JPS6125255Y2 - - Google Patents
Info
- Publication number
- JPS6125255Y2 JPS6125255Y2 JP3082079U JP3082079U JPS6125255Y2 JP S6125255 Y2 JPS6125255 Y2 JP S6125255Y2 JP 3082079 U JP3082079 U JP 3082079U JP 3082079 U JP3082079 U JP 3082079U JP S6125255 Y2 JPS6125255 Y2 JP S6125255Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- resin material
- heat sink
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3082079U JPS6125255Y2 (enrdf_load_html_response) | 1979-03-09 | 1979-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3082079U JPS6125255Y2 (enrdf_load_html_response) | 1979-03-09 | 1979-03-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55132958U JPS55132958U (enrdf_load_html_response) | 1980-09-20 |
| JPS6125255Y2 true JPS6125255Y2 (enrdf_load_html_response) | 1986-07-29 |
Family
ID=28881196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3082079U Expired JPS6125255Y2 (enrdf_load_html_response) | 1979-03-09 | 1979-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6125255Y2 (enrdf_load_html_response) |
-
1979
- 1979-03-09 JP JP3082079U patent/JPS6125255Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55132958U (enrdf_load_html_response) | 1980-09-20 |
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