JPS61252069A - 平面研削盤制御装置 - Google Patents
平面研削盤制御装置Info
- Publication number
- JPS61252069A JPS61252069A JP60093062A JP9306285A JPS61252069A JP S61252069 A JPS61252069 A JP S61252069A JP 60093062 A JP60093062 A JP 60093062A JP 9306285 A JP9306285 A JP 9306285A JP S61252069 A JPS61252069 A JP S61252069A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- station
- workpiece
- machining
- dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004513 sizing Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 abstract description 35
- 238000005259 measurement Methods 0.000 abstract description 15
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60093062A JPS61252069A (ja) | 1985-04-30 | 1985-04-30 | 平面研削盤制御装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60093062A JPS61252069A (ja) | 1985-04-30 | 1985-04-30 | 平面研削盤制御装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61252069A true JPS61252069A (ja) | 1986-11-10 |
JPH0244670B2 JPH0244670B2 (enrdf_load_stackoverflow) | 1990-10-04 |
Family
ID=14072027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60093062A Granted JPS61252069A (ja) | 1985-04-30 | 1985-04-30 | 平面研削盤制御装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61252069A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63174855A (ja) * | 1987-01-16 | 1988-07-19 | Nec Corp | 半導体ウエハ−研削装置 |
JPH05353U (ja) * | 1991-06-25 | 1993-01-08 | 株式会社イナツクス | 板状建材の研磨装置 |
JPH0740239A (ja) * | 1993-08-02 | 1995-02-10 | Sony Corp | 研削研磨装置及び方法 |
JP2000042880A (ja) * | 1998-07-28 | 2000-02-15 | Seiko Seiki Co Ltd | 平面研削装置 |
JP2018083252A (ja) * | 2016-11-24 | 2018-05-31 | 株式会社ディスコ | 研削装置 |
-
1985
- 1985-04-30 JP JP60093062A patent/JPS61252069A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63174855A (ja) * | 1987-01-16 | 1988-07-19 | Nec Corp | 半導体ウエハ−研削装置 |
JPH05353U (ja) * | 1991-06-25 | 1993-01-08 | 株式会社イナツクス | 板状建材の研磨装置 |
JPH0740239A (ja) * | 1993-08-02 | 1995-02-10 | Sony Corp | 研削研磨装置及び方法 |
JP2000042880A (ja) * | 1998-07-28 | 2000-02-15 | Seiko Seiki Co Ltd | 平面研削装置 |
JP2018083252A (ja) * | 2016-11-24 | 2018-05-31 | 株式会社ディスコ | 研削装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0244670B2 (enrdf_load_stackoverflow) | 1990-10-04 |
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