP9645085 A JP 9645085A JP 9645085 A JP9645085 A JP 9645085A JP S61254619 A JPS61254619 A JP S61254619A
Authority
JP
Japan
Prior art keywords
epoxy resin
powder
quartz
phenol
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9645085A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6326128B2 (pl
Inventor
Toshio Shiobara
利夫 塩原
Kazutoshi Tomiyoshi
富吉　和俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP9645085A priority Critical patent/JPS61254619A/ja
Publication of JPS61254619A publication Critical patent/JPS61254619A/ja
Publication of JPS6326128B2 publication Critical patent/JPS6326128B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP9645085A 1985-05-07 1985-05-07 半導体封止用エポキシ樹脂組成物 Granted JPS61254619A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9645085A JPS61254619A (ja) 1985-05-07 1985-05-07 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9645085A JPS61254619A (ja) 1985-05-07 1985-05-07 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61254619A true JPS61254619A (ja) 1986-11-12
JPS6326128B2 JPS6326128B2 (pl) 1988-05-28

Family

ID=14165354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9645085A Granted JPS61254619A (ja) 1985-05-07 1985-05-07 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61254619A (pl)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268750A (ja) * 1985-05-22 1986-11-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPS6440518A (en) * 1987-08-07 1989-02-10 Nitto Denko Corp Semiconductor device
JPS6465116A (en) * 1987-09-04 1989-03-10 Toray Industries Resin composition for semiconductor sealing
JPH01263131A (ja) * 1988-04-15 1989-10-19 Nippon Steel Chem Co Ltd 封止樹脂充填用シリカ
JPH01294765A (ja) * 1988-05-20 1989-11-28 Nippon Retsuku Kk エポキシ樹脂組成物
JPH02228354A (ja) * 1989-03-01 1990-09-11 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPH08259671A (ja) * 1996-01-29 1996-10-08 Nitto Denko Corp 半導体装置
EP0716118A3 (en) * 1994-08-05 1997-04-09 Sasib Spa Filled epoxy resin mixture and process for casting static machine parts from it

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102361A (en) * 1977-02-18 1978-09-06 Toray Silicone Co Ltd Thermosetting resin composition
JPS5443021A (en) * 1977-09-12 1979-04-05 Minolta Camera Co Ltd F/stop digital value display device of cameras
JPS56122145A (en) * 1980-02-29 1981-09-25 Shin Etsu Chem Co Ltd Resin composition for sealing semiconductor device
JPS57195117A (en) * 1981-05-27 1982-11-30 Sumitomo Bakelite Co Ltd Epoxy resin composition and its preparation
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS59108026A (ja) * 1982-12-10 1984-06-22 Toshiba Chem Corp 封止用エポキシ樹脂組成物
JPS59204633A (ja) * 1983-05-06 1984-11-20 Denki Kagaku Kogyo Kk 低放射能樹脂組成物
JPS6051613A (ja) * 1983-07-26 1985-03-23 チバ−ガイギ−　アクチエンゲゼルシヤフト 球状溶融シリカ並びに充填剤及び樹脂組成物としてのその使用方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102361A (en) * 1977-02-18 1978-09-06 Toray Silicone Co Ltd Thermosetting resin composition
JPS5443021A (en) * 1977-09-12 1979-04-05 Minolta Camera Co Ltd F/stop digital value display device of cameras
JPS56122145A (en) * 1980-02-29 1981-09-25 Shin Etsu Chem Co Ltd Resin composition for sealing semiconductor device
JPS57195117A (en) * 1981-05-27 1982-11-30 Sumitomo Bakelite Co Ltd Epoxy resin composition and its preparation
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS59108026A (ja) * 1982-12-10 1984-06-22 Toshiba Chem Corp 封止用エポキシ樹脂組成物
JPS59204633A (ja) * 1983-05-06 1984-11-20 Denki Kagaku Kogyo Kk 低放射能樹脂組成物
JPS6051613A (ja) * 1983-07-26 1985-03-23 チバ−ガイギ−　アクチエンゲゼルシヤフト 球状溶融シリカ並びに充填剤及び樹脂組成物としてのその使用方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268750A (ja) * 1985-05-22 1986-11-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0329259B2 (pl) * 1985-05-22 1991-04-23 Shinetsu Chem Ind Co
JPS6440518A (en) * 1987-08-07 1989-02-10 Nitto Denko Corp Semiconductor device
JPS6465116A (en) * 1987-09-04 1989-03-10 Toray Industries Resin composition for semiconductor sealing
JPH01263131A (ja) * 1988-04-15 1989-10-19 Nippon Steel Chem Co Ltd 封止樹脂充填用シリカ
JPH01294765A (ja) * 1988-05-20 1989-11-28 Nippon Retsuku Kk エポキシ樹脂組成物
JPH02228354A (ja) * 1989-03-01 1990-09-11 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
EP0716118A3 (en) * 1994-08-05 1997-04-09 Sasib Spa Filled epoxy resin mixture and process for casting static machine parts from it
JPH08259671A (ja) * 1996-01-29 1996-10-08 Nitto Denko Corp 半導体装置

Also Published As

Publication number Publication date
JPS6326128B2 (pl) 1988-05-28

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Legal Events

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