JPS6123666A - 耐めつきソルダレジストインク組成物 - Google Patents
耐めつきソルダレジストインク組成物Info
- Publication number
- JPS6123666A JPS6123666A JP14424084A JP14424084A JPS6123666A JP S6123666 A JPS6123666 A JP S6123666A JP 14424084 A JP14424084 A JP 14424084A JP 14424084 A JP14424084 A JP 14424084A JP S6123666 A JPS6123666 A JP S6123666A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- weight
- parts
- solder resist
- resist ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 35
- 229910000679 solder Inorganic materials 0.000 title claims description 32
- 238000007747 plating Methods 0.000 title claims description 26
- 239000000843 powder Substances 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 13
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 4
- 239000001257 hydrogen Substances 0.000 claims abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 3
- -1 Epoxide compound Chemical class 0.000 claims description 35
- 150000001875 compounds Chemical class 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 230000009974 thixotropic effect Effects 0.000 claims description 9
- 239000003086 colorant Substances 0.000 claims description 6
- 150000002989 phenols Chemical class 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 5
- 229940079877 pyrogallol Drugs 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000013008 thixotropic agent Substances 0.000 abstract description 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 abstract 1
- 150000002460 imidazoles Chemical class 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 28
- 239000004020 conductor Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000002087 whitening effect Effects 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 1
- 244000241257 Cucumis melo Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 241001504592 Trachurus trachurus Species 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WEWFIUPOLKEEJP-UHFFFAOYSA-N triazine-4,6-diamine Chemical compound NC1=CC(N)=NN=N1 WEWFIUPOLKEEJP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14424084A JPS6123666A (ja) | 1984-07-13 | 1984-07-13 | 耐めつきソルダレジストインク組成物 |
| US06/659,565 US4555532A (en) | 1983-10-14 | 1984-10-10 | Epoxy resin composition |
| KR1019840006249A KR860001555B1 (ko) | 1983-10-14 | 1984-10-10 | 에폭시 수지 조성물 |
| EP84112269A EP0138209B1 (fr) | 1983-10-14 | 1984-10-12 | Composition de résine époxyde |
| DE8484112269T DE3481064D1 (de) | 1983-10-14 | 1984-10-12 | Epoxydharzzusammensetzung. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14424084A JPS6123666A (ja) | 1984-07-13 | 1984-07-13 | 耐めつきソルダレジストインク組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6123666A true JPS6123666A (ja) | 1986-02-01 |
| JPH0437867B2 JPH0437867B2 (fr) | 1992-06-22 |
Family
ID=15357501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14424084A Granted JPS6123666A (ja) | 1983-10-14 | 1984-07-13 | 耐めつきソルダレジストインク組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6123666A (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6429416A (en) * | 1987-07-24 | 1989-01-31 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPH01304151A (ja) * | 1988-05-31 | 1989-12-07 | Somar Corp | 一液性エポキシ樹脂組成物 |
| JPH03160071A (ja) * | 1989-11-18 | 1991-07-10 | Somar Corp | 光硬化性無電解メッキレジストインキ組成物 |
| JP2001048706A (ja) * | 1999-06-02 | 2001-02-20 | Earth Chem Corp Ltd | 害虫防除製剤 |
| JP2002129079A (ja) * | 2000-07-14 | 2002-05-09 | Dainippon Ink & Chem Inc | 紫外線硬化型レジスト用グラビアインキ組成物 |
| JP2007321028A (ja) * | 2006-05-31 | 2007-12-13 | Showa Denko Kk | レジストインキ組成物及び該レジストインキ組成物を用いたエッチング方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5114044A (ja) * | 1974-07-25 | 1976-02-04 | Matsushita Electric Ind Co Ltd | Ichikenshutsusochi |
| JPS5412841A (en) * | 1977-06-30 | 1979-01-30 | Canon Inc | Static charge developing toner |
| JPS5639314A (en) * | 1979-09-03 | 1981-04-15 | Topura Kk | Self screw thread forming type fixing screw |
| JPS56157471A (en) * | 1980-05-09 | 1981-12-04 | Hitachi Ltd | Resist ink composition for chemical plating |
| JPS5749588A (en) * | 1980-09-11 | 1982-03-23 | Tokyo Electric Co Ltd | Printer |
| JPS5790072A (en) * | 1980-11-25 | 1982-06-04 | Hitachi Ltd | Resist ink composition for chemical plating |
| JPS6082673A (ja) * | 1983-10-14 | 1985-05-10 | Hitachi Ltd | 耐めつき性ソルダレジストインク組成物 |
-
1984
- 1984-07-13 JP JP14424084A patent/JPS6123666A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5114044A (ja) * | 1974-07-25 | 1976-02-04 | Matsushita Electric Ind Co Ltd | Ichikenshutsusochi |
| JPS5412841A (en) * | 1977-06-30 | 1979-01-30 | Canon Inc | Static charge developing toner |
| JPS5639314A (en) * | 1979-09-03 | 1981-04-15 | Topura Kk | Self screw thread forming type fixing screw |
| JPS56157471A (en) * | 1980-05-09 | 1981-12-04 | Hitachi Ltd | Resist ink composition for chemical plating |
| JPS5749588A (en) * | 1980-09-11 | 1982-03-23 | Tokyo Electric Co Ltd | Printer |
| JPS5790072A (en) * | 1980-11-25 | 1982-06-04 | Hitachi Ltd | Resist ink composition for chemical plating |
| JPS6082673A (ja) * | 1983-10-14 | 1985-05-10 | Hitachi Ltd | 耐めつき性ソルダレジストインク組成物 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6429416A (en) * | 1987-07-24 | 1989-01-31 | Matsushita Electric Works Ltd | Epoxy resin composition |
| JPH01304151A (ja) * | 1988-05-31 | 1989-12-07 | Somar Corp | 一液性エポキシ樹脂組成物 |
| JPH03160071A (ja) * | 1989-11-18 | 1991-07-10 | Somar Corp | 光硬化性無電解メッキレジストインキ組成物 |
| JP2001048706A (ja) * | 1999-06-02 | 2001-02-20 | Earth Chem Corp Ltd | 害虫防除製剤 |
| JP2002129079A (ja) * | 2000-07-14 | 2002-05-09 | Dainippon Ink & Chem Inc | 紫外線硬化型レジスト用グラビアインキ組成物 |
| JP2007321028A (ja) * | 2006-05-31 | 2007-12-13 | Showa Denko Kk | レジストインキ組成物及び該レジストインキ組成物を用いたエッチング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0437867B2 (fr) | 1992-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |