JPS6123861B2 - - Google Patents
Info
- Publication number
- JPS6123861B2 JPS6123861B2 JP21952783A JP21952783A JPS6123861B2 JP S6123861 B2 JPS6123861 B2 JP S6123861B2 JP 21952783 A JP21952783 A JP 21952783A JP 21952783 A JP21952783 A JP 21952783A JP S6123861 B2 JPS6123861 B2 JP S6123861B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- based alloy
- annealing
- producing
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21952783A JPS60114556A (ja) | 1983-11-24 | 1983-11-24 | 銅基合金の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21952783A JPS60114556A (ja) | 1983-11-24 | 1983-11-24 | 銅基合金の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60114556A JPS60114556A (ja) | 1985-06-21 |
| JPS6123861B2 true JPS6123861B2 (enExample) | 1986-06-07 |
Family
ID=16736873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21952783A Granted JPS60114556A (ja) | 1983-11-24 | 1983-11-24 | 銅基合金の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60114556A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159556U (enExample) * | 1987-04-08 | 1988-10-19 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60218440A (ja) * | 1984-04-13 | 1985-11-01 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
| JPS61284946A (ja) * | 1985-06-11 | 1986-12-15 | Mitsubishi Shindo Kk | 半導体装置用Cu合金リ−ド素材 |
| JPS62133034A (ja) * | 1985-12-06 | 1987-06-16 | Yazaki Corp | タ−ミナル用合金 |
| JPH0617522B2 (ja) * | 1987-04-03 | 1994-03-09 | 株式会社神戸製鋼所 | 熱間加工性に優れた電気・電子部品用銅合金 |
| US6632300B2 (en) * | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
-
1983
- 1983-11-24 JP JP21952783A patent/JPS60114556A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159556U (enExample) * | 1987-04-08 | 1988-10-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60114556A (ja) | 1985-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6239213B2 (enExample) | ||
| US3677745A (en) | Copper base composition | |
| JPS61183426A (ja) | 高力高導電性耐熱銅合金 | |
| JP2542370B2 (ja) | 半導体リ−ド用銅合金 | |
| JP3957391B2 (ja) | 剪断加工性に優れる高強度、高導電性銅合金 | |
| JPS6330375B2 (enExample) | ||
| JPS6123861B2 (enExample) | ||
| US5205878A (en) | Copper-based electric and electronic parts having high strength and high electric conductivity | |
| JPS6132386B2 (enExample) | ||
| JP3772319B2 (ja) | リードフレーム用銅合金およびその製造方法 | |
| JPS6250428A (ja) | 電子機器用銅合金 | |
| JPS6250426A (ja) | 電子機器用銅合金 | |
| JPH0717982B2 (ja) | リードフレーム、コネクタもしくはスイッチ用導電圧延材料 | |
| JPS6365748B2 (enExample) | ||
| JPS62267456A (ja) | 高強度、高導電性リ−ドフレ−ム用銅合金の製造方法 | |
| JP2662209B2 (ja) | メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法 | |
| JPH10152736A (ja) | 銅合金材及びその製造方法 | |
| JPS5839901B2 (ja) | リ−ドフレ−ム用の銅合金 | |
| JPS58147140A (ja) | 半導体装置のリ−ド材 | |
| JP2001049366A (ja) | 耐熱性に優れた高強度高導電性銅合金 | |
| JPH0356292B2 (enExample) | ||
| JPH0314897B2 (enExample) | ||
| JP2008214692A (ja) | 半導体収容金属容器用銅合金線材 | |
| JPS64458B2 (enExample) | ||
| JPS6242976B2 (enExample) |