JPS6123861B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention requires comprehensive properties such as softening resistance, electrical and thermal conductivity, solderability, plating performance, and mechanical strength. The present invention relates to a method for producing a copper-based alloy suitable for semiconductor lead frame materials, electrical parts such as connectors and switches, fin materials for heat exchangers, and the like. Generally, alloy 42 (Fe-42% Ni alloy), which has good sealing properties with ceramic packages, has been used as a lead frame material for semiconductor devices. However, in recent years, with the widespread use and cost reduction of resin packages, the adoption of copper alloy lead frame materials has rapidly increased, and CDA194 alloy and phosphor bronze are mainly used. In recent years, as ICs have become more integrated, high-strength, high-softening-resistant copper alloys have become desirable. However, the above-mentioned CDA194 alloy has good conductivity (thermal conductivity can be approximately evaluated by electrical conductivity) and strength, but its softening temperature is somewhat low, and phosphor bronze has excellent strength and repeated bending properties, but has low conductivity. There are advantages and disadvantages. Generally, the characteristics required for lead frame materials include the following. With the increasing integration of semiconductors, lead frames must have excellent electrical and thermal conductivity. Must be able to withstand high temperature heating during die bonding and not easily soften. It has excellent strength so that the lead part can withstand repeated bending and will not twist or bend due to the stress applied to the lead wire when thinning the lead wire. Good solderability. Good oxidation resistance at high temperatures. Do not cause hydrogen embrittlement. On the other hand, even when using copper alloys for electrical parts such as connectors and switches, the conventional properties of excellent conductivity, stress corrosion cracking resistance, and corrosion resistance are not enough, and efforts are being made to reduce costs by making parts thinner. It is desired that these materials have sufficient strength and excellent resistance to softening during brazing. Similarly, for heat exchanger fin materials, Sn-containing copper (Cu-0.2%Sn) has traditionally been mainly used, but as the material becomes thinner, the properties of conventional alloys become unsatisfactory, and the conductivity There is a need for a copper alloy with excellent mechanical strength and softening resistance while ensuring the following properties. Taking the above points into consideration, the present inventors have made the features of the Cu-Fe-Ti ternary alloy, which has excellent strength, conductivity, and softening resistance, easier to obtain industrially by adding additives. It was also discovered that the strength, conductivity, and softening resistance of copper-based alloys were improved by adding specific components to the Cu-Fe-Ti system with the intention of improving the properties. Gansho 58-
Although described in the specification of No. 146635, we have further discovered a processing method to further enhance these properties of the copper-based alloy, and have arrived at the present invention. That is, the method for producing a copper-based alloy of the present invention includes Ti0.05
~1.0wt%; Fe0.07~2.6wt%; 0.005~0.5wt%
Mg, each 0.01-0.5wt% Sb, V, Mitsushi Metal, Zr, In, Zn, Sn and Ni, 0.005-0.2wt%
A copper-based alloy (hereinafter referred to as the copper-based alloy of the present invention) consisting of % Al, and one or more selected from 0.005 to 0.07 wt% P: and the balance substantially Cu is cast, and Hot working and/or heat treatment is performed at ~980°C, the copper-based alloy is held at 650 ~ 840°C for 30 seconds or more during or after the hot working and/or heat treatment, and then a working rate of 30% or more is applied. Cold working and annealing are performed one or more times as one cycle,
The annealing is performed at least once at 350 to 550° C. for 30 minutes or more. The method of the present invention is carried out through the steps shown in the flow sheet below, for example.

[Table] ↓

Claims (1)

[Claims] 1 Ti0.05-1.0wt%; Fe0.07-2.6wt%; 0.005
~0.5wt% Mg, each 0.01~0.5wt%
Sb, V, Mitsushi Metal, Zr, In, Zn, Sn and
Ni, 0.005~0.2wt% Al, and 0.005~0.07wt
% of one or more selected from P: and the remainder substantially Cu;
Hot working and/or heat treatment is performed at 980°C, the copper-based alloy is held at 840 to 650°C for 30 seconds or more during or after the hot working and/or heat treatment, and then cooled at a processing rate of 30% or more. 1. A method for producing a copper-based alloy, characterized in that one cycle of machining and annealing is performed one or more times, and at least one of the annealing is performed at 350 to 550° C. for 30 minutes or more. 2. The method for producing a copper-based alloy according to claim 1, wherein cold working is performed by less than 40% after final annealing. 3. The method for producing a copper-based alloy according to claim 1, wherein at least one annealing other than the annealing at 350 to 550°C is continuous annealing at 550 to 850°C for 5 seconds or more. 4 Copper-based alloy contains Ti0.2-0.4wt%, Fe0.3-0.7wt%
%, Mg 0.05 to 0.10 wt %, and the remainder substantially Cu.