JPS6125270Y2 - - Google Patents

Info

Publication number
JPS6125270Y2
JPS6125270Y2 JP1980072908U JP7290880U JPS6125270Y2 JP S6125270 Y2 JPS6125270 Y2 JP S6125270Y2 JP 1980072908 U JP1980072908 U JP 1980072908U JP 7290880 U JP7290880 U JP 7290880U JP S6125270 Y2 JPS6125270 Y2 JP S6125270Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
metal base
substrate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980072908U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56174872U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980072908U priority Critical patent/JPS6125270Y2/ja
Publication of JPS56174872U publication Critical patent/JPS56174872U/ja
Application granted granted Critical
Publication of JPS6125270Y2 publication Critical patent/JPS6125270Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1980072908U 1980-05-26 1980-05-26 Expired JPS6125270Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980072908U JPS6125270Y2 (enExample) 1980-05-26 1980-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980072908U JPS6125270Y2 (enExample) 1980-05-26 1980-05-26

Publications (2)

Publication Number Publication Date
JPS56174872U JPS56174872U (enExample) 1981-12-23
JPS6125270Y2 true JPS6125270Y2 (enExample) 1986-07-29

Family

ID=29435928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980072908U Expired JPS6125270Y2 (enExample) 1980-05-26 1980-05-26

Country Status (1)

Country Link
JP (1) JPS6125270Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009141318A (ja) * 2007-07-30 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 高められた熱伝導度を有するｌｅｄ光源

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4307094B2 (ja) * 2003-02-04 2009-08-05 パナソニック株式会社 Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
JP4527714B2 (ja) * 2003-02-07 2010-08-18 パナソニック株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP4258338B2 (ja) * 2003-10-09 2009-04-30 日立電線株式会社 発光装置及び発光装置に用いる配線板、ならびに配線板の製造方法
JP2008108861A (ja) * 2006-10-25 2008-05-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ
JP2007123939A (ja) * 2007-01-29 2007-05-17 Kyocera Corp 発光装置
JP2007142477A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2007142476A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009141318A (ja) * 2007-07-30 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 高められた熱伝導度を有するｌｅｄ光源

Also Published As

Publication number Publication date
JPS56174872U (enExample) 1981-12-23

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